JPH03263895A - Bonding method of electronic parts - Google Patents
Bonding method of electronic partsInfo
- Publication number
- JPH03263895A JPH03263895A JP6321690A JP6321690A JPH03263895A JP H03263895 A JPH03263895 A JP H03263895A JP 6321690 A JP6321690 A JP 6321690A JP 6321690 A JP6321690 A JP 6321690A JP H03263895 A JPH03263895 A JP H03263895A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- solder part
- electrode
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 65
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品のボンディング方法に関し、詳しくは
、半田のフラックスを不要にして、電子部品を基板にボ
ンディングするための方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for bonding electronic components, and more particularly to a method for bonding electronic components to a substrate without the need for solder flux.
（従来の技術）
電子部品の電極部を基板にボンディングする半田には、
ヌレ性を改善するために、フラックスが混入されるなど
して使用されている。更に詳しく述べると、電子部品の
電極部、銅箔のような回路パターン、及びフラックスが
使用されない半田等の金属表面には、酸化被膜（サビ）
が生じやすいものであるが、酸化被膜は、半田をはじく
性質があることから、ヌレ性が低下し、電極部と回路パ
ターンの電気接続性が低下する。(Conventional technology) Solder for bonding the electrodes of electronic components to the board includes
Flux is mixed in to improve wettability. To explain in more detail, there is an oxide film (rust) on the electrode parts of electronic components, circuit patterns such as copper foil, and metal surfaces such as solder where flux is not used.
However, since the oxide film has the property of repelling solder, the wettability is reduced and the electrical connectivity between the electrode portion and the circuit pattern is reduced.
したがって従来、この種半田には、酸化被膜を除去して
、ヌレ性を改善する性質を有するフラックスが使用され
ている。Therefore, conventionally, this type of solder uses a flux that removes the oxide film and improves wettability.
（発明が解決しようとする課題）
しかしながらフラックスが使用された半田により、電子
部品を基板にボンディングした場合、半田表面にフラッ
クスの被膜が生じ、このフラックスの被膜は活性剤を含
むことから、電極部を腐食させやすく、またボンディン
グ後に、プローブを接触させて行われる製品検査の際に
、この被膜が電気接触性の障害物となり、更には、カメ
ラ等の光学手段により、半田の外観検査を行う場合にも
、この被膜が観察の障害物になりやすい問題があった。(Problem to be Solved by the Invention) However, when an electronic component is bonded to a board using solder that uses flux, a film of flux is formed on the solder surface, and this flux film contains an activator, so it is difficult to bond the electrode part. This film easily corrodes the solder, and this film becomes an obstacle to electrical contact when inspecting the product by touching it with a probe after bonding.Furthermore, when inspecting the appearance of the solder using optical means such as a camera. However, there was a problem in that this film easily became an obstacle to observation.
このため従来、ボンディング後に、洗浄液により、半田
表面のフラックスを洗浄除去することが行われている。For this reason, conventionally, after bonding, the flux on the solder surface is cleaned and removed using a cleaning liquid.
しかしながら洗浄液は、フロン系や塩素系の有害物を含
有しているため、これを使用して洗浄すると、環境上の
問題を生じる問題があった。However, since the cleaning liquid contains harmful substances such as fluorocarbons and chlorine, cleaning using this liquid causes environmental problems.
以上のように従来は、半田のヌレ性を改善するために、
半田にフラックスを使用していたため、様々な問題が生
じていた。したがって本発明は、フラックスを不要にで
きる電子部品のボンディング方法を提供することを目的
とする。As mentioned above, conventionally, in order to improve solder wettability,
Various problems arose due to the use of flux in the solder. Therefore, an object of the present invention is to provide a method for bonding electronic components that eliminates the need for flux.
