JPH03254011A - 高分子複合誘電体 - Google Patents
高分子複合誘電体Info
- Publication number
- JPH03254011A JPH03254011A JP5245290A JP5245290A JPH03254011A JP H03254011 A JPH03254011 A JP H03254011A JP 5245290 A JP5245290 A JP 5245290A JP 5245290 A JP5245290 A JP 5245290A JP H03254011 A JPH03254011 A JP H03254011A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- high molecular
- composite dielectric
- nucleus
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 9
- 239000000126 substance Substances 0.000 title abstract 2
- 239000003989 dielectric material Substances 0.000 claims abstract description 5
- 239000010936 titanium Substances 0.000 claims abstract 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract 5
- 239000000945 filler Substances 0.000 claims abstract 4
- 239000011159 matrix material Substances 0.000 claims abstract 4
- 239000002184 metal Substances 0.000 claims abstract 4
- 229910052751 metal Inorganic materials 0.000 claims abstract 4
- 239000002245 particle Substances 0.000 claims abstract 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 229910002113 barium titanate Inorganic materials 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 abstract 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は高分子複合誘電体に関する。
〈従来の技術〉
誘電体材料として用いられるプラスチックは、そのほと
んどが誘電率ε〈5となっており、これらプラスチック
とたとえばPZT(ジルコニウムチタン酸鉛)等、強誘
電体セラミ、りとの複合材料を形成することにより、誘
電率を向上させることが考えられている。
んどが誘電率ε〈5となっており、これらプラスチック
とたとえばPZT(ジルコニウムチタン酸鉛)等、強誘
電体セラミ、りとの複合材料を形成することにより、誘
電率を向上させることが考えられている。
Claims (2)
- (1)金属チタン粉体の各粒子の表面にチタン酸系誘電
体被膜が形成された誘電体材料が高分子樹脂からなるマ
トリックス中にフィラーとして分散されてなる高分子複
合誘電体。 - (2)異方性を有する金属チタンの表面にチタン酸系誘
電体被膜が形成された誘電体材料が、高分子樹脂からな
るマトリックス中にフィラーとして、方向性を有する状
態で分散されてなる高分子複合誘電体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2052452A JPH0787046B2 (ja) | 1990-03-02 | 1990-03-02 | 高分子複合誘電体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2052452A JPH0787046B2 (ja) | 1990-03-02 | 1990-03-02 | 高分子複合誘電体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03254011A true JPH03254011A (ja) | 1991-11-13 |
JPH0787046B2 JPH0787046B2 (ja) | 1995-09-20 |
Family
ID=12915116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2052452A Expired - Fee Related JPH0787046B2 (ja) | 1990-03-02 | 1990-03-02 | 高分子複合誘電体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0787046B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002061765A1 (fr) * | 2001-01-29 | 2002-08-08 | Jsr Corporation | Particule composite pour dielectriques, particule de resine composite ultra-microparticulaire, composition pour realiser des dielectriques et leur utilisation |
EP1231637A2 (en) | 2001-02-08 | 2002-08-14 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
WO2008122775A1 (en) * | 2007-04-04 | 2008-10-16 | Mbda Uk Limited | A high-dielectric material |
CN103289315A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 复合材料、基于复合材料的介质基板及其制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104530616B (zh) * | 2015-01-05 | 2017-06-09 | 内蒙古科技大学 | 一种高介电性能低损耗片状钛酸钡基/聚合物复合材料及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196411A (ja) * | 1989-12-25 | 1991-08-27 | Matsushita Electric Works Ltd | 複合誘電体 |
-
1990
- 1990-03-02 JP JP2052452A patent/JPH0787046B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196411A (ja) * | 1989-12-25 | 1991-08-27 | Matsushita Electric Works Ltd | 複合誘電体 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002061765A1 (fr) * | 2001-01-29 | 2002-08-08 | Jsr Corporation | Particule composite pour dielectriques, particule de resine composite ultra-microparticulaire, composition pour realiser des dielectriques et leur utilisation |
US7169327B2 (en) | 2001-01-29 | 2007-01-30 | Jsr Corporation | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
EP1231637A2 (en) | 2001-02-08 | 2002-08-14 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
US6924971B2 (en) | 2001-02-08 | 2005-08-02 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
US7220481B2 (en) | 2001-02-08 | 2007-05-22 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
KR100828867B1 (ko) * | 2001-02-08 | 2008-05-09 | 가부시키가이샤 히타치세이사쿠쇼 | 고유전율 복합 재료와 이를 이용한 다층 배선판 |
WO2008122775A1 (en) * | 2007-04-04 | 2008-10-16 | Mbda Uk Limited | A high-dielectric material |
EP2458595A1 (en) * | 2007-04-04 | 2012-05-30 | MBDA UK Limited | A high-dielectric material |
US8440121B2 (en) | 2007-04-04 | 2013-05-14 | Mbda Uk Limited | High-dielectric material |
CN103289315A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 复合材料、基于复合材料的介质基板及其制造方法 |
CN103289315B (zh) * | 2012-02-29 | 2017-02-15 | 深圳光启创新技术有限公司 | 复合材料、基于复合材料的介质基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0787046B2 (ja) | 1995-09-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |