JPH03252346A - Beads for ceramic slurry dispersion and method for preparing ceramic slurry - Google Patents
Beads for ceramic slurry dispersion and method for preparing ceramic slurryInfo
- Publication number
- JPH03252346A JPH03252346A JP2045969A JP4596990A JPH03252346A JP H03252346 A JPH03252346 A JP H03252346A JP 2045969 A JP2045969 A JP 2045969A JP 4596990 A JP4596990 A JP 4596990A JP H03252346 A JPH03252346 A JP H03252346A
- Authority
- JP
- Japan
- Prior art keywords
- beads
- ceramic
- ceramic slurry
- slurry
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 62
- 239000011324 bead Substances 0.000 title claims abstract description 54
- 239000002002 slurry Substances 0.000 title claims abstract description 36
- 239000006185 dispersion Substances 0.000 title claims description 13
- 238000000034 method Methods 0.000 title abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 229920001893 acrylonitrile styrene Polymers 0.000 claims abstract description 9
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 239000012535 impurity Substances 0.000 abstract description 4
- 238000011109 contamination Methods 0.000 abstract description 3
- 238000005299 abrasion Methods 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 9
- 229920006026 co-polymeric resin Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910002113 barium titanate Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- -1 alkyl methacrylates Chemical class 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012508 resin bead Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Crushing And Grinding (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミック電子部品を製造する際のセラミッ
ク原料粉末のセラミックスラリ−を得るのに用いるスラ
リー分散用ビーズ及びこれを用Ｇまたセラミックスラリ
−の製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to beads for dispersing slurry used to obtain a ceramic slurry of ceramic raw powder when manufacturing ceramic electronic parts, -Relating to the manufacturing method.
セラミックコンデン号のような電子部品にセラミック体
は広く用いられているが、最近その電気特性を向上する
とともに、そのバラツキを一段と少なくしたものが求め
られている。この特性の向上及びバラツキの減少は、セ
ラミック体の組成を厳密にコントロールすることによっ
て＋＝Ｊ能となる。Ceramic bodies are widely used in electronic components such as ceramic capacitors, but recently there has been a demand for products with improved electrical properties and further reduced variation. This improvement in properties and reduction in variation can be achieved by strictly controlling the composition of the ceramic body.
一般に電子部品用セラミック体は、例えばＢａＴｉＯ３
，５ｒＴｉＪ 等のナタン［［にＴｉＯ２，５ｔｏ２
、Ｂｉ２Ｏ３等の酸化物を水等とともに加え、湿式混合
、分散を行ってセラミックスラリ−を調製し、このスラ
リーを脱水乾燥後仮焼し、所定の金属原子組成比のチタ
ン酸塩とし、この後、水溶性樹脂、アルコール、水等か
らなりその固形分を燃焼可能なバインダーと混合し、成
形した後、バインターを焼失させ、約１２００〜１４０
０℃で本焼成し、焼結体のセラミック体を得る。あるい
は、上記スラリーを脱水乾燥したものを上記バインダー
と混合して造粒し、ついで成形し、徐々に１３５０℃位
まで昇温させてこの温度で焼成し、焼結体のセラミック
体を得る。Generally, ceramic bodies for electronic components are made of BaTiO3, for example.
, 5rTiJ etc.
, Bi2O3 and other oxides are added together with water, wet mixing and dispersion are performed to prepare a ceramic slurry, this slurry is dehydrated and dried and then calcined to form a titanate with a predetermined metal atomic composition ratio. , water-soluble resin, alcohol, water, etc., the solid content is mixed with a combustible binder, molded, the binder is burned out, and the
Main firing is performed at 0° C. to obtain a sintered ceramic body. Alternatively, the dehydrated and dried slurry is mixed with the binder and granulated, then molded, gradually heated to about 1350° C. and fired at this temperature to obtain a sintered ceramic body.
