JPH03252345A - Beads for ceramic slurry dispersion and method for preparing ceramic slurry - Google Patents
Beads for ceramic slurry dispersion and method for preparing ceramic slurryInfo
- Publication number
- JPH03252345A JPH03252345A JP2045968A JP4596890A JPH03252345A JP H03252345 A JPH03252345 A JP H03252345A JP 2045968 A JP2045968 A JP 2045968A JP 4596890 A JP4596890 A JP 4596890A JP H03252345 A JPH03252345 A JP H03252345A
- Authority
- JP
- Japan
- Prior art keywords
- beads
- ceramic
- ceramic slurry
- slurry
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 239000011324 bead Substances 0.000 title claims abstract description 51
- 239000002002 slurry Substances 0.000 title claims abstract description 37
- 239000006185 dispersion Substances 0.000 title claims description 12
- 238000000034 method Methods 0.000 title abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 4
- 238000011109 contamination Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- -1 alkyl methacrylates Chemical class 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Crushing And Grinding (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミック電子部品を製造する際のセラミッ
ク原料粉末のセラミックスラリ−を得るのに用いるスラ
リー分散用ビーズ及びこれを用いたセラミックスラリ−
の製法に関する。Detailed Description of the Invention [Industrial Field of Application] The present invention relates to beads for dispersing slurry used to obtain a ceramic slurry of ceramic raw powder when manufacturing ceramic electronic parts, and a ceramic slurry using the same.
Concerning the manufacturing method.
セラミックコンデンサのような電子部品にセラミンク体
は広く用いられているが、最古その電気特性を向上する
とともに、そのバラツキを一段と少なくしたものが求め
られている。この特性の向上及びバラツキの減少は、セ
ラミ７り体の組成を厳密にコントロールすることによっ
て可能となる。Ceramink bodies are widely used in electronic components such as ceramic capacitors, but for the longest time there has been a demand for products that have improved electrical properties and further reduced variations in their electrical properties. This improvement in properties and reduction in variation can be achieved by strictly controlling the composition of the ceramic body.
一般に電子部品用セラミック体は、例えばＢａＴｉＯ３
，５ｒＴｉ０３ 等のチタン酸塩にＴｉＯ２，５ｉ０
２、Ｂｉ２Ｏ３等の酸化物を水等とともに加え、湿式混
合、分散を行ってセラミックスラリ−を１周製し、この
スラリーを脱水乾燥後仮焼し、所定の金属原子組成比の
チタンＭ塩とし、この後、水溶性樹脂、アルコール、水
等からなりその固形分を燃焼可能なバインダーと混合し
、成形した後、バインダーを焼失させ、約１２００〜１
４００℃で本焼成し、焼結体のセラミック体を得る。あ
るいは、上記スラリーを脱水乾燥したものを上記バイン
ダーと混合して造粒し、ついで成形し、徐々に１３５０
℃位まで昇温させてこの温度で焼成し、焼結体のセラミ
ック体を得る。Generally, ceramic bodies for electronic components are made of BaTiO3, for example.
,5rTi03 and other titanates such as TiO2,5i0
2. Oxides such as Bi2O3 are added together with water, etc., wet mixed and dispersed to make one round of ceramic slurry, and this slurry is dehydrated and dried, then calcined to form a titanium M salt with a predetermined metal atomic composition ratio. After this, the solid content of water-soluble resin, alcohol, water, etc. is mixed with a combustible binder, and after molding, the binder is burned out and the
Main firing is performed at 400° C. to obtain a sintered ceramic body. Alternatively, the above slurry is dehydrated and dried, mixed with the above binder, granulated, then molded, and gradually heated to 1350
The temperature is raised to about 0.degree. C. and fired at this temperature to obtain a sintered ceramic body.