（課題を解決するための手段）
本発明は、基板の回路パターンに半田部を形成するとと
もに、この基板の電子部品の本体に対応する位置に接着
手段を形成したうえで、電子部品をその電極部を上記半
田部に、またその本体を上記接着手段に着地させて上記
基板に搭載し、
次いでリフローでこの基板を加熱し、この加熱時におけ
る上記電極部の押圧力により、この電極部に上記半田部
の表面の酸化被膜を突き破らせて、この電極部を半田部
に埋入させるようにしたものである。(Means for Solving the Problems) The present invention forms a solder part on a circuit pattern of a board, and also forms an adhesive means at a position corresponding to the main body of an electronic component on this board, and then attaches the electronic component to its electrode. The part is placed on the solder part and the main body is placed on the adhesive means and mounted on the board, and then this board is heated by reflow, and the pressing force of the electrode part during this heating causes the electrode part to be attached to the above board. The electrode part is embedded in the solder part by breaking through the oxide film on the surface of the solder part.
（作用）
上記構成によれば、半田部にフラックスを使用しないこ
とにより、その表面には酸化被膜が生じやすいが、リフ
ロー時には、電極部は酸化被膜を突き破って半田部に埋
入し、電極部は半田部にしっかりとボンディングされる
。(Function) According to the above configuration, since no flux is used in the solder part, an oxide film is likely to be formed on the surface of the solder part, but during reflow, the electrode part breaks through the oxide film and embeds in the solder part, and the electrode part is firmly bonded to the solder part.
（実施例１） 次に、図面を参照しながら本発明の詳細な説明する。(Example 1) Next, the present invention will be described in detail with reference to the drawings.
第１図は、電子部品を基板に搭載している様子を示すも
のである。基板１の上面には、銅箔により回路パターン
２が形成されており、この回路パターン２上には、半田
部３が形成されている。この半田部３は、例えば半田メ
ツキや半田レベラーにより形成されたものであり、フラ
ックスは混入されていない。FIG. 1 shows how electronic components are mounted on a board. A circuit pattern 2 made of copper foil is formed on the upper surface of the substrate 1, and a solder portion 3 is formed on this circuit pattern 2. This solder portion 3 is formed by, for example, solder plating or a solder leveler, and no flux is mixed therein.
回路パターン２の中央部には、接着手段４がスクリーン
印刷やデイスペンサ等により塗布形成されている。この
接着手段４としては、瞬間的な接着力を有し、また後工
程のりフローにおいて、高温加熱しても接着力を失わな
い耐熱性接着剤が有利である。At the center of the circuit pattern 2, an adhesive means 4 is applied and formed by screen printing, a dispenser, or the like. As the adhesive means 4, it is advantageous to use a heat-resistant adhesive that has instantaneous adhesive strength and does not lose its adhesive strength even when heated at high temperatures in the post-process adhesive flow.
５は電子部品であって、本体としてのモールド体５１か
ら電極部であるリード５２が突出している。この電子部
品５は、移載ヘッド６のノズル７に吸着され、基板１に
搭載されるが、上記接着手段４は、モールド体５１に対
応する位置に、また半田部３はリード５２の接地部に対
応する位置に形成されている。Reference numeral 5 denotes an electronic component, and leads 52, which are electrode parts, protrude from a molded body 51 as a main body. The electronic component 5 is attracted to the nozzle 7 of the transfer head 6 and mounted on the substrate 1, but the adhesive means 4 is placed at a position corresponding to the mold body 51, and the solder portion 3 is placed at the ground portion of the lead 52. It is formed at a position corresponding to .
第２図は、ボンディング順を示すものであって、ノズル
７に吸着された電子部品５は、リード５２の接地部５２
ａを上記半田部３に、またモールド体５１を接着手段４
に着地させて搭載される（同図（ａ）参照）。５３はリ
ード５２の表面に形成されたメツキである。この場合、
同図（ｂ）に示すように、ノズル７によりモールド体５
１を押圧して、モールド体５１を接着手段４に強く押し
付ける。すると、リード５２は弾性を有することから、
図示するように屈曲変形し、半田部３に強く弾圧される
。FIG. 2 shows the bonding order, and the electronic component 5 attracted to the nozzle 7 is attached to the ground portion 52 of the lead 52.
a to the solder portion 3, and the mold body 51 to the adhesive means 4.
