JPH032667U - - Google Patents
Info
- Publication number
- JPH032667U JPH032667U JP6304089U JP6304089U JPH032667U JP H032667 U JPH032667 U JP H032667U JP 6304089 U JP6304089 U JP 6304089U JP 6304089 U JP6304089 U JP 6304089U JP H032667 U JPH032667 U JP H032667U
- Authority
- JP
- Japan
- Prior art keywords
- board
- grooves
- chip ceramic
- area
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6304089U JPH032667U (fr) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6304089U JPH032667U (fr) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032667U true JPH032667U (fr) | 1991-01-11 |
Family
ID=31592739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6304089U Pending JPH032667U (fr) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032667U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150154U (fr) * | 1976-05-10 | 1977-11-14 | ||
| JP2013125855A (ja) * | 2011-12-14 | 2013-06-24 | Seiko Epson Corp | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
-
1989
- 1989-05-31 JP JP6304089U patent/JPH032667U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150154U (fr) * | 1976-05-10 | 1977-11-14 | ||
| JP2013125855A (ja) * | 2011-12-14 | 2013-06-24 | Seiko Epson Corp | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |