JPH03268475A - Printed wiring board lead frame and printed wiring board mounting method - Google Patents

Printed wiring board lead frame and printed wiring board mounting method

Info

Publication number
JPH03268475A
JPH03268475A JP6900390A JP6900390A JPH03268475A JP H03268475 A JPH03268475 A JP H03268475A JP 6900390 A JP6900390 A JP 6900390A JP 6900390 A JP6900390 A JP 6900390A JP H03268475 A JPH03268475 A JP H03268475A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
band
cut
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6900390A
Other languages
Japanese (ja)
Inventor
Kazuya Okuhata
奥畑 一也
Matsuhiko Takatani
高谷 松彦
Naoki Hosoda
直樹 細田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Facom Corp
Original Assignee
Fuji Facom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Facom Corp filed Critical Fuji Facom Corp
Priority to JP6900390A priority Critical patent/JPH03268475A/en
Publication of JPH03268475A publication Critical patent/JPH03268475A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve an assembly accuracy and workability to insert a lead pin to a printed wiring board by providing a second cut bending section, which is cut and bent in a slanting manner to the surface of a second band body and a band-shaped end whose width is narrower than the width of the second band body. CONSTITUTION:Printed wiring boards 9 and 10 are successively fitted into respective second band bodies A, B, and C by way of through holes 9a and 10a, corresponding to respective second band bodies A, B, and C. They are positioned and maintained hierarchically at each first cut bending section 5 belonging thereto and at a position opposite to a second cut bending end 6 whose width is narrower than the width of the second band body A, B, and C. Each cut bending section 2 is accordingly deformed as the printed wiring boards 9 and 10 are inserted, which does not prevent their insertion. They are returned to their original positions when the printed wiring boards are located at an opposite position having a span equivalent to the thickness. This construction makes it possible to keep each mutual span between the printed wiring board and the right angle between the printed wiring boards and lead pins accurately, thereby improving the assembly accuracy.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

この発明は、実装密度向上のためプリント配線板を階層
状に構成するときに用いられるリードフレーム、および
プリント配線板実装方法に関する。
The present invention relates to a lead frame used when configuring printed wiring boards in a hierarchical manner to improve packaging density, and a printed wiring board mounting method.

【従来の技術】[Conventional technology]

現在、プリント配線板の高密度実装のために、以下に述
べるような各種の方式がとられている。 たとえば、実装部品に係る方式として、片面1両面の各
表面実装や、AS I C化(特定用途向けLSI化)
がある。また、プリント配線板に係る方式として、多層
プリント配線板や、多階層形プリント配線板がある。 多階層形プリント配線板には、たとえば上、下2段の各
プリント配線板を、機械的、電気的に連結するのに、一
つにはコネクタを用いる方式がある。もう一つの方式と
して、上、下2段の各プリント配線板をその縁部におい
て挟み込む形で保持するとともに、電気的な導通を図る
リードフレーム、つまりクリップ形リードフレームを用
いる方式がある。
Currently, various methods as described below are being used for high-density mounting of printed wiring boards. For example, methods for mounting components include single-sided, single-sided surface mounting, and ASIC (LSI for specific applications).
There is. Further, as methods related to printed wiring boards, there are multilayer printed wiring boards and multilayer printed wiring boards. One method of multi-layered printed wiring boards is to use connectors to mechanically and electrically connect the upper and lower printed wiring boards, for example. Another method is to use a lead frame, that is, a clip-type lead frame, which holds the upper and lower printed wiring boards by sandwiching them at their edges and provides electrical continuity.

