JPH032675U - - Google Patents
Info
- Publication number
- JPH032675U JPH032675U JP6304189U JP6304189U JPH032675U JP H032675 U JPH032675 U JP H032675U JP 6304189 U JP6304189 U JP 6304189U JP 6304189 U JP6304189 U JP 6304189U JP H032675 U JPH032675 U JP H032675U
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- printed wiring
- multilayer printed
- wiring board
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Description
第１図及び第２図は本考案の実施例の斜視図及
び断面図、第３図は本考案の実施例に連結部品を
接続した状態の断面図を示す。 １……基板、２……空洞部、３……接続部、７
……連結部品。
び断面図、第３図は本考案の実施例に連結部品を
接続した状態の断面図を示す。 １……基板、２……空洞部、３……接続部、７
……連結部品。
Claims (1)
- 多層プリント配線板において、基板端面の内層
に形成した空洞部と、この空洞部に形成され内層
の回路に接続された、連結部品用の接続部とを設
けることを特徴とする多層プリント配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6304189U JPH032675U (ja) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6304189U JPH032675U (ja) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032675U true JPH032675U (ja) | 1991-01-11 |
Family
ID=31592741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6304189U Pending JPH032675U (ja) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032675U (ja) |
-
1989
- 1989-05-31 JP JP6304189U patent/JPH032675U/ja active Pending