JPH03223865A - Resist material - Google Patents

Abstract

PURPOSE:To enhance light transmittance, heat resistance, and solution stability by forming a resist material with a heat-resistant resin composed of constituents each having a functional group chemically changeable and solubilizable in alkali by heating and constituents each imparting heat resistance to the resin, and a specified photosensitive compound. CONSTITUTION:The resist material comprises the heat-resistant resin composed of the constituents each having the functional group chemically changeable and solubilizable in alkali by heating under an atmosphere containing an acid and the constituent for imparting heat resistance to the resin, and the photosensitive material for generating the acid by exposure to light and represented by formula I, and a solvent for capable of dissolving both, and in formula I, each of Ro<1> - Ro<4> is H, halogen, 1 - 10 C straight, branched, or cyclic alkyl, 1 - 10 C haloalkyl, or the like, independent from each other, thus permitting light transmittance, heat resistance,a nd solution stability to be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resist material used in manufacturing semiconductor devices and the like. For details, see 400 yen as an exposure energy source.
nm Current light source, for example, 365 nm single line light.

Far ultraviolet light of 300 nm or less, for example 24L4 nm Kr
The present invention relates to a resist material for forming a positive pattern using F excimer laser light or the like.

[Prior Art] In recent years, with the high density integration of semiconductor devices, the light source of exposure equipment used for microfabrication, particularly photolithography, has become increasingly shorter in wavelength, and now KrF excimer laser (
248,4 nm) light is now being considered. However, a resist material suitable for this wavelength has not yet been found.

For example, MP2400 (
When using Sibley Co., Ltd.), the pattern shape after development is very poor due to the large surface absorption of the base polymer Novolank resin itself to the exposure light and the poor photoreactivity of the naphthoquinone diazide compound as the photosensitive agent. Can not.

In addition, resist materials have been developed that use KrF excimer laser light or far ultraviolet light as a light source. (
For example, JP-A-64-80944; JP-A-115
No. 4048: JP-A-1-155339, etc.).

A pattern forming material made of a photosensitive compound and a resin having high light transmittance around 248.4 nm has also been developed.

(For example, Japanese Patent Application Laid-open No. 1-188852 N; Y, T
an1 et al., 5PIE's 1989 Sympo, 1
086-03 etc.). A pattern forming method using this resist material will be described using FIG. A resist material 5 is spin-coated onto the semiconductor substrate 1 to obtain a 1.0 μm resist material film (FIG. 4(a)). Note that on the substrate 1 there is an oxide film,
A conductive film and an insulating film are often formed. Next 24
It is selectively exposed to 8.4 nm KrF excimer laser light 3 through a mask 4 (FIG. 4(b)). Finally, development is performed using an ordinary alkaline developer (0.24% tetramethylammonium hydroxide aqueous solution) to dissolve and remove the exposed areas of the resist material 5, thereby obtaining a pattern 5a (FIG. 4(C)). . This resist material film (1 μm)
FIG. 5 shows the ultraviolet spectral curves before and after exposure. The transmittance of this resist material after exposure was as low as 4%, whereas the resin used had a thickness of 70% at a thickness of 1 μm, indicating that sufficient light chromaticity was not obtained. Further, as a result of pattern forming experiments, the aspect ratio of the pattern was about 70 degrees, and a sufficient pattern shape was not obtained. Furthermore, when using a resist material containing a photosensitive compound having a resist material film group, the sensitivity for boat fishing is approximately 100 to 300 mJ/an2, and Kr is not energy efficient despite its high output.
Practical implementation using F excimer laser light (248.4 nm) is difficult. In addition, in recent years, a chemically amplified resist material using acid generated during exposure as a medium has been proposed as a means of reducing the amount of exposure energy [2]. It
o et al., Polym, Eng, Sci, vol. 23, 101
2 (1983), various reports have been made regarding this. (For example, W. R. Brunsvold et al.
5PIE'51989 Sympo,, 1086-4Q
; T, Neenan et al., 5PIE's 1989S
ympo, 1086-01) However, the resins used in these chemically amplified resist materials are relatively
Due to the large number of aromatic rings, there are problems such as insufficient light transmittance around 248.4 nm and poor heat resistance of the resin.