【発明が解決しようとする課B】 多階層形プリント配線板を構成するためにコネクタを用
いる方式は、コネクタと、各プリント配線板のスルーホ
ールでの接合にはんだ付は作業が必要になり、この作業
は非常に狭いスペースではとくに困難で、熟練を要する
とともに、信軌性が低い。また、コネクタとプリント配
線板との直角度を正確に出すのが非常に難しいという問
題がある。なお、このコネクタとプリント配線板との直
角度は、2階層構造の成否を決める非常に重要な因子で
ある。 多階層形プリント配線板を構成するためにクリップ形リ
ードフレームを用いる方式は、電気的導通箇所がプリン
ト配線板の縁部に限定されるので、回路設計が制約を受
け、比較的小形のプリント配線板だけに適用される傾向
にある。小形のプリント配線板は当然、その基板を大形
のプリント配線基板にまとめて製作し、全体を検査した
のちに分割してから、実装しなければならない。 この発明の課題は、従来の技術がもつ以上の問題点を解
消し、リードピンのプリント配線板への挿着に関して組
立精度と作業性の向上が図れる階層形プリント配線板用
リードフレーム、およびプリント配線板実装方法を提供
することにある。
[Problem B to be Solved by the Invention] In the method of using connectors to construct a multilayer printed wiring board, soldering work is required to connect the connector and each printed wiring board through the through holes. This work is particularly difficult in very confined spaces, requires skill, and has low reliability. Another problem is that it is very difficult to accurately obtain the perpendicularity between the connector and the printed wiring board. Note that the perpendicularity between the connector and the printed wiring board is a very important factor that determines the success or failure of the two-layer structure. In the method of using a clip-type lead frame to construct a multilayer printed wiring board, the electrical conduction points are limited to the edges of the printed wiring board, which limits circuit design and requires relatively small printed wiring. It tends to apply only to boards. Naturally, a small printed wiring board must be manufactured by combining the boards into a large printed wiring board, inspecting the whole board, dividing it, and then mounting it. The object of the present invention is to provide a lead frame for a hierarchical printed wiring board, which solves the problems of the conventional technology, and improves assembly accuracy and workability in inserting lead pins into the printed wiring board, and a printed wiring board. The object of the present invention is to provide a board mounting method.

【課題を解決するための手段】[Means to solve the problem]

この課題を解決するために、本発明に係る階層形プリン
ト配線板用リードフレームは、第1の帯体と、これの長
手方向の各箇所からこれと直角に一方向に伸びる複数の
第2の帯体とが、金属板から一体的に形成され、この第
2帯体は、その根元から近い順に切欠き部と; 前記第2帯体の面に直角に切り曲げられた第1の切曲部
と、この第1切曲部と一定距離を隔てて対向する端部を
もち前記第2帯体面に対して傾斜する形に切り曲げられ
た第2の切曲部と;階段状段差部を境界に前記第2帯体
の幅より狭い幅をもつ帯状の先端部と;を備える。 また、本発明に係るプリント板実装方法は、第1の帯体
と、これの長手方向の各箇所からこれと直角に一方向に
伸びる複数1第2の帯体とが金属板から一体的に形成さ
れ、この第2帯体は、その根元から近い順に切欠き部と
;前記第2帯体の面に直角に切り曲げられた第1の切曲
部と、この第1切曲部と一定距離を隔てて対向する端部
をもち前記第2帯体面に対して傾斜する形に切り曲げら
れた第2の切曲部と;階段状段差部を境界に前記第2帯
体の幅より狭い幅をもつ帯状の先端部と;を備えたリー
ドフレームを用いて、 第1のプリント配線板が、前記各第2帯体に対応するス
ルーホールを通して順次その各第2帯体に嵌挿されてこ
れに属する前記各対向箇所で階層状に位置決め保持され
、 次に第2のプリント配線板が、前記各先端部に対応する
スルーホールを通してその各先端部に嵌挿されてこれに
属する前記段差部で位置決め保持され、 終わりに前記各第2帯体が、その切欠き部で前記第1帯
体と切断2分離されて、前記第1のプリント配線板が前
記第2のプリント配線板に実装前記各ブリされた状態に
なる。
In order to solve this problem, the lead frame for a hierarchical printed wiring board according to the present invention includes a first strip and a plurality of second strips extending in one direction at right angles to the first strip from each location in the longitudinal direction of the first strip. A band body is integrally formed from a metal plate, and this second band body includes, in order from the root thereof, a notch portion; and a first cut portion cut and bent at right angles to the surface of the second band body. a second bent part which has an end facing the first bent part at a certain distance and is cut and bent in a shape that is inclined with respect to the second band surface; a stepped part; and a band-shaped tip portion having a width narrower than the width of the second band member at the boundary. Further, in the printed board mounting method according to the present invention, a first strip and a plurality of second strips extending in one direction at right angles from each location in the longitudinal direction of the first strip are integrated from a metal plate. The second band includes, in order from the root thereof, a notch portion; a first cut portion cut and bent at right angles to the surface of the second band; and a portion that is constant with the first cut portion. a second bent portion having opposite end portions separated by a distance and cut and bent in a shape that is inclined with respect to the second band surface; narrower than the width of the second band with the step-like stepped portion as the boundary; A first printed wiring board is sequentially inserted into each of the second strips through through holes corresponding to each of the second strips using a lead frame having a wide strip-shaped tip; The second printed wiring board is positioned and held in a hierarchical manner at each of the opposing points belonging to the above, and then a second printed wiring board is fitted into each of the tips through the through holes corresponding to the respective tips of the stepped portions belonging to this. Finally, each of the second strips is cut and separated from the first strip at its notch, and the first printed wiring board is mounted on the second printed wiring board. Each item will be in a broken state.

