JPH03238195A - Flux composition - Google Patents
Flux compositionInfo
- Publication number
- JPH03238195A JPH03238195A JP3393190A JP3393190A JPH03238195A JP H03238195 A JPH03238195 A JP H03238195A JP 3393190 A JP3393190 A JP 3393190A JP 3393190 A JP3393190 A JP 3393190A JP H03238195 A JPH03238195 A JP H03238195A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- flux
- flux composition
- formula
- corrosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 22
- 239000000203 mixture Substances 0.000 title claims description 18
- 238000005260 corrosion Methods 0.000 claims abstract description 21
- 230000007797 corrosion Effects 0.000 claims abstract description 21
- 239000012964 benzotriazole Substances 0.000 claims abstract description 10
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 125000003277 amino group Chemical group 0.000 claims abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 3
- -1 benzotriazole compound Chemical class 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 8
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000012190 activator Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- ITLDHFORLZTRJI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-5-octoxyphenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1N1N=C2C=CC=CC2=N1 ITLDHFORLZTRJI-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明はハンダ付けに用いられるフラックス組成物に
関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a flux composition used for soldering.
〈従来の技術〉
ハンダ付けに用いられるフラックス組成物は、−膜内に
ロジン、アミン塩酸塩、臭化水素酸塩、有機酸等の活性
剤を含んでいる。<Prior Art> Flux compositions used for soldering contain an activator such as rosin, amine hydrochloride, hydrobromide, organic acid, etc. within the film.
〈発明が解決しようとする課題〉
ところが、このような活性材はハンダ付けの一般的母材
である銅と錯化し、緑色の腐食生成物を発生させてしま
うことがある。つまり、ハンダ付は後に母材上に残った
フラックス組成物の残渣を洗浄により完全に除去しない
と、残ったフラックス組成物が母材と錯化を起こして腐
食生成物を発生させてしまうものである。この腐食生成
物の発生は、高温・高湿下において特に顕著に行われる
。<Problems to be Solved by the Invention> However, such active materials may complex with copper, which is a common base material for soldering, and generate green corrosion products. In other words, if the flux composition residue left on the base material is not completely removed by cleaning after soldering, the remaining flux composition will complex with the base material and generate corrosion products. be. The generation of this corrosion product is particularly noticeable under high temperature and high humidity conditions.
そして、このようにして発生される腐食生成物は電子部
品等の信頼性に重大な悪影響を与えるために、品質管理
上、ハンダ付は処理工程の後に、フラックス組成物の十
分で確実な洗浄工程がどうしても必要となり、ハンダ付
けの全体的作業工程が大変面倒となっていた。Since the corrosion products generated in this way have a serious negative impact on the reliability of electronic parts, etc., for quality control reasons, the soldering process must be followed by a thorough and reliable cleaning process of the flux composition. was absolutely necessary, making the entire soldering process extremely troublesome.
この発明はこのような従来の技術に着目してなされたも
のであり、母材と反応して腐食生成物を発生せず、ハン
ダ付は処理後に洗浄工程を行わずに済むフラックス組成
物を提供せんとするものである。The present invention has been made by focusing on such conventional technology, and provides a flux composition that does not react with the base material and generate corrosion products, and does not require a cleaning process after soldering. This is what I am trying to do.
く課題を解決するための手段〉
この発明に係るフラックス組成物は、上記の目的を達成
するために、下記一般式で示されるベンゾトリアゾール
化合物を、腐食抑制剤として０゜１〜１．０ｗｔ％含む
ものである。Means for Solving the Problems> In order to achieve the above objects, the flux composition according to the present invention contains a benzotriazole compound represented by the following general formula as a corrosion inhibitor in an amount of 0.1 to 1.0 wt%. It includes.
２ Ｒ
Ｒ１
ここで、Ｒ２−Ｒ５は、水素原子、ハロゲン原子、アミ
ノ基、水酸基、アルキル基、フェニル基のいずれかを示
している。2 R R1 Here, R2-R5 represents any one of a hydrogen atom, a halogen atom, an amino group, a hydroxyl group, an alkyl group, and a phenyl group.