Regarding photosensitive compounds, for example, onium salts such as tophenylsulfonium tetrafluoroborate have poor solution stability and exhibit their original performance immediately after the resist material is manufactured, but on a semiconductor manufacturing line. It is said that it is difficult to put it into practical use.
In the case of sulfonic acid ester of 6-cinitrobenzyl, stability as a compound is recognized, but 2-nitro-6-nitrotubenzaldehyde, which is produced by exposure to light, is a commonly used developer (tetramethylammonium hydroxide aqueous solution). ), problems such as scum remaining in exposed areas and poor pattern shape occur after development. Also, tris(methanesulfonyloxy)
Benzene is not suitable as a photosensitive compound for chemically amplified resists because its sensitivity is lower than that of the photosensitive compounds described above.

[Problems to be Solved by the Invention] N20 As described above, in the case of a resist material containing a -C-C- photosensitive compound having an l II ll group, since the photosensitive compound must glow, a good It is difficult to obtain a pattern shape, and a large amount of exposure energy is required. In addition, chemically amplified resist materials cannot be used unless the light transmittance of the resin near 248.4 nm is improved or the heat resistance of the resin is improved, and at the same time, the amount of exposure energy is lower for photosensitive compounds. There is a need for a material that can generate an acid in a chemical reaction, has solution stability, and has high permeability to the acid generated by a photoreaction.

[Object of the Invention] The present invention was made in view of the above-mentioned situation, and it provides a resin that has high transparency after exposure to i-line light, far ultraviolet light, such as KrF excimer laser light, and has heat resistance. and a resist material comprising a photosensitive compound that efficiently generates acid with high sensitivity (low exposure energy amount), is stable in solution, and has high permeability to acid generated by photoreaction. The purpose is to

[Configuration of the Invention] In order to achieve the above object, the present invention consists of the following configuration.

"A heat-resistant resin consisting of a component having a functional group that undergoes a chemical change when heated in an acid atmosphere and becomes alkali-soluble, and a component that imparts heat resistance to the resin, and a heat-resistant resin that generates an acid upon exposure to light. A photosensitive compound represented by II;
A resist material comprising a solvent capable of dissolving both.

6 [In the formula, Rδ, R6, R(1, Re each independently represent a hydrogen atom, a halogen atom, a linear monobranched or cyclic alkyl group having 1 to 10 carbon atoms, Haloalkyl group, linear or branched alkoxy group having 1 to 10 carbon atoms, alkenyl group having 2 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, phenyl group, substituted phenyl group (substituents are:
Halogen atom, linear monobranched or cyclic alkyl group having 1 to 10 carbon atoms, haloalkyl group having 1 to 10 carbon atoms, linear or branched alkoxy group having 1 to 10 carbon atoms, nitro group , nitrile group or amide group. ). Also, R
Male and R6, R6 and R♂ and R (l and Re are each independently bonded to each other to form an alicyclic ring.

It may form a heteroaromatic ring, an aromatic ring, or a heteroaromatic ring. ]'' The resist material of the present invention utilizes chemical amplification in order to reduce the amount of exposure energy as much as possible. That is, the resist material of the present invention contains a component having a functional group that undergoes a chemical change upon heating in an acid atmosphere generated from an acid generator upon exposure and becomes alkali-soluble, and a component that imparts heat resistance to the resin, i.e., a component that imparts heat resistance to the resin. On the other hand, it is characterized by the combined use of a heat-resistant resin (hereinafter abbreviated as "resin according to the present invention") composed of a component that has the function of suppressing the softening of the entire resin and a novel photosensitive compound. This is a new resist material with A component having a functional group that becomes alkali-soluble by heating in an acid atmosphere according to the present invention (hereinafter referred to as "
Abbreviated as "component having a specific functional group." ) include monomers such as P-hydroxystyrene derivatives and P-hydroxy-α-methylstyrene derivatives having a protecting group that can be removed with acid. As a specific example, for example, P-
Methoxystyrene, P-isopropoxystyrene, p-
te~butoxystyrene, P-methoxymethoxystyrene, P-isopropoxymethoxystyrene, P-tetrahydropyranyloxystyrene, P-tetrahydrofuranyloxystyrene, P~trimethylsilyloxystyrene, ρ-tert-butoxycarbonyloxystyrene, P- Examples include isopropoxycarbonyloxystyrene, P-hydroxy-α-methylstyrene derivatives having the same protective group as P-hydroxystyrene derivatives, but are not limited thereto. Further, as a component that imparts heat resistance to the resin, any component may be used as long as the use of this component can prevent the entire resin from softening even when heated to 100°C or higher, more preferably 140°C or higher. is 1 such as p-hydroxystyrene, p-chlorostyrene, styrene, α
- methylstyrene, fumaronitrile, monoisopropyl maleate, mono-tert-butyl maleate.

