JPH0325367Y2 - - Google Patents
Info
- Publication number
- JPH0325367Y2 JPH0325367Y2 JP1985014561U JP1456185U JPH0325367Y2 JP H0325367 Y2 JPH0325367 Y2 JP H0325367Y2 JP 1985014561 U JP1985014561 U JP 1985014561U JP 1456185 U JP1456185 U JP 1456185U JP H0325367 Y2 JPH0325367 Y2 JP H0325367Y2
- Authority
- JP
- Japan
- Prior art keywords
- rail
- connecting piece
- electronic component
- rails
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008602 contraction Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007591 painting process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Belt Conveyors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は塗装、乾燥工程における円筒形チツプ
状電子部品搬送装置にかかりレールの継目の構成
に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to the construction of a rail joint for a cylindrical chip-shaped electronic component conveying device used in painting and drying processes.
近年円筒形チツプ部品と呼ばれるリード線の付
かない部品が出現している。この種の部品はリー
ド付部品に見る様にリード線を支持して各種製造
処理を行うことができない。したがつて近年ベル
トとレールを配しそれ等が改々協動して電子部品
を転送する所謂ベルト方式なる搬送装置が開発さ
れている。しかし、これ等の装置は塗装工程の焼
付の場合のように熱を使う場合進行方向への熱膨
脹が著しくその対策として従来は第４図に示すよ
うに電子部品Ａを支持するレール１の継目に一定
間隔Ｓを開けて熱膨脹に備え、その間をマグネツ
ト２等を用いて吸着させて移し替えを行つてい
る。３は搬送ベルトで、電子部品Ａが転動自在に
係合されレール１と平行に走行している。しかし
この方法は電子部品Ａが磁化され次工程でトラブ
ルを誘発することのみならず金属粉の付着、詰
り、脱落と云つた物理的不具合いが発生しトラブ
ルの最大な要因となる。
In recent years, parts called cylindrical chip parts that do not have lead wires have appeared. Unlike parts with leads, this type of parts cannot support lead wires and perform various manufacturing processes. Therefore, in recent years, a so-called belt-type conveying device has been developed in which a belt and a rail are arranged and these components work together to transfer electronic components. However, when these devices use heat, such as baking in the painting process, thermal expansion in the direction of travel is significant.As a countermeasure, conventionally, as shown in Figure 4, the joints of the rails 1 supporting the electronic components A are A fixed interval S is left open to prepare for thermal expansion, and a magnet 2 or the like is used to adsorb the parts between them to perform transfer. Reference numeral 3 denotes a conveyor belt, on which the electronic component A is rotatably engaged and runs parallel to the rail 1. However, this method not only magnetizes the electronic component A and causes trouble in the next process, but also causes physical defects such as adhesion of metal powder, clogging, and falling off, which is the biggest cause of trouble.
本考案は上述の問題に鑑み、レールの継目部分
の間隙でマグネツトによらず電子部品を保持させ
ようとするものである。
In view of the above-mentioned problems, the present invention attempts to hold electronic components in gaps between rail joints without relying on magnets.
本考案は上面を電子部品が搬送されるレールを
長さ方向に連続させる継目位置に少許の間隙を介
在させ、一方のレールより連結片を突出させこの
連結片を他方の案内レールに進退自在に係合させ
連結片がレールの間隙で電子部品を支持して連続
的に搬送を続行させ、レールの伸縮は連結片の進
退によつて吸収されるようにしたものである。
The present invention has a small gap at the joint where the rails on which electronic components are conveyed are continuous in the length direction on the top surface, and a connecting piece protrudes from one rail so that this connecting piece can move forward and backward into the other guide rail. The engaging connecting pieces support the electronic components in the gaps between the rails to allow continuous conveyance, and expansion and contraction of the rails is absorbed by the forward and backward movements of the connecting pieces.
本考案は、搬送される電子部品がレールの継目
間隙に至ると連結片に支持されて次のレールに移
行して搬送され、またレールの熱膨脹による伸縮
は継目間隙により吸収される。
In the present invention, when the electronic component to be transported reaches the joint gap between the rails, it is supported by the connecting piece and transferred to the next rail for transport, and expansion and contraction due to thermal expansion of the rail is absorbed by the joint gap.
本考案の実施例を第１図ないし第３図について
説明する。
An embodiment of the present invention will be described with reference to FIGS. 1 to 3.
４は移送装置本体で、コンベヤ状に移送される
搬送ベルト５とこのベルト５の下面に臨ませたレ
ール６とよりなり、レール６は図示されない固定
台に支持され上面中央部の長さ方向に凹溝８が形
成され、この凹溝８の両側に電子部品Ａの電極部
A1が係合される段部１１，１１が形成されてい
る。このレール６，６を長さ方向に接続する継目
部分には、熱膨脹に際してののびを吸収する少許
の間隙Ｓが介在されている。 Reference numeral 4 denotes a main body of the transfer device, which is composed of a conveyor belt 5 that is transferred like a conveyor and a rail 6 that faces the bottom surface of this belt 5. A groove 8 is formed, and electrode portions of the electronic component A are placed on both sides of the groove 8.
Step portions 11, 11 are formed to which A 1 is engaged. A small gap S is provided at the joint portion connecting the rails 6, 6 in the length direction to absorb stretching due to thermal expansion.