また、ベンゾトリアゾール化合物としては、■１、 ２
． ３−ベンゾトリアゾール、■ｌ−ヒドロキシベンゾ
トリアゾール、■５クロロベンゾトリアゾール、■２−
（２’−ヒドロキシ−５′−メチルフェニル）ベンゾト
リアゾール５−５４４、■２−（２′−ヒドロキシ−５
’ −ｔｅｒｔ−ブチルフェニル）ベンゾトリアゾール
５−３６０６、■２−（２’−ヒドロキシ−３’、５’
−ジーｔｅｒｔ−プチルフェニル）ベンゾトリアゾール
５−３５８０、■２−（２’ −ヒドロキシ−３’ −
ｔｅｒｔブチル−５′−メチルフェニル）−５−クロロ
ベンゾトリアゾール５−５４５、■２−（２’−ヒドロ
キシ−３’、５’ −ジーｔｅｒｔ−ブチルフェニル）
−５−クロロベンゾトリアゾール５−３５８１、■２−
（２’−ヒドロキシ−３’、５’ −ジｔｅｒｔ−ア
ミルフェニル）ベンゾトリアゾール５３６０４、［相］
２−（２’−ヒドロキシ−４′オクトキシフエニル）ベ
ンゾトリアゾール５−５４８などが好適である。In addition, as benzotriazole compounds, ■1, 2
．． 3-benzotriazole, ■l-hydroxybenzotriazole, ■5chlorobenzotriazole, ■2-
(2'-hydroxy-5'-methylphenyl)benzotriazole 5-544, ■2-(2'-hydroxy-5
'-tert-butylphenyl)benzotriazole 5-3606, ■2-(2'-hydroxy-3', 5'
-di-tert-butylphenyl)benzotriazole 5-3580, ■2-(2'-hydroxy-3'-
tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole 5-545, ■2-(2'-hydroxy-3',5'-di-tert-butylphenyl)
-5-chlorobenzotriazole 5-3581, ■2-
(2'-hydroxy-3',5'-di-tert-amylphenyl)benzotriazole 53604, [phase]
2-(2'-hydroxy-4'octoxyphenyl)benzotriazole 5-548 and the like are preferred.
また、このベンゾトリアゾール化合物のフラックス組成
物中における含有量としては、０．１〜１゜０ｗｔ％が
好ましく、０．１ｗｔ％より少ないと腐食抑制効果が充
分でなく、また１、０ｗｔ％より多いとハンダ付は性が
阻害されてしまい実用的でない。Further, the content of this benzotriazole compound in the flux composition is preferably 0.1 to 1.0 wt%, and if it is less than 0.1 wt%, the corrosion inhibiting effect will not be sufficient, and if it is more than 1.0 wt%. Soldering is impractical as it inhibits functionality.
〈作 用〉
この発明のベンゾトリアゾール化合物は、腐食生成物の
発生を抑制する腐食抑制剤として機能する。このベンゾ
トリアゾール化合物は、母材である銅表面において、ロ
ジンや有機酸などの活性剤よりも優先的に錯体を形成し
、無色の錯化物となる。これにより、前記活性剤が緑色
の腐食生成物を形威しなくなる。従って、ハンダ付は工
程後にフラックス組成物残渣の洗浄工程を設ける必要が
なくなるため、作業性及びコストの点で有利となる。<Function> The benzotriazole compound of the present invention functions as a corrosion inhibitor that suppresses the generation of corrosion products. This benzotriazole compound forms a complex on the copper surface, which is the base material, more preferentially than an activator such as rosin or an organic acid, and becomes a colorless complex. This prevents the activator from producing green corrosion products. Therefore, soldering eliminates the need for a cleaning step for flux composition residue after the soldering process, which is advantageous in terms of workability and cost.
く実 施 例〉
本発明に係るベンゾトリアゾール化合物を腐食抑制剤と
して含んだフラックス組成物（Ｎｏ、１〜３）と、それ
以外の腐食抑制剤を含んだ比較例としてのフラックス組
成物（Ｎｏ、４〜８）をつくり、銅板腐食試験と、ハン
ダ広がり率の評価を行った結果を第１表に示した。Examples Flux compositions containing the benzotriazole compound according to the present invention as a corrosion inhibitor (Nos. 1 to 3) and flux compositions as comparative examples containing other corrosion inhibitors (Nos. 1 to 3) 4 to 8) were made, and the copper plate corrosion test and solder spread rate evaluation were performed. The results are shown in Table 1.
ここで、「銅板腐食試験」とは、ＪＩＳ Ｚ３１９７−
１９８６６、６．１に規定される試験方法によるもので
あり、比較試験片と比較して腐食のないものを「合格」
とし、それ以外を「不合格」と評価している。Here, "copper plate corrosion test" is JIS Z3197-
It is based on the test method specified in 19866, 6.1, and a specimen with no corrosion compared to a comparative test piece is considered to be "passed".