Di-ert-butyl maleate, monocyclohexyl maleate-maleic anhydride, N-phenylmaleimide,
N-substituted phenylmaleimide, N-methylmaleimide,
Monomers such as N-n-butylmaleimide are more common.

The resin according to the present invention is, for example, the following formula [■] or [II
I] can bring you blessings.

[Wherein, R1 is a methyl group, isopropyl group, tert-butyl group, methoxymethyl group, impropoxymethyl group,
It represents a tetrahydropyranyl group, a tetrahydrofuranyl group, a trimethylsilyl group, a terL-butoxycarbonyl group or an isoproboxycarbonyl group, R2 represents a hydrogen atom, a halogen atom or a methyl group, and R3 represents a hydrogen atom or a P-hydroxyphenyl group. , p-chlorophenyl group, phenyl group, cyano group or -COOR7 (however, R7
represents a branched or cyclic alkyl group having 3 to 10 carbon atoms, or a hydrogen atom.

), R4 and R6 each independently represent a hydrogen atom, a methyl group, or a halogen atom, and R5 represents a hydrogen atom, a cyan group, or -COOR8 (however, R8 has 3 to 10 carbon atoms).
represents a branched or cyclic alkyl group, or a hydrogen atom. ), R9 represents a hydrogen atom or -COOR10 (wherein Rlo represents a branched or cyclic alkyl group having 3 to 10 carbon atoms, or a hydrogen atom), and k and l each independently represent a natural number. represent [In the formula, represents an optional phenyl group, q represents 0 or a natural number), 1' and P each independently represent 0 or a natural number, R1, R2, R3, R
4, R5, H6, R9 and k are the same as above. ] These compounds represented by the formula [II] or [m] are representative of the resins according to the present invention, but the resins according to the present invention are of course not limited to these compounds.

Specific examples of the resin according to the present invention include P-isopropoxystyrene and α-methylstyrene copolymer, P-isopropoxystyrene and α-methylstyrene copolymer,
Tetrahydropyranyloxystyrene and P-hydroxystyrene copolymer, p-tert-butoxystyrene and P-hydroxystyrene copolymer, p-tert-butoxycarbonyloxystyrene and maleic acid monocyclohexyl ester copolymer, p-tert -Butoxycarbonyloxystyrene and α-methylstyrene copolymer, p-tert-butoxystyrene and fumaronitrile copolymer, P-methoxymethoxystyrene and p-chlorostyrene copolymer, P-methoxymethoxystyrene and monocyclohexyl maleate copolymer with ester and maleic anhydride, p-tetrahydrofuranyloxystyrene and N-methylmaleimide copolymer, p-tert-
Copolymer of butoxycarbonyloxystyrene, P-hydroxystyrene and maleic anhydride, copolymer of p-tetrahydropyranyloxystyrene, P-hydroxystyrene and fumaronitrile, p-tert-butoxycarbonyloxystyrene and P- Examples include, but are not limited to, copolymers of hydroxystyrene and N-butylmaleimide, copolymers of P-tetrahydropyranyloxystyrene, P-hydroxystyrene, and N-phenylmaleimide, etc. .

The resin according to the present invention comprises a component having the above-mentioned specific functional group (
It can be easily obtained by copolymerizing one or more monomers and one or more components (monomers) that impart heat resistance to the resin according to a conventional method for producing copolymers. That is, one or more components (monomers) having the above-mentioned specific functional groups and one or more components (monomers) that impart heat resistance to the resin are combined with radicals in an organic solvent such as benzene or toluene. Polymerization initiator [e.g. azobisisobutyronitrile 2,2'-azobis(2,
4-dimethylvaleronitrile), 2,2'-azobis(
Polymerization in the presence of an azo polymerization initiator such as (methyl 2-methylpropionate) or a peroxide polymerization initiator such as benzoyl peroxide, lauroyl peroxide, etc. at 50 to 100°C in a nitrogen stream for 1 to 10 hours. It is sufficient to carry out the reaction, and after the reaction, post-treatment may be carried out according to a conventional method for obtaining a polymer compound, and the product may be isolated.