【作用】[Effect]

プリント配線板が、各第2帯体に対応するスル−ホール
を通して順次、その各第2帯体に嵌挿され、これに属す
る各第1切曲部と第2切曲部端部との対向箇所で階層状
に位置決め保持される。なお各第2切曲部は、プリント
配線板の嵌挿とともに変形してその嵌挿を妨げず、プリ
ント配線板がその厚さ分の間隔をもつ対向箇所に位置し
たとき復帰して、第1切曲部とともにプリント配線板を
位置決め保持するわけである。 次に別のプリント配線板が、各第2帯体の先端部に対応
するスルーホールを通してその各先端部に嵌挿され、こ
れに属する段差部で位置決め保持される。以上で第2帯
体へのプリント配線板の階層状嵌挿が完了する。 終わりに各第2帯体は、その切欠き部で第1帯体と切断
9分離されることによって、階層状プリント配線板に挿
着された状態のリードビンとなる。
The printed wiring board is sequentially fitted into each of the second strips through through-holes corresponding to the second strips, and the ends of the first and second bent portions thereof are opposed to each other. It is positioned and held in a hierarchical manner at certain points. Note that each of the second bent portions deforms as the printed wiring board is inserted and does not interfere with the insertion, and returns to its original position when the printed wiring board is located at an opposing position with an interval equal to the thickness of the printed wiring board. Together with the cut portion, the printed wiring board is positioned and held. Next, another printed wiring board is inserted into each of the ends of each second band through the through holes corresponding to the ends thereof, and is positioned and held by the corresponding step portion. This completes the hierarchical insertion of the printed wiring board into the second band. Finally, each of the second strips is separated from the first strip by cutting at its notch, thereby forming a lead bin inserted into the hierarchical printed wiring board.