The vehicle is mounted by landing on the ground (see figure (a)). 53 is a plating formed on the surface of the lead 52. in this case,
As shown in FIG. 5(b), the mold body 5 is
1 to strongly press the mold body 51 against the adhesive means 4. Then, since the lead 52 has elasticity,
As shown in the figure, it bends and deforms and is strongly pressed against the solder portion 3.
部分拡大図に示すように、メツキ５３や半田部３の表面
には酸化被膜ａが生じており、この酸化被膜ａのために
、リード５２の接地部５２ａと半田部３の電気的接触は
阻害されている。As shown in the partially enlarged view, an oxide film a is formed on the surface of the plating 53 and the solder part 3, and this oxide film a prevents electrical contact between the ground part 52a of the lead 52 and the solder part 3. has been done.
次いでノズル７は上昇して、モールド体５１から離れる
が、モールド体５１は接着手段４に接着されていること
から、リード５２は屈曲変形状態、すなわち接地部５２
ａが半田部３に強く弾圧された状態を保持する。Next, the nozzle 7 rises and separates from the mold body 51, but since the mold body 51 is adhered to the adhesive means 4, the lead 52 is bent and deformed, that is, the grounding portion 52
A is maintained in a state where it is strongly pressed against the solder portion 3.
次いで、基板１はリフロー装置へ送られ、半円部３の加
熱処理が行われる。同図（Ｃ）は、加熱処理を行ってい
る様子を示すものであって、半田部３は高温加熱（一般
に２００℃以上）されることにより溶融するが、上述の
ように屈曲変形したり一ド５２は、自身の弾性復元力に
より原形に戻ろうとするのに対し、モールド体５１は接
着手段４により基板１に固着されて浮き上るのを阻止さ
れていることから、接地部５２ａは上記弾性復元力に基
づく押圧力により、酸化被膜ａを突き破って、溶融状態
の半田部３の内部に埋入する。またこのように接地部５
２ａが半田部３に埋入することにより、リード５２はほ
ぼ原形に復帰する。またその際、リード５２表面のメツ
キ５３も溶融する。Next, the substrate 1 is sent to a reflow device, and the semicircular portion 3 is heated. Figure (C) shows how the heat treatment is being performed, and the solder part 3 is melted by being heated at a high temperature (generally 200°C or higher), but as described above, it is bent and deformed. The molded body 51 is fixed to the substrate 1 by the adhesive means 4 and is prevented from floating up, whereas the molded body 51 tries to return to its original shape by its own elastic restoring force. The pressing force based on the restoring force breaks through the oxide film a and embeds it inside the molten solder part 3. Also, like this, the grounding part 5
By embedding the lead 2a into the solder portion 3, the lead 52 returns to almost its original shape. At this time, the plating 53 on the surface of the lead 52 is also melted.
８は振動手段であり、リフローの際に、基板１を高速微
振動させることにより、上記酸化被膜ａの突き破り効果
をあげる。Reference numeral 8 denotes a vibration means which vibrates the substrate 1 at high speed during reflow, thereby increasing the effect of breaking through the oxide film a.
次いで半田部３は冷却されて硬化し、半田部３に埋入し
た接地部５２ａはしっかりとボンディングされる。Next, the solder portion 3 is cooled and hardened, and the grounding portion 52a embedded in the solder portion 3 is firmly bonded.
以上のように本方法によれば、リフローの加熱時に、リ
ード５２の接地部５２ａを半田部３に埋入させるように
しているので、接地部５２ａを半田部３にしっかりとと
ボンディングすることができ、したがってヌレ性を改善
するために使用されるフラフクスを不要にできる。As described above, according to this method, the grounding portion 52a of the lead 52 is embedded in the solder portion 3 during heating during reflow, so that the grounding portion 52a can be firmly bonded to the solder portion 3. and thus eliminates the need for fluff, which is used to improve wettability.
