JPS6413751U - - Google Patents

Info

Publication number
JPS6413751U
JPS6413751U JP1987110395U JP11039587U JPS6413751U JP S6413751 U JPS6413751 U JP S6413751U JP 1987110395 U JP1987110395 U JP 1987110395U JP 11039587 U JP11039587 U JP 11039587U JP S6413751 U JPS6413751 U JP S6413751U
Authority
JP
Japan
Prior art keywords
housing
attached
conductive pattern
transparent resin
substitute
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987110395U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987110395U priority Critical patent/JPS6413751U/ja
Publication of JPS6413751U publication Critical patent/JPS6413751U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第2図及び第3図は同実施
例の正面図及び側面図、第4図は同実施例におけ
るLEDチツプの実装状態を示す正面図、第5図
は第4図の−線断面図、第6図は従来例を示
す一部破断状態の平面図である。 1……ハウジング、1A……反射枠、2……導
電パターン、3……LEDチツプ、4……金線、
5……透明樹脂、6……ワイヤーハーネス、7…
…アウターレンズ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ハウジングの後部内面に所定数の反射枠を一体
    に成形するとともに、所定形状の導電パターンを
    電流制限用抵抗の代用となる抵抗分を含むように
    形成してLEDチツプ、逆電圧保護ダイオードな
    どを装着し、更にLEDチツプの部分を透明樹脂
    でレンズ作用を持つように被覆し、ハウジングの
    前面にアウターレンズを取付けたことを特徴とす
    る灯具。
JP1987110395U 1987-07-17 1987-07-17 Pending JPS6413751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987110395U JPS6413751U (ja) 1987-07-17 1987-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987110395U JPS6413751U (ja) 1987-07-17 1987-07-17

Publications (1)

Publication Number Publication Date
JPS6413751U true JPS6413751U (ja) 1989-01-24

Family

ID=31347513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987110395U Pending JPS6413751U (ja) 1987-07-17 1987-07-17

Country Status (1)

Country Link
JP (1) JPS6413751U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013144915A (ja) * 2011-12-16 2013-07-25 Koei Industry Co Ltd 柱状建築物用作業装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013144915A (ja) * 2011-12-16 2013-07-25 Koei Industry Co Ltd 柱状建築物用作業装置

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