【実施例】【Example】

本発明に係るプリント配線板用リードフレームの実施例
について、以下に図面を参照しながら説明する。 第1図は第1の発明に係る実施例の平面図である。第1
図において、リードフレーム1は、発明における第1帯
体としてのフレーム2と、同じく第2帯体としてのリー
ドビン3とが一体として金属板から打ち抜かれた部材で
ある。フレーム2には定ピツチの送り用穴2aがあけら
れ、この穴2aを利用してリードフレーム1は、製作、
保管。 使用−される。 リードビン3は、フレーム2の定ピツチ箇所からこれに
直角に伸びる部分である。リードビン3には、そのフレ
ーム2との根元から近い順に、両面に付けられたV形の
切欠き部4と、両側の各切曲部5と、中央の切曲部6と
、段差部7と、この段差部7を境界として幅が狭くなる
先端部8とがある。第1図におけるAは、打ち抜かれ、
切曲部5と、切曲部6とに対応する切りが入れられた状
態のリードビンを示す。同じ<B、Cは、切曲部5と切
曲部6とが、それぞれ直角に、または傾斜して手前側、
向う側にそれぞれ折り曲げられた状態のリードビンを示
す。したがって、リードフレーム1としては、B、Cの
各状態のリードビンが連続して並設されることになる。 なお、各切曲部5.6の曲げ方向を互い違いにしたのは
、後工程でのプリント配線板の保持のときに、力のバラ
ンスをとるためである。 次に、本発明に係るプリント配線板の実装方法について
説明する。 第2図はり−ドピン挿着状態での2階層形プリント配線
板の一側断面図、第3図は第2図を右側から見た別の側
断面図である。 第2図において、プリント配線板9は、リードビン3の
先端部8の側からスルーホール9aを通して上方向に挿
入され、切曲部6を押して変形させながら上昇し、切曲
部5の直角の折曲面と、弾性によって原状復帰する切曲
部6の先端部とで挟まれる形で位置決め保持される。プ
リント配線板9とリードビン3とは直角度が出ている。 次に、別のプリント配線板10が、スルーホール10a
を通してリードビン3の先端部8に嵌挿され、段差部7
で位置決めされる。プリント配線板工0とリードビン3
とは直角度が出ている。 この場合、各プリント配線板9.10によって2階層構
造となる。図示は省略するが、各切曲部5゜6の組をリ
ードビンの方向に直列に複数個設けることによって、プ
リント配線板の3階層以上の構造にすることができる。 終わりに第2図、第3図において、二点鎖線表示のフレ
ーム2を、切欠き部4で各リードビン3と切断2分離し
て、各リードビン3が挿着された状態の2階層形プリン
ト配線板が完成する。なお、前記したような各リードフ
レーム3のプリント配線板への挿着、切断は、全て自動
挿着機によっておこなわれる。
Examples of the lead frame for printed wiring boards according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an embodiment according to the first invention. 1st
In the figure, a lead frame 1 is a member in which a frame 2 as a first band and a lead bin 3 as a second band are integrally punched out of a metal plate. Feed holes 2a of a fixed pitch are drilled in the frame 2, and the lead frame 1 is manufactured using these holes 2a.
storage. used - to be used. The lead bin 3 is a portion extending from a fixed pitch point of the frame 2 at right angles thereto. The lead bin 3 has a V-shaped notch 4 on both sides, a bent part 5 on both sides, a bent part 6 in the center, and a stepped part 7 in order from the base of the lead bin 3 to the frame 2. , and a tip portion 8 whose width becomes narrower with this stepped portion 7 as a boundary. A in FIG. 1 is punched out,
The lead bin is shown with cuts corresponding to the cut portions 5 and 6. Same <B, C, the cut portion 5 and the cut portion 6 are at right angles or inclined to the front side,
The lead bins are shown in their respective folded positions on the opposite side. Therefore, in the lead frame 1, lead bins in states B and C are successively arranged side by side. The reason why the bending directions of each of the cut portions 5.6 are alternated is to balance the force when holding the printed wiring board in a subsequent process. Next, a method for mounting a printed wiring board according to the present invention will be described. FIG. 2 is a side sectional view of the two-layer printed wiring board in a state where the beams and pins are inserted, and FIG. 3 is another side sectional view of FIG. 2 viewed from the right side. In FIG. 2, the printed wiring board 9 is inserted upward from the tip end 8 side of the lead bin 3 through the through hole 9a, and moves up while pushing and deforming the bent part 6, and bends the bent part 5 at a right angle. It is held in position by being sandwiched between the curved surface and the tip of the bent portion 6 which returns to its original state due to elasticity. The printed wiring board 9 and the lead bin 3 form a right angle. Next, another printed wiring board 10 has through holes 10a.
It is inserted into the tip part 8 of the lead bin 3 through the step part 7.
is positioned. Printed wiring board worker 0 and lead bin 3
There is a right angle. In this case, each printed wiring board 9.10 forms a two-layer structure. Although not shown in the drawings, by providing a plurality of sets of each of the bent portions 5.degree.6 in series in the direction of the lead bin, a structure of three or more layers of the printed wiring board can be obtained. Finally, in FIGS. 2 and 3, the frame 2 indicated by the two-dot chain line is cut and separated from each lead bin 3 at the notch 4, and each lead bin 3 is inserted into the two-layer printed wiring. The board is completed. Incidentally, the above-mentioned insertion and cutting of each lead frame 3 onto the printed wiring board are all performed by an automatic insertion machine.