この一連の工程でセラミックスラリ−を調製するときに
、その分散手段のセラミック原料粉末と接触する部分が
摩耗し、その摩耗した材料ができあがったセラミックス
ラリ−中に混入し、最終的に得られるセラミック体の例
えば金属チタン酸塩の金属組成比を当初設計した配合値
と異ならせることが多い。そのため、この分散手段に何
を用いるかは極めて重要なことである。When preparing the ceramic slurry in this series of steps, the part of the dispersion means that comes into contact with the ceramic raw material powder is worn out, and the worn material is mixed into the finished ceramic slurry, resulting in the final ceramic. For example, the metal composition ratio of the metal titanate in the body is often made different from the originally designed composition value. Therefore, what is used as this dispersion means is extremely important.
この分散を行う分散機として古くからボールミルが知ら
れている。これは円筒あるいは球状の容器の中にセラミ
ック原料粉末、水又はその他の分散媒を硬質のボールと
ともに入れ、容器全体を所定時間回転させて、ボール同
士やボールの容器内壁に対する摩擦によりセラミック原
料粉末を粉砕し、水等に分散させようとするものである
。その際、ボールの材質として摩耗し難く、かつ摩耗し
てその材料がセラミックスラリ−に混入しても、得られ
るセラミック体の組成比に影響が少ないものが選択され
る０例えば天然石（シリカを主成分とする）、メノウ石
、アルミナ磁器ボール、５ｉＣ１Ｓ４３Ｎ、４等の非酸
化物ボールが用いられている。A ball mill has long been known as a dispersing machine that performs this dispersion. In this method, ceramic raw material powder, water, or other dispersion medium are placed in a cylindrical or spherical container along with hard balls, and the entire container is rotated for a predetermined period of time, and the ceramic raw material powder is dispersed by friction between the balls and against the inner wall of the container. It is intended to be crushed and dispersed in water, etc. In this case, the material of the ball should be selected to be one that is hard to wear and has little effect on the composition ratio of the ceramic body obtained even if the material is mixed into the ceramic slurry due to wear. For example, natural stone (mainly containing silica) is selected. Non-oxide balls such as agate, alumina porcelain balls, and 5iC1S43N, 4 are used.
ところが、最近、例えばセラミックコンデンサ等もコン
パクトで高性能のものが求められ、そのためにはセラミ
ック製品もその組織が緻密であることが要求され、セラ
ミクスラリ−を調製する際も分散性の向上が求められる
とともに生産性を向上させるために、連続生産システム
としてビーズミルを使用することが多くなってきた。ビ
ーズミルは、円筒型容器の中に回転板を複数枚離間して
取付けた回転軸を設け、さらに円筒容器内の空間の５０
〜７０％に直径０．５〜５■のビーズを入れ、これにセ
ラミックスラリ−の原料を投入して上記回転軸を高速回
転させ、ビーズ同士の摩擦及びビーズと容器内壁との摩
擦により分散を行うものである。このビーズミルによれ
ば、短時間で分散効率を良くし、高分散性のセラミック
スラリ−を連続的に得ることができる。However, recently, compact and high-performance products such as ceramic capacitors are required, and for this purpose, ceramic products are also required to have a dense structure, and improved dispersibility is also required when preparing ceramic slurry. Bead mills are increasingly being used as a continuous production system in order to improve production efficiency and productivity. A bead mill is equipped with a rotating shaft in which a plurality of rotary plates are mounted spaced apart in a cylindrical container, and furthermore, the bead mill has a rotating shaft with a plurality of rotary plates attached at a distance inside a cylindrical container.
Beads with a diameter of 0.5 to 5 cm are placed in ~70%, and the raw materials for the ceramic slurry are added to this, and the rotating shaft is rotated at high speed to cause dispersion by friction between the beads and friction between the beads and the inner wall of the container. It is something to do. According to this bead mill, it is possible to improve the dispersion efficiency and continuously obtain a highly dispersible ceramic slurry in a short time.