It goes without saying that the resin according to the present invention can also be easily obtained by appropriately introducing the specific functional group into a commercially available polymer such as poly(P-vinylphenol) through a chemical reaction.

The weight average molecular weight (M%l) of the resin according to the present invention is usually 1
, about 000 to 40,000, preferably 3,000
~20,000.

In the photosensitive compound represented by general formula [I] used in the present invention, the halogen atom and haloalkyl group represented by R♂, R5, R(3, R8) include chlorine, bromine, fluorine, Iodine is mentioned, and it is linear.

Examples of the alkyl group of a branched or cyclic alkyl group, the alkyl group of a haloalkyl group, and the alkyl group of a linear or branched alkoxy group include a methyl group, an ethyl group, a propyl group, a butyl group, an amyl group, Alkyl groups having 1 to 10 carbon atoms such as hexyl group, octyl group, decyl group, etc. are mentioned, and examples of alkenyl groups include vinyl group, 1-propenyl group, 2-propenyl group (allyl group), 2-butenyl group, iso propenyl group, 1,3-butadienyl group, 2-
Examples include alkenyl groups having 2 to 10 carbon atoms such as hentenyl group and -hexenyl group. Examples of aralkyl group include benzyl group, phenethyl group, and phenylpropyl group.

Examples include aralkyl groups having 7 to 10 carbon atoms such as phenylbutyl group. In addition, halogen atoms as substituents of substituted phenyl groups and halogens of haloalkyl groups include chlorine,
Examples include bromine, fluorine, and iodine, and examples of the alkyl group of a linear bibranched or cyclic alkyl group, an alkyl group of a haloalkyl group, and an alkyl group of a linear or branched alkoxy group include 1, for example, a methyl group. , ethyl group, propyl group, butyl group.

Examples include alkyl groups having 1 to 10 carbon atoms such as amyl group, hexyl group, octyl group, and decyl group.

In the course of intensive research on photosensitive compounds that generate acid when exposed to light, the present inventors discovered that when using a photosensitive compound that bleaches when exposed to light, that is, a photosensitive compound represented by the above formula [I], the internal The present inventors have discovered that due to the cell effect, the transmittance after exposure is significantly improved and the resolution is significantly improved compared to when conventional photosensitive compounds are used, and the present invention has been completed.

The solvent used in the present invention may be any solvent as long as it can dissolve both the resin and the photosensitive compound, but it is usually more preferable to use a solvent that does not have absorption in the vicinity of 385r+m and 248.4nm. . More specific examples include ethyl cellosolve acetate, methyl cellosolve acetate, diethylene glycol dimethyl ether, ethyl lactate, methyl lactate, dioxane, and ethylene glycol monoisopropyl ether, but are not limited thereto.

The resin according to the present invention does not absorb light in a wavelength range of 30 Or+m or more, and has extremely high light transmittance for +365 nm O1 line light. It has also been confirmed that acid generators generate acids even with i-line light, and chemical amplification can be used. Therefore, the resist material of the present invention utilizes a chemical amplification method to produce a low exposure amount of KrF excimer laser light (2
It is a resist material that can be patterned using i-line light (365 nm) or i-line light (365 nm).

[Function] To explain the function of the present invention, first, a region exposed to KrF excimer laser light, i-line light, etc. is exposed to, for example, the following (
Acid is generated according to the photoreaction shown in A).

When heat treatment is performed subsequent to the exposure step, the functional groups of the resin undergo a chemical change by the acid according to the reaction formula (B) below, and become alkali-soluble, which is eluted into the developer during development.

On the other hand, since no acid is generated in the unexposed area, no chemical change occurs even after heat treatment, and no alkali-soluble groups are expressed. Furthermore, since the resin itself has high heat resistance, no softening of the resin is observed during heat treatment. When a pattern is formed using the resist material of the present invention in this way, a large difference in solubility in an alkaline developer occurs between the exposed and unexposed areas.
Moreover, since the resin in the unexposed areas does not soften during the heat treatment, a positive pattern with good contrast is formed. Further, as shown in the reaction formula (B), since the acid generated by exposure acts catalytically, exposure only needs to generate the necessary acid, making it possible to reduce the amount of exposure energy.