（実施例２）
第３図のものは、上記接着手段４に替えて、熱収縮性を
有する接着手段１０が設けられている。この接着手段１
０は、例えば形状記憶合金体や形状記憶樹脂体、あるい
は熱収縮性プラスチック１０ａの上面と下面に、耐熱性
の接着剤１０ｂを塗布して形成されている。(Example 2) In the one shown in FIG. 3, a heat-shrinkable adhesive 10 is provided in place of the adhesive 4 described above. This adhesive means 1
0 is formed by applying a heat-resistant adhesive 10b to the upper and lower surfaces of, for example, a shape memory alloy body, a shape memory resin body, or a heat shrinkable plastic body 10a.
リード５２を半田部３に、またモールド体５１を接着手
段ＩＯに着地させて電子部品５を基板１に搭載しく同図
（ａ）、 （ｂ）’） 、次いでリフロー装置により
加熱すると（同図（Ｃ））、接着手段１０は熱収縮する
ことから、リード５２の接地部５２ａは、この熱収縮に
ともなう押圧力により、酸化被膜ａを突き破って溶融し
た半田部３に埋入し、次いで半田部３が冷却硬化するこ
とにより、接地部５２ａは半田部３にしっかりとボンデ
ィングされる。The lead 52 is placed on the solder part 3 and the molded body 51 is placed on the adhesive means IO to mount the electronic component 5 on the board 1 (Figs. (C)), since the adhesive means 10 is thermally contracted, the grounding portion 52a of the lead 52 penetrates the oxide film a and is embedded in the melted solder portion 3 due to the pressing force accompanying this thermal contraction, and then solder By cooling and hardening the portion 3, the grounding portion 52a is firmly bonded to the solder portion 3.
上記実施例１は、リード５２の弾性力により、その接地
部５２ａを半田部３に埋入させるものであるので、ＱＦ
ＰやＳＯＰのような弾性を有するリードを備えた電子部
品に適用できるが、コンデンサチップや抵抗チップのよ
うなり一ドレスの電子部品には適用できない。これに対
し実施例２は、接着手段１０の熱収縮力により、リード
５２を半田部３に埋入させるものであるので、リードレ
スの電子部品にも適用できる。In the first embodiment, the grounding part 52a is embedded in the solder part 3 by the elastic force of the lead 52, so the QF
Although it can be applied to electronic components with elastic leads such as P and SOP, it cannot be applied to single-dress electronic components such as capacitor chips and resistor chips. On the other hand, in the second embodiment, the leads 52 are embedded in the solder portion 3 by the thermal shrinkage force of the adhesive means 10, so that the second embodiment can also be applied to leadless electronic components.
（実施例３）
第４図において、リード５２は形状記憶合金体やバイメ
タルのような温度特性を有する素材にてやや上方に屈曲
させて形成されており、本体５１を接着手段４に接着さ
せてリフローを行う際に、リード５２は下方に屈曲して
半田部３の酸化被膜を突き破り、半田部３に埋入する。(Embodiment 3) In FIG. 4, the lead 52 is made of a material having temperature characteristics such as a shape memory alloy or bimetal and is bent slightly upward, and the main body 51 is bonded to the adhesive means 4. When performing reflow, the lead 52 is bent downward, breaks through the oxide film of the solder part 3, and is embedded in the solder part 3.
なお本方法は、フラフクスを使用せずとも、電極部を半
田部に埋入させてしっかりとボンディングできるもので
あり、フラフクスを不要にできる長所を有しているが、
フラフクスを使用することを禁止するものではない。Note that this method has the advantage that the electrode part can be embedded in the solder part and bonded firmly without using the flux, and it can eliminate the need for the flux.
This does not prohibit the use of flafukus.
