JPH0323634B2 - - Google Patents
Info
- Publication number
- JPH0323634B2 JPH0323634B2 JP59210996A JP21099684A JPH0323634B2 JP H0323634 B2 JPH0323634 B2 JP H0323634B2 JP 59210996 A JP59210996 A JP 59210996A JP 21099684 A JP21099684 A JP 21099684A JP H0323634 B2 JPH0323634 B2 JP H0323634B2
- Authority
- JP
- Japan
- Prior art keywords
- bath
- copper plating
- dipyridyl
- chemical copper
- tensile strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21099684A JPS6187876A (ja) | 1984-10-08 | 1984-10-08 | 化学銅めつき浴 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21099684A JPS6187876A (ja) | 1984-10-08 | 1984-10-08 | 化学銅めつき浴 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6187876A JPS6187876A (ja) | 1986-05-06 |
| JPH0323634B2 true JPH0323634B2 (https=) | 1991-03-29 |
Family
ID=16598597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21099684A Granted JPS6187876A (ja) | 1984-10-08 | 1984-10-08 | 化学銅めつき浴 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6187876A (https=) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610666B2 (https=) * | 1973-05-15 | 1981-03-10 |
-
1984
- 1984-10-08 JP JP21099684A patent/JPS6187876A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6187876A (ja) | 1986-05-06 |
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| JPH0323634B2 (https=) |