JPH03258270A - High frequency thermotherapy apparatus - Google Patents
High frequency thermotherapy apparatusInfo
- Publication number
- JPH03258270A JPH03258270A JP5778790A JP5778790A JPH03258270A JP H03258270 A JPH03258270 A JP H03258270A JP 5778790 A JP5778790 A JP 5778790A JP 5778790 A JP5778790 A JP 5778790A JP H03258270 A JPH03258270 A JP H03258270A
- Authority
- JP
- Japan
- Prior art keywords
- matching
- load impedance
- variable
- real
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000015 thermotherapy Methods 0.000 title claims description 8
- 238000007669 thermal treatment Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000035900 sweating Effects 0.000 description 1
Landscapes
- Electrotherapy Devices (AREA)
Abstract
Description
【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、高周波温熱治療装置の整合装置に関する。[Detailed description of the invention] (b) Industrial application fields The present invention relates to a matching device for a high-frequency thermotherapy device.
（ロ）従来の技術
一１ｉ１８に高周波温熱治療装置では、高周波信号を有
効に電極を介して負荷に供給するために、高周波出力回
路と治療用電極間に整合装置（マツチング回路）を設け
ている。この種の整合装置として使用される回路には、
第２図（ａ）、第２図（ｂ）に示すＴ型平衡整合回路と
、第３図（ａ）、第３図（１））に示すπ型平衡整合回
路がある。第２図（ａ）に示す回路は、バラン１の出力
側に可変コンデンサｖｃ、 、ｖｃ２、ｖｃ３、ｖｃ４
と可変インダクタンスＬとで構成されるＴ型平衡回路が
、可変コンデンサＶＣ■Ｃ２を連動で、さらに可変コン
デンサＶｃ３、ｖｃ６を連動で変化させてマツチングを
取るものである。また第２図（ｂ）に示す回路はバラン
１の出力側に可変インダクタンスＬ１、Ｌ２、Ｌ３、Ｌ
４と可変コンデンサＶＣ７で構成されるＴ型平衡回路が
接続されてなるものであり、可変インダクタンスＬ＋、
Ｌｘを連動で可変インダクタンスＬ４、Ｌ４を連動で変
化させて、マツチングを取るものである。(b) Conventional technology 1i18 In high-frequency thermotherapy devices, a matching device (matching circuit) is provided between the high-frequency output circuit and the treatment electrodes in order to effectively supply high-frequency signals to the load via the electrodes. . The circuit used as this type of matching device includes:
There are T-type balanced matching circuits shown in FIGS. 2(a) and 2(b), and π-type balanced matching circuits shown in FIGS. 3(a) and 3(1)). The circuit shown in FIG. 2(a) has variable capacitors vc, , vc2, vc3, vc4 on the output side of balun 1.
A T-type balanced circuit composed of a variable inductance L and a variable inductance L performs matching by interlocking variable capacitor VC2 and interlocking variable capacitors Vc3 and vc6. In addition, the circuit shown in FIG. 2(b) has variable inductances L1, L2, L3, L on the output side of the balun 1.
4 and a T-type balanced circuit consisting of a variable capacitor VC7 are connected, and a variable inductance L+,
Matching is achieved by interlocking variable inductances L4 and L4 with Lx.
また、第３図（ａ）に示す回路は、パラン１の出力側に
可変コンデンサｖ口、ｖｃ、と可変インダクタンスＬ＋
、Ｌｚで構成されるπ型平衡回路が接続されてなるも
のであり、可変インダクタンスＬｌ、Ｌｍを連動してマ
ツチングを取る必要がある。第３図（ｂ）に示す回路は
パランｌの出力側に、可変インダクタンスＬ、 、Ｌ２
と可変コンデンサｖｃ、 、ｖｃ２で構成されるπ型平
衡回路が接続されてなるものであり、可変コンデンサＶ
Ｃ■Ｃ２を連動してマツチングを取る必要がある。In addition, the circuit shown in FIG. 3(a) has a variable capacitor v, vc and a variable inductance L+ on the output side of the paran 1.
, Lz are connected, and it is necessary to perform matching by interlocking the variable inductances Ll and Lm. The circuit shown in FIG. 3(b) has variable inductances L, , L2 on the output side of the parallel
A π-type balanced circuit consisting of variable capacitors vc, , and vc2 is connected to the variable capacitor V.
It is necessary to achieve matching by linking C■C2.
（ハ）発明が解決しようとする課題
上記した従来の高周波温熱治療装置の整合装置では、い
ずれも整合回路の可変インダクタンス（コイル）や可変
コンデンサがベアで必要であり、平衡を保って配置する
必要があり、又その分天型化する問題がある。又コイル
やコンデンサは最低でも２つ以上の調整ができるように
する必要があるが、調整が複雑である上に、広い整合範
囲から目的の整合を取るのに時間が必要であり、交互に
何度も調整する必要がある。また、自動整合するために
はソフトが複雑となり、自動整合に時間が必要となる等
の問題がある。(c) Problems to be solved by the invention In the above-mentioned matching devices for conventional high-frequency thermal treatment devices, the variable inductance (coil) and variable capacitor of the matching circuit are required bare, and they must be arranged in a balanced manner. There is a problem that is becoming increasingly common. In addition, coils and capacitors must be able to be adjusted in at least two ways, but not only is the adjustment complicated, but it also takes time to achieve the desired matching from a wide matching range. The degree also needs to be adjusted. Further, there are problems such as the need for complicated software for automatic matching and the need for time for automatic matching.