この一連の工程でセラミックスラリ−を調製するときに
、その分散手段のセラミック原料粉末と接触する部分が
摩耗し、その摩耗した材料ができあがったセラミックス
ラリ−中に混入し、最終的に得られるセラミック体の例
えば金属チタン酸塩の金属組成比を当初設計した配合値
と異ならせることが多い。そのため、この分散手段に何
を用いるかは極めて重要なことである。When preparing the ceramic slurry in this series of steps, the part of the dispersion means that comes into contact with the ceramic raw material powder is worn out, and the worn material is mixed into the finished ceramic slurry, resulting in the final ceramic. For example, the metal composition ratio of the metal titanate in the body is often made different from the originally designed composition value. Therefore, what is used as this dispersion means is extremely important.
この分散を行う分散機として古くからボールミルが知ら
れている。これは円筒あるいは球状の容器の中にセラミ
ック原料粉末、水又はその他の分散媒を硬質のボールと
ともに入れ、容器全体を所定時間回転させて、ボール同
士やボールの容器内壁に対する摩擦によりセラミック原
料粉末を粉砕し、水等に分散させようとするものである
。その際、ボールの材質として摩耗し難く、かつ摩耗し
てその材料がセラミックスラリ−に混入しても、得られ
るセラミック体の組成比に影響が少ないものが選択され
る。例えば天然石（シリカを主成分とする）、メノウ石
、アルミナ磁器ボール、５ｉＣ１Ｓｉ３Ｎ４等の非酸化
物ボールが用いられている。A ball mill has long been known as a dispersing machine that performs this dispersion. In this method, ceramic raw material powder, water, or other dispersion medium are placed in a cylindrical or spherical container along with hard balls, and the entire container is rotated for a predetermined period of time, and the ceramic raw material powder is dispersed by friction between the balls and against the inner wall of the container. It is intended to be crushed and dispersed in water, etc. In this case, a material is selected for the ball that is resistant to abrasion, and even if the material is abraded and mixed into the ceramic slurry, it will have little effect on the composition ratio of the resulting ceramic body. For example, non-oxide balls such as natural stone (mainly composed of silica), agate, alumina porcelain balls, and 5iC1Si3N4 are used.
ところが、最近、例えばセラミックコンデンサ等もコン
パクトで高性能のものが求められ、そのためにはセラミ
ック製品もその組織が緻密であることが要求され、セラ
ミックスラリ−を調製する際も分散性の向上が求められ
るとともに生産性を向上させるために、連続生産システ
ムとしてビーズミルを使用することが多くなってきた。However, recently, compact and high-performance products such as ceramic capacitors are required, and for this purpose, ceramic products are also required to have a dense structure, and improved dispersibility is also required when preparing ceramic slurry. Bead mills are increasingly being used as a continuous production system in order to improve production efficiency and productivity.
ビーズミルは、円筒型容器の中に回転板を複数枚離間し
て取付けた回転軸を設け、さらに円筒容器内の空間の５
０〜７０％に直径０．５〜５ｆｉのピースを入れ、これ
にセラミックスラリ−の原料を投入して上記回転軸を高
速回転させ、ビーズ同士の摩擦及びビーズと容器内壁と
の摩擦により分散を行うものである。このビーズミルに
よれば、短時間で分散効率を良くし、高分散性のセラミ
ックスラリ−を連続的に得ることができる。A bead mill has a rotating shaft with multiple rotary plates mounted spaced apart inside a cylindrical container, and furthermore,
A piece with a diameter of 0.5 to 5 fi is placed in 0 to 70%, and the raw material for the ceramic slurry is put into it, and the rotating shaft is rotated at high speed to cause dispersion by friction between the beads and friction between the beads and the inner wall of the container. It is something to do. According to this bead mill, it is possible to improve the dispersion efficiency and continuously obtain a highly dispersible ceramic slurry in a short time.
しかしながら、ビーズミルの高分散性の主な要因である
ビーズ同士の摩擦及びビーズと容器内壁との摩擦は、例
えばアルミナビーズを使用すると、ビーズを摩耗させ、
その摩耗した材料が不純物としてセラミックスラリ−に
混入し、上記した如くセラミック体の組成を変化させる
。これはガラスピーズ、ナタニアビーズを用いてもなお
満足するセラミック体が得られていない。現在、ｙ２ｏ
３部分安定ジルコニアを成分としたジルコニアビーズが
最も耐摩耗性に優れ、使用されるようになってきた。し
かし、これは非常に高価であり、例えばアルミナビーズ
に比較して約５〜ｌＯ倍はコスト高になる。However, the friction between the beads and the friction between the beads and the inner wall of the container, which are the main factors for the high dispersibility of bead mills, causes the beads to wear out when using alumina beads, for example.