The rest are rated as "fail".
本発明に係るフラックス組成物は第１表の通り全て「合
格」であった。All of the flux compositions according to the present invention were "passed" as shown in Table 1.
また、ハンダ広がり率とは、ＪＩＳ Ｚ３１９７−１９
８６６．１０ に規定される広がり試験に基づいて測
定されたものであり、本発明に係るフラックス組成物も
比較例と同様に高いハンダ広がり率を示しており、腐食
抑制効果と共にハンダ付は性にも効果が期待できるもの
であった。Also, solder spread rate is JIS Z3197-19
866.10, and the flux composition according to the present invention also showed a high solder spreading rate as well as the comparative example, and it showed that the flux composition according to the present invention had a high solder spreading rate as well as a corrosion inhibiting effect. The results were also expected to be effective.
尚、以上の説明において、母料として銅を代表して説明
したが、本発明のフラックス組成物は、銅以外の鉛、錫
、ハンダ、４２合金等にも同様に適用できるものである
。In the above description, copper was used as a representative base material, but the flux composition of the present invention can be similarly applied to lead, tin, solder, 42 alloy, etc. other than copper.
〈発明の効果〉
この発明に係るフラックス組成物は、以上説明してきた
ように、母材と反応して腐食生成物を発生しないので、
ハンダ付は処理後に洗浄工程を行わずに済むため、ハン
ダ付は作業の全体的作業性の向上とコストダウンを図る
ことができ、その工業的価値は極めて高い。<Effects of the Invention> As explained above, the flux composition according to the present invention does not react with the base material and generate corrosion products.
Since soldering does not require a cleaning process after processing, soldering can improve the overall workability and reduce costs, and its industrial value is extremely high.
Claims (1)
食抑制剤として０．１〜１．０ｗｔ％含むフラックス組
成物。 ▲数式、化学式、表等があります▼ 〔式中、Ｒ＿１〜Ｒ＿５は、水素原子、ハロゲン原子、
アミノ基、水酸基、アルキル基、フェニル基のいずれか
を示す。〕[Scope of Claims] A flux composition containing 0.1 to 1.0 wt% of a benzotriazole compound represented by the following general formula as a corrosion inhibitor. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the formula, R_1 to R_5 are hydrogen atoms, halogen atoms,
Indicates an amino group, a hydroxyl group, an alkyl group, or a phenyl group. ]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3393190A JPH03238195A (en) | 1990-02-16 | 1990-02-16 | Flux composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3393190A JPH03238195A (en) | 1990-02-16 | 1990-02-16 | Flux composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03238195A true JPH03238195A (en) | 1991-10-23 |
Family
ID=12400262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3393190A Pending JPH03238195A (en) | 1990-02-16 | 1990-02-16 | Flux composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03238195A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0595343A2 (en) * | 1992-10-30 | 1994-05-04 | Showa Denko Kabushiki Kaisha | Method of forming solder film |
| WO1999048146A1 (en) * | 1998-03-17 | 1999-09-23 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
| JP2007158310A (en) * | 2005-11-02 | 2007-06-21 | Natl Starch & Chem Investment Holding Corp | Fluxing composition including benzotriazoles |
| WO2023063160A1 (en) * | 2021-10-12 | 2023-04-20 | 千住金属工業株式会社 | Flux and solder paste |
-
1990
- 1990-02-16 JP JP3393190A patent/JPH03238195A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0595343A2 (en) * | 1992-10-30 | 1994-05-04 | Showa Denko Kabushiki Kaisha | Method of forming solder film |
| EP0595343A3 (en) * | 1992-10-30 | 1994-06-08 | Showa Denko Kk | Method of forming solder film |
| WO1999048146A1 (en) * | 1998-03-17 | 1999-09-23 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
| US6103549A (en) * | 1998-03-17 | 2000-08-15 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
| JP2007158310A (en) * | 2005-11-02 | 2007-06-21 | Natl Starch & Chem Investment Holding Corp | Fluxing composition including benzotriazoles |
| WO2023063160A1 (en) * | 2021-10-12 | 2023-04-20 | 千住金属工業株式会社 | Flux and solder paste |
| JP2023057688A (en) * | 2021-10-12 | 2023-04-24 | 千住金属工業株式会社 | flux and solder paste |
| CN118176083A (en) * | 2021-10-12 | 2024-06-11 | 千住金属工业株式会社 | Soldering flux and soldering paste |
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