この発明は、上記問題点に着目してなされたものであっ
て、構成が簡単で調整が容易な整合装置を従供すること
を目的としている。The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide an alignment device that has a simple configuration and is easy to adjust.
（ニ）課題を解決するための手段及び作用この発明の高
周波温熱治療装置の整合装置は、負荷インピーダンスの
実数部を調整し得る第１の整合部と、負荷インピーダン
スの虚数部を調整し得る第２の整合部とを備えている。(d) Means and Effects for Solving the Problems The matching device for a high-frequency thermotherapy device of the present invention includes a first matching section that can adjust the real part of the load impedance, and a first matching section that can adjust the imaginary part of the load impedance. 2 matching parts.
この高周波温熱治療装置の整合装置では、第１の整合部
で調整を行うことにより、負荷インピーダンスの実数部
が虚数部と分離して整合が取られる。文節２の整合部で
調整を行うことにより、負荷インピーダンスの虚数部が
実数部と分離して整合が取られる。In this matching device of the high-frequency thermotherapy device, the real part of the load impedance is separated from the imaginary part and matching is achieved by performing adjustment in the first matching section. By performing adjustment in the matching section of Clause 2, the imaginary part of the load impedance is separated from the real part and matched.
（ホ）実施例
以下、実施例により、この発明をさらに詳細に説明する
。(E) Examples The present invention will be explained in more detail with reference to Examples below.
第１図は、この発明の一実施例を示す高周波温熱治療装
置の整合装置の回路図である。FIG. 1 is a circuit diagram of a matching device for a high frequency thermotherapy device showing one embodiment of the present invention.
第１図において、入力端子Ｐ、には可変コンデンサ■Ｃ
３の一端が接続され、この可変コンデンサＶＣ３の他端
はバラン１の入力コイルＬ、に接続され、入力コイルＬ
、の他端は、入カケープルの接地端子Ｐ６に接続されて
いる。さらに入力コイル■４．に並列にコイルＬが接続
されている。In Figure 1, the input terminal P has a variable capacitor ■C
One end of this variable capacitor VC3 is connected to the input coil L of the balun 1, and the other end of the variable capacitor VC3 is connected to the input coil L of the balun 1.
The other end of , is connected to the ground terminal P6 of the input cable. Furthermore, input coil ■4. A coil L is connected in parallel to.
バランＩの出力コイルＬＳの一端には可変コンデンサＶ
Ｃ８の一端が接続され、この可変コンデンサＶＣ１の他
端には治療用電極２が接続される。A variable capacitor V is connected to one end of the output coil LS of the balun I.
One end of C8 is connected to the variable capacitor VC1, and the treatment electrode 2 is connected to the other end of the variable capacitor VC1.
また、出力コイルＬ５の他端には可変コンデンサ■Ｃ２
の一端が接続され、この可変コンデンサＶＣ２の他端に
は治療用電極３が接続される。治療に際しては、治療用
電極２．３間に患部（負荷）４が挟持される。可変コン
デンサｖｃ、、ｖｃ２は連動で容量が変化されるように
なっている。In addition, a variable capacitor ■C2 is connected to the other end of the output coil L5.
One end of the variable capacitor VC2 is connected to the other end of the variable capacitor VC2, and the treatment electrode 3 is connected to the other end of the variable capacitor VC2. During treatment, the affected area (load) 4 is held between the treatment electrodes 2 and 3. The capacitances of the variable capacitors vc, , vc2 are changed in conjunction with each other.
上記のように接続構成される実施例回路において、バラ
ン１の入力側の可変コンデンサ■Ｃ３、コイルＬ＋で負
荷インピーダンスの実数値調整部（第１の整合部）５を
構成し、バラン１の出力側の可変コンデンサＶＣ＋、、
ＶＣ２で負荷インピーダンスの虚数値調整部（第２の整
合部）６を構成している。In the example circuit connected as described above, the variable capacitor ■C3 on the input side of the balun 1 and the coil L+ constitute the real value adjustment section (first matching section) 5 of the load impedance, and the output of the balun 1 side variable capacitor VC+,,
The VC2 constitutes an imaginary value adjustment section (second matching section) 6 for load impedance.
この実施例回路において、整合を取る場合は、先ず実数
（Ｉｉ！８ｍ整部５が回部５ンデンサ■Ｃ３を変化させ
て、負荷インピーダンスの実数値のみを調整し、整合を
取る。実数値調整部５は］、 Ｏ０％の実数変化はでき
ないが、可変コンデンサＶＣ３とコイルＬ１の定数を選
択することにより、はぼ実数上を変動できるポイントが
ある。In this embodiment circuit, when matching is to be achieved, first the real number (Ii! In section 5], although it is not possible to change the real number by 0%, there is a point where it can be changed approximately on the real number by selecting the constants of the variable capacitor VC3 and the coil L1.