【発明の効果】【Effect of the invention】

この発明によれば、従来の技術に比べ次のようなすぐれ
た効果がある。 (1)プリント配線板相互の間隔は、第2帯体の各第1
切曲部の位置1段差部の位置によって決まるから、正確
である。また、プリント配線板とリードビンとの直角度
は、第2帯体の各第1切曲部。 段差部の直角度によって決まるから、正確である。 このように組立精度の向上が図れる。 (2)複数個の第2帯体が共通な第1帯体によってまと
められた形をとるから、各第2帯体のプリント配線板へ
の挿着は一括挿着であり、その後に第1帯体が切断9分
離される。したがって、組立作業は自動化されやすく、
非常に容易、かつ短時間ですむ。 (3)プリント配線板への挿着前には、リードビンにな
るべき第2帯体が共通な第1帯体によってまとめられた
形をとるから、リードピン自体の精度。 加工効率が良く、しかもリールに巻き取られる形で収容
されるから、取扱い上、保管上、非常に便利である。 (4)  リードビンのプリント配線板への挿着箇所は
スルーホールであるから、回路構成に制約がなく一般的
なプリント配線板に広く適用できる。
According to this invention, there are the following superior effects compared to the conventional technology. (1) The distance between the printed wiring boards is
The position of the bent part is accurate because it is determined by the position of the one step part. Further, the perpendicularity between the printed wiring board and the lead bin is determined by each first cut portion of the second band. It is accurate because it is determined by the squareness of the step. In this way, assembly precision can be improved. (2) Since a plurality of second strips are grouped together by a common first strip, each second strip is inserted into the printed wiring board at once, and then the first The strip is cut into 9 parts. Therefore, assembly work is easy to automate;
It's very easy and takes a short time. (3) The accuracy of the lead pin itself is high because the second band, which is to become a lead bin, is held together by a common first band before being inserted into the printed wiring board. It has good processing efficiency and is stored in the form of being wound onto a reel, so it is very convenient in terms of handling and storage. (4) Since the lead bin is inserted into the printed wiring board through a through hole, there are no restrictions on the circuit configuration and it can be widely applied to general printed wiring boards.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る実施例の平面図、第2図はリード
ビン挿着状態での2階層形プリント配線板の一側断面図
、 第3図は同じくその別の側断面図である。 符号説明 1:リードフレーム、2:フレーム、 2a :送り用穴、3:リードビン、4:切欠き部、5
.6:切曲部、7:段差部、8:先端部、9.10ニブ
リント配線板、 9a、10a  ニスルーホール。 第2図 第3図 第1圀
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a side sectional view of the two-layer printed wiring board with the lead bin inserted, and FIG. 3 is another side sectional view thereof. Code explanation 1: Lead frame, 2: Frame, 2a: Feed hole, 3: Lead bin, 4: Notch, 5
.. 6: Bent part, 7: Step part, 8: Tip part, 9.10 Niblint wiring board, 9a, 10a Varnish through hole. Figure 2 Figure 3 Figure 1

Claims (1)

