JPH0325393Y2 - - Google Patents
Info
- Publication number
- JPH0325393Y2 JPH0325393Y2 JP1985175486U JP17548685U JPH0325393Y2 JP H0325393 Y2 JPH0325393 Y2 JP H0325393Y2 JP 1985175486 U JP1985175486 U JP 1985175486U JP 17548685 U JP17548685 U JP 17548685U JP H0325393 Y2 JPH0325393 Y2 JP H0325393Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- capacitor
- hole
- recess
- metal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 40
- 239000003990 capacitor Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175486U JPH0325393Y2 (US07993877-20110809-P00003.png) | 1985-11-13 | 1985-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175486U JPH0325393Y2 (US07993877-20110809-P00003.png) | 1985-11-13 | 1985-11-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282728U JPS6282728U (US07993877-20110809-P00003.png) | 1987-05-27 |
| JPH0325393Y2 true JPH0325393Y2 (US07993877-20110809-P00003.png) | 1991-06-03 |
Family
ID=31114853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985175486U Expired JPH0325393Y2 (US07993877-20110809-P00003.png) | 1985-11-13 | 1985-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325393Y2 (US07993877-20110809-P00003.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189050A (ja) * | 2006-01-13 | 2007-07-26 | Nichicon Corp | 電子部品 |
| JP4690209B2 (ja) * | 2006-01-31 | 2011-06-01 | ニチコン株式会社 | 電子部品 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249704Y2 (US07993877-20110809-P00003.png) * | 1985-11-11 | 1990-12-27 |
-
1985
- 1985-11-13 JP JP1985175486U patent/JPH0325393Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6282728U (US07993877-20110809-P00003.png) | 1987-05-27 |