The worn material enters the ceramic slurry as an impurity and changes the composition of the ceramic body as described above. Even if glass beads or natania beads are used, a satisfactory ceramic body cannot be obtained. Currently, y2o
Zirconia beads containing three-part stable zirconia have the best wear resistance and have come into use. However, this is very expensive, for example, about 5 to 10 times more expensive than alumina beads.
本発明の目的は、焼結体のセラミック体の組成への不純
物混入の影響を少なくするとともに、安価に提供できる
セラミックスラリ−分散用ビーズ及びこれを用いたセラ
ミックスラリ−の製法を提供することにある。An object of the present invention is to provide beads for dispersing ceramic slurry that can be provided at low cost and that reduce the influence of impurities on the composition of a ceramic body of a sintered body, and to provide a method for manufacturing ceramic slurry using the beads. be.
本発明は、上記課題を解決するために、セラミック原料
をスラリー化する際に用いるスラリー分散用ビーズに分
子量１〜１００万のアクリルニトリル−スチレン共重合
体樹脂にて形成したビーズを含有することを特徴とする
セラミックスラリ−分散用ビーズを提供するものである
。また、このセラミックスラリ−分散用ビーズを用いて
セラミックスラリ−を製造するセラミックスラリ−の製
法を提供するものである。In order to solve the above problems, the present invention includes beads formed of an acrylonitrile-styrene copolymer resin having a molecular weight of 1 to 1 million in the slurry dispersion beads used when slurrying ceramic raw materials. The present invention provides beads for dispersing ceramic slurry. The present invention also provides a method for manufacturing ceramic slurry using the beads for dispersing ceramic slurry.
セラミックスラリ−製造の際にアクリルニトリル−スチ
レン共重合体の樹脂からなるビーズを用いると、このビ
ーズが摩耗してその材料がセラミックスラリ−に混入し
ても有機物であるので後の仮焼あるいは焼成の工程で焼
失され、得られる焼結体のセラミック体の組成に影響を
及ぼさない。When beads made of acrylonitrile-styrene copolymer resin are used in the production of ceramic slurry, even if the beads wear out and the material mixes into the ceramic slurry, it is an organic substance and cannot be used during subsequent calcination or firing. It is burnt out in the process and does not affect the composition of the ceramic body of the resulting sintered body.
〔実施例〕 次に本発明の詳細な説明する。〔Example〕 Next, the present invention will be explained in detail.
実施例１
高純度ＢａＴｉＯ３を主原料としてこのＢａＴｉＯ３１
モルに対し、旧２０３０．００２モル、ＴｉＯ２０，０
０４％ル及び５ｉ０２０．０２モルを正確に秤量し、こ
れに総粉体重量の１．５倍の水を加え、ボールやビーズ
を使用しない攪拌羽根投げ込み型バッチ式混合攪拌機に
より混合（粗分散）を行った。Example 1 This BaTiO31 using high purity BaTiO3 as the main raw material
mole, old 2030.002 mole, TiO20.0
Accurately weigh 0.02 mol of 04% and 0.02 mol of 5i, add 1.5 times the total powder weight of water, and mix (coarse dispersion) using a batch-type mixer with stirring blades that does not use balls or beads. I did it.
次にこの粗分散物をアクリルニトリル−スチレン共重合
体樹脂（分子量４０万）からなるビーズを用いたビーズ
ミルにて下記条件により分散処理を行ってセラミックス
ラリ−を得た。Next, this crude dispersion was subjected to dispersion treatment in a bead mill using beads made of acrylonitrile-styrene copolymer resin (molecular weight: 400,000) under the following conditions to obtain a ceramic slurry.
