JPH0323928U - - Google Patents

Info

Publication number
JPH0323928U
JPH0323928U JP1989085569U JP8556989U JPH0323928U JP H0323928 U JPH0323928 U JP H0323928U JP 1989085569 U JP1989085569 U JP 1989085569U JP 8556989 U JP8556989 U JP 8556989U JP H0323928 U JPH0323928 U JP H0323928U
Authority
JP
Japan
Prior art keywords
protruding electrode
electrode portion
protruding
integrated circuit
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989085569U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989085569U priority Critical patent/JPH0323928U/ja
Publication of JPH0323928U publication Critical patent/JPH0323928U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1989085569U 1989-07-19 1989-07-19 Pending JPH0323928U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085569U JPH0323928U (fr) 1989-07-19 1989-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085569U JPH0323928U (fr) 1989-07-19 1989-07-19

Publications (1)

Publication Number Publication Date
JPH0323928U true JPH0323928U (fr) 1991-03-12

Family

ID=31634780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085569U Pending JPH0323928U (fr) 1989-07-19 1989-07-19

Country Status (1)

Country Link
JP (1) JPH0323928U (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156820A (ja) * 2004-11-30 2006-06-15 Toshiba Corp 回路基板
US8384213B2 (en) 1996-12-04 2013-02-26 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
JP2014093339A (ja) * 2012-11-01 2014-05-19 Nippon Telegr & Teleph Corp <Ntt> 実装方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8384213B2 (en) 1996-12-04 2013-02-26 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
JP2006156820A (ja) * 2004-11-30 2006-06-15 Toshiba Corp 回路基板
JP4664657B2 (ja) * 2004-11-30 2011-04-06 株式会社東芝 回路基板
JP2014093339A (ja) * 2012-11-01 2014-05-19 Nippon Telegr & Teleph Corp <Ntt> 実装方法

Similar Documents

Publication Publication Date Title
JPS6413129U (fr)
JPH0323928U (fr)
JPH0363217U (fr)
JPH033752U (fr)
JPH044747U (fr)
JPH0348230U (fr)
JPH022835U (fr)
JPS622259U (fr)
JPS6437048U (fr)
JPS6327096U (fr)
JPS6280671U (fr)
JPH02136321U (fr)
JPS6429885U (fr)
JPS6359344U (fr)
JPS6447038U (fr)
JPH02101551U (fr)
JPH0279055U (fr)
JPH03115407U (fr)
JPH0254234U (fr)
JPS60174254U (ja) 電力用半導体装置
JPS63124742U (fr)
JPS61149334U (fr)
JPS6289157U (fr)
JPS6451305U (fr)
JPS63193836U (fr)