さらにこの間隙Ｓに臨ませて一方の固定レール
６の凹溝８に一端を軸着した連結片７が他方のレ
ール６の凹溝８に進退自在に係合されている。 Furthermore, a connecting piece 7 facing this gap S and having one end pivoted in the groove 8 of one of the fixed rails 6 is engaged in the groove 8 of the other rail 6 so as to be able to move forward and backward.
搬送ベルト５には円筒形チツプ状電子部品Ａが
１個ずつ嵌合される多数の通孔９が形成され、電
子部品Ａの両端電極部A1が通孔９両側の切欠部
１０，１０に係合されて搬送されるようになつて
いる。 A large number of through holes 9 into which cylindrical chip-shaped electronic components A are fitted one by one are formed in the conveyor belt 5, and the electrode portions A1 at both ends of the electronic components A are inserted into the notches 10, 10 on both sides of the through hole 9. It is adapted to be engaged and conveyed.
また１２は脱落防止の押え板で固定レール６上
に一定間隙で配設されている。 Further, reference numeral 12 denotes a holding plate to prevent falling off, which is arranged on the fixed rail 6 at a constant interval.
次に上述の実施例の作用を説明する。 Next, the operation of the above embodiment will be explained.
電子部品Ａが間隙Ｓに至ると電子部品Ａの胴部
A2が連結片７上を回転しながら進行して次のレ
ール６上に搬送される。またレール６が熱膨脹に
より伸長した場合は伸長分だけ連結片７が凹溝８
上を進出し、収縮時には逆に凹溝８上を後退す
る。 When electronic component A reaches gap S, the body of electronic component A
A 2 advances while rotating on the connecting piece 7 and is conveyed onto the next rail 6. In addition, when the rail 6 expands due to thermal expansion, the connecting piece 7 is moved into the groove 8 by the amount of expansion.
It advances on the top, and reversely retreats on the groove 8 when contracted.
本考案によれば上面を電子部品が搬送されるレ
ールを長さ方向に連続させる継目位置に少許の間
隙を介在させ、一方のレールより連結片を突出さ
せこの連結片を他方の案内レールに進退自在に係
合させたから、レール上を搬送される電子部品は
次のレールとの継目位置で連結片上を搬送され次
のレール上に円滑に移行させることができる。ま
たレールの熱膨脹による伸縮時には、連結片が他
方のレールに係合して進退し伸縮を吸収させるこ
とができる。
According to the present invention, a small gap is provided at the joint position where the rails on which electronic components are conveyed are continuous in the length direction on the upper surface, and a connecting piece protrudes from one rail, and this connecting piece advances and retreats from the other guide rail. Since the electronic components are freely engaged, the electronic component transported on the rail can be transported on the connecting piece at the joint position with the next rail, and can be smoothly transferred onto the next rail. Further, when the rail expands and contracts due to thermal expansion, the connecting piece engages with the other rail and moves back and forth to absorb the expansion and contraction.
したがつてチツプ状電子部品の塗装工程からこ
れに続く加熱乾燥工程への搬送等に適している。 Therefore, it is suitable for transporting chip-shaped electronic parts from the coating process to the subsequent heating and drying process.
さらに従来のマグネツトによる移し替えの場合
のように電子部品が磁化されるようなことがな
く、金属粉が附着したり、脱落する等の事故がな
く、構造も容易である。 Further, unlike in the case of transfer using a conventional magnet, electronic parts are not magnetized, there are no accidents such as metal powder adhering or falling off, and the structure is simple.
第１図は本考案の一実施例を示す電子部品搬送
装置の縦断側面図、第２図は同上平面図、第３図
は同上縦断正面図、第４図は従来の電子部品搬送
装置の縦断側面図である。
Ａ……電子部品、６……レール、７……連結
片。
Fig. 1 is a longitudinal cross-sectional side view of an electronic component transfer device showing an embodiment of the present invention, Fig. 2 is a plan view of the same, Fig. 3 is a longitudinal cross-sectional front view of the same, and Fig. 4 is a longitudinal cross-section of a conventional electronic component transfer device. FIG. A...Electronic component, 6...Rail, 7...Connection piece.
Claims (1)
に連続させる継目位置に少許の間隙を介在させ、
一方のレールより連結片を突出させこの連結片を
他方の案内レールに進退自在に係合させたことを
特徴とする電子部品搬送装置。 A small gap is provided at the joint position where the rail on which electronic components are transported is continuous in the length direction on the top surface.
An electronic component conveying device characterized in that a connecting piece projects from one of the rails and is engaged with the other guide rail in a manner that allows the connecting piece to move forward and backward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014561U JPH0325367Y2 (en) | 1985-02-04 | 1985-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014561U JPH0325367Y2 (en) | 1985-02-04 | 1985-02-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61131810U JPS61131810U (en) | 1986-08-18 |
| JPH0325367Y2 true JPH0325367Y2 (en) | 1991-06-03 |
Family
ID=30499599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985014561U Expired JPH0325367Y2 (en) | 1985-02-04 | 1985-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325367Y2 (en) |
-
1985
- 1985-02-04 JP JP1985014561U patent/JPH0325367Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61131810U (en) | 1986-08-18 |
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