ビーズミル内容積：５１
ビーズミル回転数：毎分８００回転
ビーズ投入量： ３．５ ｆ
ビーズ径：１．５削
スラリー吐出量：毎分２１
なお、ビーズは熔融状態の樹脂を加圧ノズルより吹き出
し、急冷させる、いわそるスプレー製造方式により成形
した。Bead mill internal volume: 51 Bead mill rotation speed: 800 revolutions per minute Bead input rate: 3.5 f Bead diameter: 1.5 Cutting slurry discharge rate: 21 per minute The beads are made by blowing out molten resin from a pressure nozzle. It was molded using the Iwasoru spray manufacturing method, which involves rapid cooling.
この後通常のセラミック焼成体の製造方法と同様に湿式
篩、脱水乾燥工程を経て、水、ポリビニアルコール樹脂
からなるバインダーと摺潰機等により混合して造粒し、
所定形状に成形後１３５０℃の大気雰囲気のトンネル型
電気炉で約１５時間焼成し、焼結体のＢａＴｉＯ３半導
体セラミック体を製造した。After that, it goes through a wet sieve and dehydration drying process in the same way as the usual manufacturing method of ceramic fired bodies, and is granulated by mixing with water and a binder made of polyvinyl alcohol resin using a crusher, etc.
After molding into a predetermined shape, it was fired in a tunnel-type electric furnace in an air atmosphere at 1350° C. for about 15 hours to produce a sintered BaTiO3 semiconductor ceramic body.
このようにして得られた半導体セラミック体の両面にＩ
ｎ−Ｇａ合金を擦り付けて電極を形成し、測定用試料と
した。この試料について抵抗値を測定（２５℃）し、そ
の比抵抗を算出してその結果を下記表に示す。I on both sides of the semiconductor ceramic body thus obtained
An electrode was formed by rubbing an n-Ga alloy and used as a measurement sample. The resistance value of this sample was measured (25° C.), the specific resistance was calculated, and the results are shown in the table below.
比較例１
実施例１において、ビーズミルを使用する代わりに、通
常、ＢａＴｉＯ３半導体抵抗（ＰＴＣサーミスタ）製造
の際に原料の湿式午後方法として用いられるメノウ玉石
によるボールミルを使用した以外は同様にしてセラミッ
クスラリ−を得た。Comparative Example 1 Ceramic slurry was produced in the same manner as in Example 1, except that instead of using a bead mill, a ball mill using agate boulders, which is usually used as a wet method for raw materials in the production of BaTiO3 semiconductor resistors (PTC thermistors), was used. I got -.
このセラミックスラリ−についても実施例１と同様に処
理してＢａＴｉＯ３半導体セラミック体を製造し、実施
例１と同様に比抵抗を算出しその結果を下表に示す。This ceramic slurry was also treated in the same manner as in Example 1 to produce a BaTiO3 semiconductor ceramic body, and the specific resistance was calculated in the same manner as in Example 1, and the results are shown in the table below.
比較例２〜５
実施例１において、ビーズの材質を下表のそれぞれの欄
に記載されたものを用いた以外は同様にしてセラミック
スラリ−を得、これから実施例１と同様に半導体セラミ
ック体を得、その比抵抗を算出した結果を下表に示す。Comparative Examples 2 to 5 Ceramic slurry was obtained in the same manner as in Example 1, except that the beads were made of materials listed in the respective columns of the table below, and from this a semiconductor ceramic body was made in the same manner as in Example 1. The results of calculating the specific resistance are shown in the table below.
上記表から明らかのように、実施例１のビーズを使用し
たものから得られた半導体セラミック体の比抵抗は他の
ものより小さいことがわかる。これはセラミックスラリ
−の乾燥粉末をバインダーとともに造粒、成形した後焼
成する工程で、ビーズの摩耗した材料がセラミックスラ
リ−に混入していたとしてもバインダーとともに低温帯
（２００〜５００℃）で焼失し、セラミック焼成体に残
留しないため、抵抗値を高めることがないためと考えら
れる。As is clear from the above table, the specific resistance of the semiconductor ceramic body obtained using the beads of Example 1 is smaller than that of the others. This is a process in which the dry powder of ceramic slurry is granulated with a binder, molded, and then fired. Even if the worn beads are mixed into the ceramic slurry, they will be burned out together with the binder at a low temperature (200 to 500°C). However, this is thought to be because it does not remain in the fired ceramic body and therefore does not increase the resistance value.
