JPH0324602Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a plating device that performs plating by running a steel strip between electrodes.

[Conventional technology]

There are two types of electroplating devices: plating devices using insoluble electrodes and plating devices using soluble electrodes. In plating equipment using insoluble electrodes,
The distance between the electrode plate and the steel strip was changed depending on the threading of the weld and the quality of the threading material. As this device, Japanese Patent Publication No. 15996/1983 has been proposed.

In this device, electrode plates are fixed to an upper frame and a lower frame to prevent the plating liquid from leaking, and fluid pressure seals are arranged at the ends of the upper frame and the lower frame. By flowing fluid into and out of this fluid pressurized seal, the upper frame and lower frame are moved to adjust the distance between the poles.

Furthermore, in a plating device using a soluble electrode, the electrode plate is moved toward the steel strip as the soluble electrode wears out. As an example of this, Japanese Patent Application Laid-Open No. 133131/1984 has been proposed. In this device, an energizing bar was installed in the metalworks, an electrode plate was suspended from the energizing bar, and the distance between the electrode plates was adjusted by moving the energizing bar.

[Problem that the invention attempts to solve]

In a plating device using insoluble electrode plates, upper and lower frames constitute the plating tank body, an edge mask is disposed in the width direction, and the edge mask is held between the upper and lower frames. Because of this configuration, if a steel strip with a poor shape is traveling, the steel strip will come into direct contact with the electrode plate, causing flaws or damage to the electrode plate. Furthermore, if the distance between the electrodes is increased to avoid contact, sufficient plating will not be possible, which will adversely affect the finished product. Furthermore, if the distance between the poles is increased, the edge mask is sandwiched between the upper and lower frames, so a gap is created between the frame and the edge mask, making it impossible to hold the edge mask. Furthermore, when the distance between the poles is increased, the gap between the input and output sides also increases, and the plating liquid sealed in the gap between the poles enters and flows out from the output side, making the threading of the steel strip unstable.

In addition, in plating equipment using soluble electrodes, multiple electrode plates are suspended on current-carrying bars, so there is no frame to cover the electrode plates, and the plating liquid cannot be held between the electrodes. Therefore, the steel strip cannot be held. Therefore, the steel strip runs unstable and the distance between the poles cannot be reduced.

[Means for solving problems]

The present invention solves the above-mentioned problems and is a plating device having the following requirements.

Electrode plate 8 divided into single or plural parts in the plating tank
are placed facing each other.

A plating liquid supply port 9 through which a plating liquid flows between the electrode plates 8 is provided at a predetermined position.

Plating tank wall, plating liquid supply port 9 and electrode plate 8
A flexible object 7 connects the periphery of the .

An adjustment mechanism 4 that moves the electrode plate 8 independently or in conjunction with the electrode plate 8 is provided.

[Effect]

A plating solution flows from a plating supply port 9 between electrode plates 8 disposed oppositely in the plating tank. A steel strip 1 is then run between the electrode plates 8. The plating tank wall and the electrode plate 8 and the electrode plate 8 and the plating liquid supply port 9 are connected by a flexible object 7. This prevents the plating liquid supplied between the electrode plates 8 from leaking.

Next, an adjustment mechanism 4 for moving and adjusting the electrode plate 8 is provided on the electrode plate 8. By this adjustment mechanism 4, the electrode plate 8
Adjust the distance between them.

〔Example〕

FIG. 1 is a side view of an embodiment of the device applied to a horizontal plating device using an insoluble electrode, and FIG. 2 is a side view of another embodiment of the device in which the present invention is applied to a vertical plating device.

In FIG. 1, the electrode plate 8 is divided into two parts in the horizontal direction and disposed vertically to face each other. steel strip 1
travels between the opposing electrode plates 8. One plating liquid supply port 9 is provided at each of the upper and lower parts of the divided portion of the electrode plate 9. A plating liquid supply pipe 10 is connected to the supply port 9.