しかしながら、ビーズミルの高分散性の主な要因である
ビーズ同士の摩擦及びビーズと容器内壁との摩擦は、例
えばアルミナビーズを使用すると、ビーズを摩耗させ、
その摩耗した材料が不純物としてセラミックスラリ−に
混入し、上記した如くセラミック体の組成を変化させる
。これはガラスピーズ、チタニアビーズを用いてもなお
満足するセラミック体が得られていない。現在、ｖ２０
３部分安定ジルコニアを成分としたジルコニアビーズが
最も耐摩耗性に優れ、使用されるようになってきた。し
かし、これは非常に高価であり、例えばアルミナビーズ
に比較して約５〜ＩＯ倍はコスト高になる。However, the friction between the beads and the friction between the beads and the inner wall of the container, which are the main factors for the high dispersibility of bead mills, causes the beads to wear out when using alumina beads, for example.
The worn material enters the ceramic slurry as an impurity and changes the composition of the ceramic body as described above. Even if glass beads or titania beads are used, a satisfactory ceramic body cannot be obtained. Currently v20
Zirconia beads containing three-part stable zirconia have the best wear resistance and have come into use. However, this is very expensive, for example about 5 to IO times more expensive than alumina beads.
本発明の目的は、焼結体のセラミック体の組成への不純
物混入の影響を少なくするとともに、安価に提供できる
セラミックスラリ−分散用ビーズ及びこれを用いたセラ
ミックスラリ−の製法を提供することにある。An object of the present invention is to provide beads for dispersing ceramic slurry that can be provided at low cost and that reduce the influence of impurities on the composition of a ceramic body of a sintered body, and to provide a method for manufacturing ceramic slurry using the beads. be.
（課題を解決するための手段〕
本発明は、上記課題を解決するために、セラミック原料
をスラリー化する際に用いるスラリー分散用ビーズに分
子量１〜１００万のポリスチレン樹脂にて形成したビー
ズを含有することを特徴とするセラミックスラリ−分散
用ビーズを提供するものである。また、このセラミック
スラリ−分散用ビーズを用いてセラミックスラリ−を製
造するセラミックスラリ−の製法を提供するものである
。(Means for Solving the Problems) In order to solve the above problems, the present invention includes beads formed of polystyrene resin with a molecular weight of 1 to 1 million in slurry dispersion beads used when slurrying ceramic raw materials. The present invention provides beads for dispersing ceramic slurry, which are characterized by the following: A method for producing ceramic slurry using the beads for dispersing ceramic slurry.
セラミックスラリ−製造の際にポリスチレン樹脂からな
るビーズを用いると、このビーズが摩耗してその材料が
セラミックスラリ−に混入しても有機物であるので後の
仮焼あるいは焼成の工程で焼失され、得られる焼結体の
セラミック体の組成に影響を及ぼさない。When beads made of polystyrene resin are used in the production of ceramic slurry, even if the beads are worn out and the material is mixed into the ceramic slurry, it is an organic substance and will be burned out during the subsequent calcination or firing process, resulting in a loss of product. It does not affect the composition of the ceramic body of the sintered body.
（実施例〕 次に本発明の詳細な説明する。(Example〕 Next, the present invention will be explained in detail.
実施例１
高純度ＢａＴｉＯ３を主原料としてこのＢａＴｉＯ３１
モルに対し、Ｂｉ２Ｏ３０，００２モル、ＴｉＯ２０，
００４モル及び５ｉ０２０．０２モルを正確に秤量し、
これに総桧体重量の１．５倍の水を加え、ボールやビー
ズを使用しない攪拌羽根投げ込み型バッチ式混合攪拌機
により混合（粗分散）を行った。Example 1 This BaTiO31 using high purity BaTiO3 as the main raw material
With respect to mole, Bi2O30,002 mole, TiO20,
Accurately weigh 004 mol and 5i020.02 mol,
Water 1.5 times the total weight of the cypress was added thereto, and mixing (coarse dispersion) was performed using a batch-type mixer with stirring blades that does not use balls or beads.
次にこの粗分散物をポリスチレン樹脂（分子量３０万）
からなるビーズを用いたビーズミルにて下記条件により
分散処理を行ってセラミックスラリ−を得た。Next, this crude dispersion was mixed with polystyrene resin (molecular weight 300,000).
