JPH0325403Y2 - - Google Patents

Info

Publication number
JPH0325403Y2
JPH0325403Y2 JP3599586U JP3599586U JPH0325403Y2 JP H0325403 Y2 JPH0325403 Y2 JP H0325403Y2 JP 3599586 U JP3599586 U JP 3599586U JP 3599586 U JP3599586 U JP 3599586U JP H0325403 Y2 JPH0325403 Y2 JP H0325403Y2
Authority
JP
Japan
Prior art keywords
clamp
hole
fixed
leaf springs
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3599586U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62147341U (US06566495-20030520-M00011.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3599586U priority Critical patent/JPH0325403Y2/ja
Publication of JPS62147341U publication Critical patent/JPS62147341U/ja
Application granted granted Critical
Publication of JPH0325403Y2 publication Critical patent/JPH0325403Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Jigs For Machine Tools (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP3599586U 1986-03-12 1986-03-12 Expired JPH0325403Y2 (US06566495-20030520-M00011.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (US06566495-20030520-M00011.png) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (US06566495-20030520-M00011.png) 1986-03-12 1986-03-12

Publications (2)

Publication Number Publication Date
JPS62147341U JPS62147341U (US06566495-20030520-M00011.png) 1987-09-17
JPH0325403Y2 true JPH0325403Y2 (US06566495-20030520-M00011.png) 1991-06-03

Family

ID=30845994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3599586U Expired JPH0325403Y2 (US06566495-20030520-M00011.png) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPH0325403Y2 (US06566495-20030520-M00011.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054992A (ja) * 2010-11-12 2011-03-17 Seiko Instruments Inc ワイヤボンダ装置およびその使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (US06566495-20030520-M00011.png) * 1980-08-14 1982-03-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (US06566495-20030520-M00011.png) * 1980-08-14 1982-03-08

Also Published As

Publication number Publication date
JPS62147341U (US06566495-20030520-M00011.png) 1987-09-17

Similar Documents

Publication Publication Date Title
KR940002761B1 (ko) 와이어 본딩 방법 및 장치
EP1126507A2 (en) Apparatus for positioning a thin plate
JPH0325403Y2 (US06566495-20030520-M00011.png)
TW511223B (en) Workpiece holding device for a bonding apparatus
US6363976B1 (en) Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JP3226035B2 (ja) 電子部品の位置決めリード曲げ装置及び曲げ法
KR100919791B1 (ko) 범프 본딩 장치
JP3242486B2 (ja) 半導体モールド装置
JPH0214200Y2 (US06566495-20030520-M00011.png)
KR200162352Y1 (ko) 리드 프레임 테이프 접착장치
JPS6350041Y2 (US06566495-20030520-M00011.png)
JPS6344998Y2 (US06566495-20030520-M00011.png)
JP2548227Y2 (ja) 電子部品用リードフレームの押さえ装置
JPH0244520Y2 (US06566495-20030520-M00011.png)
JP3314771B2 (ja) リード成形装置及び半導体装置保持方法
JPH0416016B2 (US06566495-20030520-M00011.png)
JPH056658Y2 (US06566495-20030520-M00011.png)
JPH0636418B2 (ja) Ｔａｂのリードフォーミング方法
JPS6269539A (ja) リ−ド成形機
JPH04324948A (ja) ボンディング方法
JPS61222214A (ja) コンデンサのタブ折曲げ装置
JPS62122241A (ja) 半導体装置
JPH05269697A (ja) 半導体素子接着用テープの打ち抜き用金型装置
JPH01243565A (ja) 半導体装置のリード切断装置
JPH0474860B2 (US06566495-20030520-M00011.png)