The supplied plating liquid is discharged from the inlet 12 and outlet 13 of the steel strip 1. The electrode plate 8 is held by an electrode holding plate 5, and the electrode holding plate 5 is moved up and down by the adjustment mechanism 4.

The adjustment mechanism 4 employs a cylinder. This cylinder is arranged on each divided electrode plate 8,
These cylinders are operated individually or in conjunction with each other.

A high pressure is created between the electrode plates 8 due to the supplied plating liquid. Therefore, in order to prevent the plating liquid from leaking, the plating tank 11 wall and the electrode holding plate 5 and the electrode holding plate 5 are
A bellows 7 is provided between the plating liquid supply port 9 and the plating liquid supply port 9, and the bellows 7 prevents the plating liquid from leaking.

The adjustment mechanism 4 described above for adjusting the distance between the electrode plates 8
Adjust by operating. At this time, since the electrode holding plate 5 and the plating liquid supply port 9 and the electrode holding plate 5 and the wall of the plating tank 11 are connected by the bellows 7, only the electrode plate 8 held by the electrode holding plate 5 moves. The gap between the inlet 12 and the outlet 13 remains unchanged. Therefore, the pressure between the electrode plates 8 is also kept constant, and the steel strip 1 can run stably. Further, since the plating tank 11 wall also protects the electrode plate 8, even if a steel strip 1 with a poor shape enters, the protection plate prevents the steel strip 1 from coming into contact with the electrode plate 8 and causing flaws or damage.

FIG. 2 is an explanatory diagram of an embodiment of the present invention applied to a vertical plating device.

FIG. 3 is a diagram showing an example in which the present invention is applied to a conventional consumable electrode plating tank. The rod-shaped electrode plate 8 is held by an electrode holding plate 5. The electrode holding plate 5 can be moved up and down by the adjustment mechanism 4 connected to it, thereby adjusting the distance between the electrode plates 8. .
When the electrode plates 8 are worn out, the electrode plates 8 are sequentially moved, the old electrode plates 8 are removed, and new electrode plates 8 are supplied to replace the electrode plates 8.

[Effect of idea]

As described above, in the device of the present invention, only the electrode plates are moved during adjustment between the electrode plates, so the pressure between the electrode plates does not fluctuate, so the steel strip can be held stably. Furthermore, even if a steel strip with a poor shape enters, the protection plate on the plating tank wall prevents it from coming into contact with the electrode plate, and there is no occurrence of flaws or damage.

Furthermore, since the steel strip runs stably, the distance between the electrode plates can be reduced, and the plating efficiency is also improved.
In this way, the practical effects are very large.

[Brief explanation of the drawing]

Fig. 1 is a side view of an example in which the present invention is applied to a horizontal plating device, Fig. 2 is a side view of an example in which the present invention is applied to a vertical plating device, and Fig. 3 is a plating device using a conventional soluble electrode. FIG. 2 is an explanatory diagram of an embodiment to which the present invention is applied. DESCRIPTION OF SYMBOLS 1... Steel strip, 2... Current roll, 3... Rubber roll, 4... Adjustment mechanism, 5... Electrode holding plate, 6...
...Adjustment mechanism, 7... Flexible object, 8... Electrode plate,
9...Plating liquid supply port, 10...Plating liquid supply pipe, 11...Plating tank, 12...Inlet, 13...
…Vent.

Claims (1)

[Claims for Utility Model Registration] In a plating device in which opposing electrode plates 8 are disposed in a plating tank and a steel strip 1 is run between the electrode plates 8 to perform plating, the electrode plates 8 are arranged singly or A plating liquid supply port 9 that is divided into a plurality of parts and supplies plating liquid between the electrode plates 8.
is arranged at a predetermined position, the plating tank wall 11 and the plating liquid supply port 9 are connected to the periphery of the electrode plate 8 by a flexible object 7, and the electrode plate 8 is adjusted independently or in conjunction with each other. A movable electrode plating device characterized by comprising an adjustment mechanism 4.