[Example] The present invention will be explained in more detail with reference to Examples and Reference Examples below, but the present invention is not limited by these in any way.

Reference Example 1 88 g of p-tert-butoxystyrene and 39 g of fumaronitrile were mixed in a toluene solvent under a nitrogen stream in the presence of 2,2'-azobis(methyl 2-methylpropionate),
A polymerization reaction was carried out at 90°C for 2 hours. After the reaction, the reaction solution was poured into methanol to cause crystallization, and the precipitated product was collected by filtration and dried to obtain 120 g of p-tert-butoxystyrene-fumaronitrile copolymer (about 10,000).

Example 1゜ Regis consisting of the following composition P-mert-butoxystyrene- fumaronitrile copolymer (Compound obtained in Reference Example 1) A sheet material was prepared.

Diethylene glycol dimethyl ether 15.0g 1st
A pattern forming method using the above resist material will be explained with reference to the drawings. The resist material 2 was spin-coated onto a substrate 1 such as a semiconductor, and after soft baking on a hot plate at 90° C. for 90 seconds, a resist material film with a thickness of 1.0 μm was obtained (FIG. 1(a)). Next, KrF excimer laser light 3 of 248.4 na was selectively exposed through a mask 4 (
Figure 1(b)). After baking on a hot plate at 130°C for 90 seconds, developing with an alkaline developer (2.38% tetramethylammonium hydroxide aqueous solution) for 60 seconds dissolves and removes only the exposed areas of resist material 2, forming a positive pattern. 2a was obtained (Fig. 1(C)). FIG. 2 shows the ultraviolet ray spectral curves of this resist material film (1 μm) before and after exposure. The transmittance was approximately 65% before exposure, and the transmittance was as high as approximately 80% after exposure. In addition, the aspect ratio of the continuous pattern was a 0.25 μm line-and-space pattern with a shadow shape of about 88 degrees. Furthermore, the γ characteristics of this resist material film (1 μl) are shown in FIG. This material has a minimum exposure dose of 2011 IJ/a
It had a high sensitivity of 112.

Example 2 A resist material was prepared in the same manner as in Example 1 except that the resin in Example 1 was changed to the styrene resin shown below, and the same experiment as in Example 1 was conducted.

p-tert-butoxystyrene-p-hydroxystyrene copolymer (F+ approx. 13,000
) As a result, the same good results as in Example 1 were obtained.

The positive pattern obtained using this resist material was approximately 25
Pattern formation was possible with an exposure energy amount of "mJ/cm".

Example 3゜A resist material was prepared in the same manner as in Example 1 except that the photosensitive compound in Example 1 was changed to the compound shown below, and the same experiment as in Example 1 was conducted. As a result, good results similar to those in Example 1 were obtained. The positive pattern obtained using this resist material is approximately 18cm
Pattern formation was possible with the exposure energy amount of +J/c port 2.

Example 4 A resist material was prepared in the same manner as in Example 2 except that the photosensitive compound in Example 2 was changed to the compound shown below, and the same experiment as in Example 2 was conducted.

As a result, good results similar to those of Example 2 were obtained. The positive pattern obtained using this resist material is approximately 12 m long.
Pattern formation was possible with an exposure energy amount of J/cm2.

Example 5 p-methoxymethoxystyrene-maleic acid copolymer (about 15,000 l) (k/1/
p=2/1/1) 6.0 g Diethylene glycol dimethyl ether 15.0 g An experiment similar to Example 1 was conducted.

As a result, good results similar to those of Example 1 were obtained. The positive pattern obtained using this resist material is approximately 22 m long.
Pattern formation was possible with an exposure energy amount of J/am2.

[Effects of the Invention] The resist material according to the present invention can be used with a light source of 400 nm or less, for example, 365 nm or less single-line light, 300 nm or less deep ultraviolet light (D
eepUV) - for example, KrFI ximer laser light (248
When used as a resist material for exposure such as 4nn+), fine patterns with good shapes on the order of submicrons can be easily obtained. Accordingly, the present invention has great value for the formation of ultra-fine patterns in the semiconductor industry and the like.

