JPH03239339A - Semiconductor package - Google Patents

Abstract

PURPOSE:To recognize the temperature change of a semiconductor package by heat generated by an integrated circuit and to simply execute a temperature- measuring operation by a method wherein a substance whose color is changed by a temperature change is applied or pasted in an arbitrary part on the surface. CONSTITUTION:A substance 2 whose color is changed by a temperature is applied or pasted on the surface of a package 1 in order to confirm heat generated by an integrated circuit which has been housed at the inside of the package 1. That is to say, when the discoloration of the temperature-sensing part 2 is confirmed in advance by the correspondence between a discolored color and a temperature, it is possible to visually confirm, at its inside, by means of the discoloration, abnormal heat on the surface of the package and the integrated circuit which has been housed. Thereby, it is possible to simply recognize a temperature on the surface of the package.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor package that houses an integrated circuit, and in particular provides a method for protecting an integrated circuit that is susceptible to failure due to high temperatures.

[Conventional technology]

In recent years, as devices have become more dense and faster, power consumption has increased and heat generation in integrated circuits has become a problem. Furthermore, in addition to heat generated by normal power consumption, heat generated by excessive current, etc., often induces defects due to thermal stress in addition to the defects themselves. For this reason, temperature analysis has become important for integrated circuit boards on which such devices are mounted. was measuring.

[Problem to be solved by the invention]

Conventional semiconductor packages have been configured as described above, but there has been a problem in that an expensive system such as an infrared camera is required to measure the temperature on the integrated circuit board.

This invention was made to solve the above-mentioned problems, and allows for easy temperature measurement without the need for a system using an infrared camera or the like in order to recognize temperature changes in semiconductor packages due to heat generation in integrated circuits. The purpose is to do something.

[Means to solve the problem]

In the semiconductor package according to the present invention, heat generation of the package, that is, the integrated circuit housed inside the package, can be confirmed by applying or pasting a substance that changes color depending on temperature on the package surface.

[Effect]

In this invention, the substance that changes color due to humidity in the semiconductor package can be used to detect discoloration of the temperature sensing part by confirming the correspondence between the color change and the temperature in advance. Heat generation can be visually confirmed. [Example] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.0 Fig. 1 is a plan view of a semiconductor package according to an embodiment of the present invention.

That is, in package (1) shown in the figure,
For example, when mounted on a board such as the top of the package (1), a round temperature sensing part (2
), and this temperature sensing part is coated with a substance that changes color depending on the temperature, such as liquid crystal. Figure 2 shows another embodiment of the present invention. Square humidity sensor on top (2)
is attached.

Also, if the humidity on the surface of the package (1) exceeds the variable range of the substance (2) that changes color depending on temperature,
A heat-reducing material such as a heat insulating material may be interposed between the temperature sensing portion (2) on the surface of the package (1) and a substance such as a liquid crystal that changes color.

〔Effect of the invention〕

As described above, according to the present invention, the temperature of the package surface can be recognized by the liquid crystal coated or pasted on the temperature sensing part of the package surface, and if a plurality of such packages are mounted on a board, the hot temperature distribution on the board can be detected. can be visually recognized to some extent, and it is also possible to predict defects due to heat generation itself due to excessive current in the integrated circuit housed inside, as well as defects induced by thermal stress due to heat generation, and it is possible to replace defective devices. Become.

[Brief explanation of drawings]

FIG. 1 is a plan view of a semiconductor pancake according to one embodiment of the invention, and FIG. 2 is a plan view showing another embodiment of the invention. In the figure, (1)...Package, (2)...A button which is a temperature sensing section. In the figure, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. A semiconductor package that is characterized in that a substance that changes color due to temperature changes is coated or pasted on any part of the surface of the semiconductor package that houses an integrated circuit.