A ceramic slurry was obtained by performing dispersion treatment under the following conditions in a bead mill using beads consisting of:
ビーズミル内容ｉｉ１：５４’
ビーズミル回転数：毎分８００回転
ビーズ投入量： ３．５ Ｎ
ビーズ径： １．５ ｍ
スラリー吐出量：毎分２１
なお、ビーズは溶融状態の樹脂を加圧ノズルより吹き出
し、急冷させる、いわそるスプレー製造方式により成形
した。Bead mill contents ii1:54' Bead mill rotation speed: 800 revolutions per minute Bead input amount: 3.5 N Bead diameter: 1.5 m Slurry discharge amount: 21 per minute The beads are made by blowing out molten resin from a pressure nozzle. It was molded using the Iwasoru spray manufacturing method, which involves rapid cooling.
この後通常のセラミック焼成体の製造方法と同様に湿式
篩、脱水乾燥工程を経て、水、ポリビニアルコール樹脂
からなるバインダーと播潰機等により混合して造粒し、
所定形状に成形後１３５０℃の大気雰囲気のトンネル型
電気炉で約１５時間焼成し、焼結体のＢａＴｉＯ３半導
体セラミック体を製造した。After that, it goes through a wet sieve and dehydration drying process in the same way as the usual manufacturing method of ceramic fired bodies, and is mixed with water and a binder made of polyvinyl alcohol resin using a crusher, etc., and granulated.
After molding into a predetermined shape, it was fired in a tunnel-type electric furnace in an air atmosphere at 1350° C. for about 15 hours to produce a sintered BaTiO3 semiconductor ceramic body.
このようにして得られた半導体セラミック体の両面にＩ
ｎ−Ｇａ合金を擦り付けて電極を形成し、測定用試料と
した。この試料について抵抗値を測定（２５℃）し、そ
の比抵抗を算出してその結果を下記表に不１゜
比較例１
実施例１において、ビーズミルを使用する代わりに、通
富、ＢａＴｉＯ３半導体抵抗（ＰＴｃｔ−ミスタ）製造
の際に原料の湿式午後方法として用いられるメノウ玉石
によるホールミルを使用した以外は同様にしてセラミッ
クスラリ−を得た。I on both sides of the semiconductor ceramic body thus obtained
An electrode was formed by rubbing an n-Ga alloy and used as a measurement sample. The resistance value of this sample was measured (at 25°C), the specific resistance was calculated, and the results are shown in the table below. (PTct-Mister) A ceramic slurry was obtained in the same manner except that a hole mill using agate boulders, which is used as a wet method for preparing raw materials, was used in the production.
このセラミックスラリ−についても実施例１と同様に処
理してＢａＴｉＯ３半導体セラミック体を製造し、実施
例１と同様に比抵抗を算出しその結果を下表に示す。This ceramic slurry was also treated in the same manner as in Example 1 to produce a BaTiO3 semiconductor ceramic body, and the specific resistance was calculated in the same manner as in Example 1, and the results are shown in the table below.
比較例２〜５
実施例１において、ビーズの材質を下表のそれぞれの欄
に記載されたものを用いた以外は同様にしてセラミック
スラリ−を得、これから実施例１と同様に半導体セラミ
ック体を得、その比抵抗を算出した結果を下表に示す。Comparative Examples 2 to 5 Ceramic slurry was obtained in the same manner as in Example 1, except that the beads were made of materials listed in the respective columns of the table below, and from this a semiconductor ceramic body was made in the same manner as in Example 1. The results of calculating the specific resistance are shown in the table below.
