JPH0325244U - - Google Patents

Info

Publication number

JPH0325244U

JPH0325244U JP8668789U JP8668789U JPH0325244U JP H0325244 U JPH0325244 U JP H0325244U JP 8668789 U JP8668789 U JP 8668789U JP 8668789 U JP8668789 U JP 8668789U JP H0325244 U JPH0325244 U JP H0325244U

Authority

JP

Japan

Prior art keywords

sealing body

conductor land

semiconductor device

insulating substrate

solder

Prior art date

1989-07-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 7
• 239000004020 conductor Substances 0.000 claims description 4
• 238000007789 sealing Methods 0.000 claims description 4
• 239000000758 substrate Substances 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 239000013078 crystal Substances 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1

Cited By (2)