JPH0325393Y2 - - Google Patents

Info

Publication number

JPH0325393Y2

JPH0325393Y2 JP1985175486U JP17548685U JPH0325393Y2 JP H0325393 Y2 JPH0325393 Y2 JP H0325393Y2 JP 1985175486 U JP1985175486 U JP 1985175486U JP 17548685 U JP17548685 U JP 17548685U JP H0325393 Y2 JPH0325393 Y2 JP H0325393Y2

Authority

JP

Japan

Prior art keywords

lead wire

capacitor

hole

recess

metal terminal

Prior art date

1985-11-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 40
• 239000003990 capacitor Substances 0.000 claims description 35
• 229910052751 metal Inorganic materials 0.000 claims description 24
• 239000002184 metal Substances 0.000 claims description 24
• 229910052782 aluminium Inorganic materials 0.000 claims description 13
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
• 238000007789 sealing Methods 0.000 claims description 6
• 238000003466 welding Methods 0.000 claims description 4
• 239000003792 electrolyte Substances 0.000 description 4
• 239000011347 resin Substances 0.000 description 4
• 229920005989 resin Polymers 0.000 description 4
• 238000005452 bending Methods 0.000 description 2
• 238000000605 extraction Methods 0.000 description 2
• 239000011888 foil Substances 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000001704 evaporation Methods 0.000 description 1
• 230000008020 evaporation Effects 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• 239000003566 sealing material Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 125000006850 spacer group Chemical group 0.000 description 1
• 238000004804 winding Methods 0.000 description 1