【特許請求の範囲】 1)第1の帯体と、これの長手方向の各箇所からこれと
直角に一方向に伸びる複数の第2の帯体とが、金属板か
ら一体的に形成され、この第2帯体は、その根元から近
い順に切欠き部と;前記第2帯体の面に直角に切り曲げ
られた第1の切曲部と、この第1切曲部と一定距離を隔
てて対向する端部をもち前記第2帯体面に対して傾斜す
る形に切り曲げられた第2の切曲部と;階段状段差部を
境界に前記第2帯体の幅より狭い幅をもつ帯状の先端部
と;を備えることを特徴とするプリント配線板用リード
フレーム。 2)第1の帯体と、これの長手方向の各箇所からこれと
直角に一方向に伸びる複数の第2の帯体とが、金属板か
ら一体的に形成され、この第2帯体は、その根元から近
い順に切欠き部と;前記第2帯体の面に直角に切り曲げ
られた第1の切曲部と、この第1切曲部と一定距離を隔
てて対向する端部をもち前記第2帯体面に対して傾斜す
る形に切り曲げられた第2の切曲部と;階段状段差部を
境界に前記第2帯体の幅より狭い幅をもつ帯状の先端部
と;を備えたリードフレームを用いて、第1のプリント
配線板が、前記各第2帯体に対応するスルーホールを通
して順次その各第2帯体に嵌挿されてこれに属する前記
各対向箇所で階層状に位置決め保持され、次に第2のプ
リント配線板が、前記各先端部に対応するスルーホール
を通してその各先端部に嵌挿されてこれに属する前記段
差部で位置決め保持され、終わりに前記各第2帯体が、
その切欠き部で前記第1帯体と切断,分離されて、前記
第1のプリント配線板が前記第2のプリント配線板に実
装された状態になることを特徴とするプリント配線板実
装方法。
[Claims] 1) A first strip and a plurality of second strips extending in one direction at right angles from each location in the longitudinal direction of the first strip are integrally formed from a metal plate, This second band includes, in order from the root thereof, a notch; a first cut portion cut and bent at right angles to the surface of the second band; a second bent part having opposite ends and cut and bent in a shape inclined with respect to the second band surface; having a width narrower than the width of the second band with the step-like stepped part as a boundary; A lead frame for a printed wiring board, characterized by having a band-shaped tip; and; 2) A first strip and a plurality of second strips extending in one direction at right angles from each location in the longitudinal direction of the first strip are integrally formed from a metal plate, and the second strips are , in order from the root to the notch part; a first cut part cut and bent at right angles to the surface of the second band; and an end part facing the first cut part at a certain distance. a second bent portion that is cut and bent in a shape that is inclined with respect to the second band surface; a band-shaped tip portion that has a width narrower than the width of the second band with the step-like stepped portion as a boundary; A first printed wiring board is sequentially inserted into each of the second strips through through-holes corresponding to the second strips, using a lead frame having Next, a second printed wiring board is inserted into each of the tips through through holes corresponding to the tips and is positioned and held at the stepped portions belonging thereto. The second band body is
A printed wiring board mounting method characterized in that the first printed wiring board is cut and separated from the first band at the notch portion, and the first printed wiring board is mounted on the second printed wiring board.
JP6900390A 1990-03-19 1990-03-19 Printed wiring board lead frame and printed wiring board mounting method Pending JPH03268475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6900390A JPH03268475A (en) 1990-03-19 1990-03-19 Printed wiring board lead frame and printed wiring board mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6900390A JPH03268475A (en) 1990-03-19 1990-03-19 Printed wiring board lead frame and printed wiring board mounting method

Publications (1)

Publication Number Publication Date
JPH03268475A true JPH03268475A (en) 1991-11-29

Family

ID=13389986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6900390A Pending JPH03268475A (en) 1990-03-19 1990-03-19 Printed wiring board lead frame and printed wiring board mounting method

Country Status (1)

Country Link
JP (1) JPH03268475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009078059A1 (en) * 2007-12-14 2009-06-25 Fujitsu Limited Printed board structure and connection electrode used for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009078059A1 (en) * 2007-12-14 2009-06-25 Fujitsu Limited Printed board structure and connection electrode used for the same

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