（発明の効果）
以上説明したように本発明は、基板の回路パターンに半
田部を形成するとともに、この基板の電子部品の本体に
対応する位置に接着手段を形成したうえで、
電子部品をその電極部を上記半田部に、またその本体を
上記接着手段に着地させて上記基板に搭載し、
次いでリフローでこの基板を加熱し、この加熱時におけ
る上記電極部の押圧力により、この電極部に上記半田部
の表面の酸化被膜を突き破らせて、この電極部を半田部
に埋入させるようにしているので、リフローで加熱処理
する際に、電子部品の電極部を、酸化被膜を突き破って
半田部に埋入させ、半田部にしっかりとボンディングす
ることができ、したがってヌレ性を改善するためのフラ
ツクスを使用することを不要にできる。(Effects of the Invention) As explained above, the present invention forms a solder part on the circuit pattern of a board, forms an adhesive means on the board at a position corresponding to the main body of the electronic component, and then attaches the electronic component to the circuit pattern. The electrode part is placed on the solder part and its main body is placed on the adhesive means and mounted on the board, and then this board is heated by reflow, and the pressing force of the electrode part during this heating causes the electrode part to be attached. The electrode part is embedded in the solder part by breaking through the oxide film on the surface of the solder part, so when heat-treating it by reflow, the electrode part of the electronic component can be broken through the oxide film. It can be embedded in the solder part and firmly bonded to the solder part, thus making it unnecessary to use flux to improve wettability.
図は本発明の実施例を示すものであって、第１図は移載
ヘッドによる搭載中の斜視図、第２図
はボンディング順を示す正面図、第３図
は他の実施例のボンディング順を示す
正面図、第４図は更に他の実施例の正面図である。
１・・・基板
２・・・回路パターン
３・・・半田部
４．１０・・・接着手段
５・・・電子部品
５１・・・本体
５２・・・電極部
ａ・・・酸化被膜The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view during loading by the transfer head, and Fig. 2
Figure 3 is a front view showing the bonding order.
4 is a front view showing the bonding order of another embodiment, and FIG. 4 is a front view of still another embodiment. 1... Substrate 2... Circuit pattern 3... Solder part 4.10... Adhesive means 5... Electronic component 51... Main body 52... Electrode part a... Oxide film
Claims (1)
基板の電子部品の本体に対応する位置に接着手段を形成
したうえで、 電子部品をその電極部を上記半田部に、またその本体を
上記接着手段に着地させて上記基板に搭載し、 次いでリフローでこの基板を加熱し、この加熱時におけ
る上記電極部の押圧力により、この電極部に上記半田部
の表面の酸化被膜を突き破らせて、この電極部を半田部
に埋入させるようにしたことを特徴とする電子部品のボ
ンディング方法。[Claims] A solder portion is formed on the circuit pattern of a circuit board, and an adhesive means is formed on the board at a position corresponding to the main body of the electronic component, and then the electronic component is attached to the solder portion with its electrode portion, Further, the main body is placed on the above-mentioned adhesive means and mounted on the above-mentioned board, and then this board is heated by reflow, and the oxide film on the surface of the above-mentioned solder part is formed on this electrode part by the pressing force of the above-mentioned electrode part during this heating. A bonding method for electronic components, characterized in that the electrode portion is penetrated into the solder portion and the electrode portion is embedded in the solder portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063216A JP2738118B2 (en) | 1990-03-14 | 1990-03-14 | Electronic component bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063216A JP2738118B2 (en) | 1990-03-14 | 1990-03-14 | Electronic component bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03263895A true JPH03263895A (en) | 1991-11-25 |
| JP2738118B2 JP2738118B2 (en) | 1998-04-08 |
Family
ID=13222787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2063216A Expired - Lifetime JP2738118B2 (en) | 1990-03-14 | 1990-03-14 | Electronic component bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2738118B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353801A (en) * | 2004-06-10 | 2005-12-22 | Mitsubishi Electric Corp | Terminal-jointing method by soldering |
-
1990
- 1990-03-14 JP JP2063216A patent/JP2738118B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353801A (en) * | 2004-06-10 | 2005-12-22 | Mitsubishi Electric Corp | Terminal-jointing method by soldering |
| JP4522752B2 (en) * | 2004-06-10 | 2010-08-11 | 三菱電機株式会社 | Terminal joining method by soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2738118B2 (en) | 1998-04-08 |
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