上記表から明らかのように、実施例１のビーズを使用し
たものから得られた半導体セラミック体の比抵抗は他の
ものより小さいことがわかる。これはセラミックスラリ
−の乾燥粉末をバインダーとともに造粒、成形した後焼
成する工程で、ビーズの摩耗した材料がセラミックスラ
リ−に混入していたとしてもバインダーとともに低温帯
（２００〜５００℃）で焼失し、セラミック焼成体に残
留しないため、抵抗値を高めることがないためと考えら
れる。As is clear from the above table, the specific resistance of the semiconductor ceramic body obtained using the beads of Example 1 is smaller than that of the others. This is a process in which the dry powder of ceramic slurry is granulated with a binder, molded, and then fired. Even if the worn beads are mixed into the ceramic slurry, they will be burned out together with the binder at a low temperature (200 to 500°C). However, this is thought to be because it does not remain in the fired ceramic body and therefore does not increase the resistance value.
上記はポリスチレン樹脂からなるビーズを用いたが、メ
タクリル酸のメチル、エチル、イソプロピル等のメタク
リル酸アルキルエステルの単独重合体又は２種以上の共
重合体、メククリル酸アルキル、アクリル酸アルキル、
アクリル酸等の内の２種以上を含む共重合体のアクリル
系樹脂からなるビーズを併用しても良い。この際アクリ
ル系樹脂の分子量は１〜１００万か好ましい。Although beads made of polystyrene resin were used in the above example, beads made of a homopolymer or a copolymer of two or more of alkyl methacrylates such as methyl, ethyl, and isopropyl methacrylate, alkyl meccrylate, alkyl acrylate,
Beads made of an acrylic resin, a copolymer containing two or more of acrylic acids, etc., may be used in combination. At this time, the molecular weight of the acrylic resin is preferably 1 to 1 million.
本発明によれば、ポリスチレン樹脂のビーズを含有する
ビーズを用いてセラミック原料粉末の分散体であるセラ
ミックスラリ−を得るようにしたので、このビーズの摩
耗した材料がこのスラリーに混入しても後の焼成工程で
これが焼失し、あとに残らないのでセラミック焼成体に
おける不純物の混入が少なく、例えば半導体セラミック
体の比抵抗を高くならないようにできるとともに、安定
な比抵抗を得ることができる。また、ジルコニアビーズ
に比べて安価で、コスト的にも優れ、その経済効果も大
きい。According to the present invention, beads containing polystyrene resin beads are used to obtain a ceramic slurry, which is a dispersion of ceramic raw powder, so that even if worn material from the beads gets mixed into the slurry, This is burnt out in the firing process and does not remain behind, so there is less contamination of impurities in the fired ceramic body, and for example, the specific resistance of the semiconductor ceramic body can be prevented from becoming high, and a stable resistivity can be obtained. In addition, it is cheaper than zirconia beads, is superior in terms of cost, and has a large economic effect.
Claims (2)
用ビーズに分子量１〜１００万のポリスチレン樹脂にて
形成したビーズを含有することを特徴とするセラミック
スラリー分散用ビーズ。(1) Beads for dispersing ceramic slurry, characterized in that the dispersing beads used when slurryizing ceramic raw materials contain beads made of polystyrene resin with a molecular weight of 1 to 1 million.
を用いてセラミックスラリーを製造することを特徴とす
るセラミックスラリーの製法。(2) A method for producing a ceramic slurry, which comprises producing a ceramic slurry using the ceramic slurry dispersion beads according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045968A JPH03252345A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045968A JPH03252345A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03252345A true JPH03252345A (en) | 1991-11-11 |
Family
ID=12734032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2045968A Pending JPH03252345A (en) | 1990-02-28 | 1990-02-28 | Beads for ceramic slurry dispersion and method for preparing ceramic slurry |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03252345A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584547A (en) * | 1978-12-20 | 1980-06-25 | Chuo Kakouki Shoji Kk | Ball of ball mill |
| JPS61168552A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Glass Co Ltd | Wear-resistant crystallized glass bead |
-
1990
- 1990-02-28 JP JP2045968A patent/JPH03252345A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584547A (en) * | 1978-12-20 | 1980-06-25 | Chuo Kakouki Shoji Kk | Ball of ball mill |
| JPS61168552A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Glass Co Ltd | Wear-resistant crystallized glass bead |
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