JPH0325260U - - Google Patents
Info
- Publication number
- JPH0325260U JPH0325260U JP1989085822U JP8582289U JPH0325260U JP H0325260 U JPH0325260 U JP H0325260U JP 1989085822 U JP1989085822 U JP 1989085822U JP 8582289 U JP8582289 U JP 8582289U JP H0325260 U JPH0325260 U JP H0325260U
- Authority
- JP
- Japan
- Prior art keywords
- led lamp
- built
- light emitting
- protective resistor
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案の一実施例を示す保護抵抗内蔵
ＬＥＤランプの側断面図、第２図は従来例を示す
ＬＥＤランプの側断面図、第３図は同ＬＥＤラン
プ等のプリント基板への電気的接続を伴う装着状
態を示す一部省略説明図である。 １……ＬＥＤランプ、２……保護抵抗、１１…
…発光ダイオード、１５……側部。
ＬＥＤランプの側断面図、第２図は従来例を示す
ＬＥＤランプの側断面図、第３図は同ＬＥＤラン
プ等のプリント基板への電気的接続を伴う装着状
態を示す一部省略説明図である。 １……ＬＥＤランプ、２……保護抵抗、１１…
…発光ダイオード、１５……側部。
Claims (1)
- 発光ダイオードを内部にそなえ、合成樹脂にて
成形されたＬＥＤランプの成形部分の側部に同発
光ダイオードと直列に電気回路を形成する保護抵
抗を少なくとも一部を露出するように内蔵したこ
とを特徴とする保護抵抗内蔵ＬＥＤランプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085822U JPH0325260U (ja) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085822U JPH0325260U (ja) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325260U true JPH0325260U (ja) | 1991-03-15 |
Family
ID=31635146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085822U Pending JPH0325260U (ja) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325260U (ja) |
-
1989
- 1989-07-21 JP JP1989085822U patent/JPH0325260U/ja active Pending