上記はアクリルニトリル−スチレン共重合体樹脂からな
るビーズを用いたが、メタクリル酸のメチル、エチル、
イソプロピル等のメタクリル酸アルキルの単独重合体又
は２種以上の共重合体、メタクリル酸アルキル、アクリ
ル酸アルキル、アクリル酸等の内２種以上含む共重合体
のアクリル系樹脂からなるビーズを上記アクリルニトリ
ル−スチレン共重合体樹脂のビーズに併用しても良い。In the above, beads made of acrylonitrile-styrene copolymer resin were used, but methyl, ethyl methacrylate,
Beads made of an acrylic resin of a homopolymer or a copolymer of two or more of alkyl methacrylates such as isopropyl, a copolymer containing two or more of alkyl methacrylates, alkyl acrylates, acrylic acid, etc. - It may be used in combination with styrene copolymer resin beads.
また、アクリルニトリル−スチレン共重合体樹脂からな
るビーズあるいは上記アクリル系樹脂のビーズにポリス
チレン樹脂のビーズを併用しても良い。また、これら３
種のビーズを併用しても良い。Furthermore, beads made of acrylonitrile-styrene copolymer resin or beads made of polystyrene resin may be used in combination with the beads made of the above-mentioned acrylic resin. Also, these 3
Seed beads may also be used.
これらの樹脂はその分子量が１〜１００万であることが
好ましい。It is preferable that these resins have a molecular weight of 1 to 1 million.
本発明によれば、アクリルニトリル−スチレン共重合体
樹脂のビーズを含有するビーズを用いてセラミック原料
粉末の分散体であるセラミックスラリ−を得るようにし
たので、このビーズの摩耗した材料がこのスラリーに混
入しても後の焼成工程でこれが焼失し、あとに残らない
のでセラミ・ノ夕焼成体における不純物の混入が少な（
、例えば半導体セラミック体の比抵抗を高くならないよ
うにできるとともに、安定な比抵抗を得ることができる
。また、ジルコニアビーズに比べて安価で、コスト的に
も優れ、その経済効果も大きい。According to the present invention, beads containing acrylonitrile-styrene copolymer resin beads are used to obtain a ceramic slurry, which is a dispersion of ceramic raw material powder, so that the worn material of the beads becomes the slurry. Even if it gets mixed in, it will be burnt off in the later firing process and will not remain behind, so there will be less contamination of impurities in the fired ceramic body (
For example, it is possible to prevent the specific resistance of the semiconductor ceramic body from becoming high, and it is also possible to obtain a stable specific resistance. In addition, it is cheaper than zirconia beads, is superior in terms of cost, and has a large economic effect.
平成２年２月２８日February 28, 1990
Claims (2)
用ビーズに分子量１〜１００万のアクリルニトリル−ス
チレン共重合体にて形成したビーズを含有することを特
徴とするセラミックスラリー分散用ビーズ。(1) Beads for dispersing ceramic slurry, characterized in that the dispersing beads used when slurrying ceramic raw materials contain beads formed of an acrylonitrile-styrene copolymer with a molecular weight of 1 to 1 million.
を用いてセラミックスラリーを製造することを特徴とす
るセラミックスラリーの製法。(2) A method for producing a ceramic slurry, which comprises producing a ceramic slurry using the ceramic slurry dispersion beads according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045969A JPH03252346A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045969A JPH03252346A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03252346A true JPH03252346A (en) | 1991-11-11 |
Family
ID=12734059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2045969A Pending JPH03252346A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03252346A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584547A (en) * | 1978-12-20 | 1980-06-25 | Chuo Kakouki Shoji Kk | Ball of ball mill |
| JPS61168552A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Glass Co Ltd | Wear-resistant crystallized glass bead |
-
1990
- 1990-02-28 JP JP2045969A patent/JPH03252346A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584547A (en) * | 1978-12-20 | 1980-06-25 | Chuo Kakouki Shoji Kk | Ball of ball mill |
| JPS61168552A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Glass Co Ltd | Wear-resistant crystallized glass bead |
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