This resist material is particularly effective with i-line light, far ultraviolet light, and KrF excimer laser light, but it can also be used satisfactorily with electron beams and X-rays.

[Brief explanation of drawings]

Figures 1 to 3 show the results obtained in Example 1;
The figure is a process cross-sectional view of a pattern forming method using the resist material of the present invention.
The figures show γ characteristic diagrams of the resist materials of the present invention. Fig. 4 is a process cross-sectional view of a pattern forming method using a conventional resist material, Fig. 5 is an ultraviolet ray spectral curve diagram of a conventional resist material (the solid line is before exposure, the broken line is after exposure), and Fig.
The figure is a γ characteristic diagram of a conventional resist material. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Resist material film of the present invention, 3.
...KrF excimer laser light, 4...mask, 5...
- Conventional resist material film, 2a...resin pattern.

Claims (3)

[Claims] (1) A heat-resistant resin consisting of a component that has a functional group that undergoes a chemical change when heated in an acid atmosphere and becomes alkali-soluble, and a component that imparts heat resistance to the resin, and the following general resins that generate acid when exposed to light: A resist material comprising a photosensitive compound represented by formula [I] and a solvent capable of dissolving both. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [I] [In the formula, R_0^1, R_0^2, R_0^3, R_0
^4 each independently represents a hydrogen atom, a halogen atom, and a carbon number of 1 to
10 linear, branched or cyclic alkyl groups, 1 carbon number
-10 haloalkyl group, linear or branched alkoxy group having 1 to 10 carbon atoms, alkenyl group having 2 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, phenyl group, substituted phenyl group (substituent is a halogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and 1 to 10 carbon atoms.
a haloalkyl group, a linear or branched alkoxy group having 1 to 10 carbon atoms, a nitro group, a nitrile group, or an amide group. ). Also, R_0^1, R_0^2, R_0^
2 and R_0^3 and R_0^3 and R_0^4 may each independently be bonded to each other to form an alicyclic ring, a heteroalicyclic ring, an aromatic ring, or a heteroaromatic ring. ] (2) A heat-resistant resin composed of a component having a functional group that undergoes a chemical change upon heating in an acid atmosphere and becomes alkali-soluble, and a component that imparts heat resistance to the resin has the following general formula [
II] ▲There are mathematical formulas, chemical formulas, tables, etc.▼[II] [In the formula, R^1 is a methyl group, isopropyl group, tert
- represents a butyl group, methoxymethyl group, isopropoxymethyl group, tetrahydropyranyl group, tetrahydropranyl group, trimethylsilyl group, tert-butoxycarbonyl group, or isopropoxycarbonyl group, and R^2 is a hydrogen atom, a halogen atom, or a methyl group. Represents a group, R^3
is a hydrogen atom, p-hydroxyphenyl group, p-chlorophenyl group, phenyl group, cyano group or -COOR^7(
However, R^7 represents a branched or cyclic alkyl group having 3 to 10 carbon atoms, or a hydrogen atom. ), R^4 and R^6 each independently represent a hydrogen atom, a methyl group, or a halogen atom, and R^5 is a hydrogen atom, a cyano group, or -COOR^8 (however, R^8 is the number of carbon atoms 3 to 10 branched or cyclic alkyl groups, or a hydrogen atom), and R^9 is a hydrogen atom or -CO
OR^1^0 (However, R^1^0 represents a branched or cyclic alkyl group having 3 to 10 carbon atoms, or a hydrogen atom.)
, and k and l each independently represent a natural number. ]
The resist material according to claim 1, which is a resin represented by: (3) A heat-resistant resin composed of a component having a functional group that undergoes a chemical change upon heating in an acid atmosphere and becomes alkali-soluble and a component that imparts heat resistance to the resin has the following general formula [
III] ▲There are mathematical formulas, chemical formulas, tables, etc.▼[III] [In the formula, represents a chain, branched or cyclic alkyl group or a phenyl group which may have a substituent, q represents 0 or a natural number);
' and p each independently represent 0 or a natural number, R^1
, R^2, R^3, R^4, R^5, R^6, R^9 and k are the same as above. ] Claim (1)
) Resist materials listed in ).