次に、虚数値調整部５の可変コンデンサｖＣ１、■Ｃ２
を変化させて負荷インピーダンスの虚数値のみを調整し
、整合を取る。Next, the variable capacitors vC1 and ■C2 of the imaginary value adjustment section 5
, and adjust only the imaginary value of the load impedance to achieve matching.
以上のように、この実施例回路では、負荷インピーダン
スの実数値と虚数値を分離して個別に調整することがで
きる。As described above, in this embodiment circuit, the real value and imaginary value of the load impedance can be separated and adjusted individually.
（へ）発明の効果
この発明によれば、負荷インピーダンスの実数部を調整
し得る第１の整合部と、負荷インピーダンスの虚数部を
調整し得る第２の整合部とを備えるものであるから、
■整合回路の部品数が少なくなり小型化できる上、エネ
ルギー損失も少なくなる。(f) Effects of the Invention According to the present invention, since it is provided with a first matching section that can adjust the real part of the load impedance and a second matching section that can adjust the imaginary part of the load impedance, ■The number of parts in the matching circuit is reduced, making it more compact and reducing energy loss.
■平衡を保って配置する必要がある部分が半減し、その
分調整、設計が容易となる。■The number of parts that need to be arranged in a balanced manner is halved, making adjustment and design easier.
■実数部と虚数部を個別に調整できるので、調整が簡単
となり、交互に調整する必要がなく、調整時間が短くな
る。■Since the real part and the imaginary part can be adjusted separately, adjustment is easy, and there is no need to adjust them alternately, which shortens the adjustment time.
■自動整合するときでも、ソフトウェア構成が簡単であ
り、やはり整合時間が短くなる。■ Even when performing automatic matching, the software configuration is simple and the matching time is short.
■治療中に発汗等で整合がずれても簡単に再調整し、整
合が取れる。■Even if the alignment shifts due to sweating etc. during treatment, it can be easily readjusted and the alignment can be achieved.
等の利点がある。There are advantages such as
第１図は、この発明の一実施例を示す高周波温熱治療装
置の整合装置の回路図、第２図（ａ）、第２図（ｂ）は
、従来のπ型平衡整合回路を示す回路図、第３図（ａ）
、第３図（ｂ）は、従来のπ型平衡整合回路を示す回路
図である。
１：バラン、 ２・３：治療用電極、５：実数値
調整部、 ６：虚数値調整部。FIG. 1 is a circuit diagram of a matching device for a high-frequency thermotherapy device showing an embodiment of the present invention, and FIGS. 2(a) and 2(b) are circuit diagrams showing a conventional π-type balanced matching circuit. , Figure 3(a)
, FIG. 3(b) is a circuit diagram showing a conventional π-type balanced matching circuit. 1: Balun, 2 and 3: Treatment electrodes, 5: Real value adjustment section, 6: Imaginary value adjustment section.
Claims (1)
の高周波温熱治療装置の整合装置であって、負荷インピ
ーダンスの実数部を調整し得る第１の整合部と、負荷イ
ンピーダンスの虚数部を調整し得る第２の整合部とを備
えたことを特徴とする高周波温熱治療装置の整合装置。(1) A matching device for a high-frequency thermal treatment device for efficiently supplying a high-frequency signal to a treatment electrode, which includes a first matching section that can adjust the real part of the load impedance, and a first matching part that can adjust the imaginary part of the load impedance. 1. A matching device for a high-frequency thermotherapy device, comprising: a second matching portion that can be used in a high-frequency thermal treatment device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5778790A JP2906265B2 (en) | 1990-03-08 | 1990-03-08 | High frequency hyperthermia treatment device matching device and high frequency hyperthermia treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5778790A JP2906265B2 (en) | 1990-03-08 | 1990-03-08 | High frequency hyperthermia treatment device matching device and high frequency hyperthermia treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03258270A true JPH03258270A (en) | 1991-11-18 |
| JP2906265B2 JP2906265B2 (en) | 1999-06-14 |
Family
ID=13065597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5778790A Expired - Fee Related JP2906265B2 (en) | 1990-03-08 | 1990-03-08 | High frequency hyperthermia treatment device matching device and high frequency hyperthermia treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2906265B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018016929A1 (en) * | 2016-07-22 | 2018-01-25 | 주식회사 루트로닉 | Therapeutic rf energy transmitter and method for controlling same |
| JP2018538778A (en) * | 2015-12-22 | 2018-12-27 | サーマツール コーポレイション | High frequency power supply system with fine-tuned output for workpiece heating |
-
1990
- 1990-03-08 JP JP5778790A patent/JP2906265B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018538778A (en) * | 2015-12-22 | 2018-12-27 | サーマツール コーポレイション | High frequency power supply system with fine-tuned output for workpiece heating |
| WO2018016929A1 (en) * | 2016-07-22 | 2018-01-25 | 주식회사 루트로닉 | Therapeutic rf energy transmitter and method for controlling same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2906265B2 (en) | 1999-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |