JPH03222338A - Mounting of semiconductor element - Google Patents

Abstract

PURPOSE:To eliminate an unfilled part between a substrate and a semiconductor element by a method wherein a filling of a liquid resin is pressed in through a hole provided at a position, which corresponds to the surface of the semiconductor element, on the substrate. CONSTITUTION:A liquid resin 5 is pressed in through an opening part, which is located on the side of the rear of a substrate 2, of a hole 7 provided at a position, which corresponds to the surface of a semiconductor element 1, on the substrate 2 using a dispenser, for example, or the like. The resin 5 pressed in gradually spreads from the central part, which is located under the surface of the element 1, of the substrate 2 and oozes out from the gap between the element 1 and the substrate 2. When this resin 5 oozed out reaches a proper amount, a filling of the resin which is performed by press fitting is finished. That is, as the resin 5 is filled through the hole 7 provided in the substrate 2 by press fitting and as the resin 5 applied on an opening part, which is located in the gap between the element 1 and the substrate 2, of the hole is filled between the element 1 and the substrate 2 by sucking the resin 5 via the hole, an unfilled part is eliminated between the element 1 and the substrate.

Description

[Detailed description of the invention] [Industrial Application Field J The present invention relates to a method for mounting semiconductor elements.

[Conventional technology]

FIG. 7 shows a conventional example, in which a semiconductor element l is connected to a substrate 2 through a protruding connection electrode (bump) 4 formed on a conductive metal 3 on a substrate 2 by face-down bonding.
It is installed in.

Here, in order to improve the conformity of the semiconductor element 1 to the substrate 2, liquid resin 5 is generally filled between the semiconductor element 1 and the base Fi2. This liquid resin 5 is applied to the opening of the gap (space) between the semiconductor element 1 and the substrate 2, and uses the osmotic pressure generated from the difference in atmospheric pressure between the opening and the inside to apply the liquid resin 5 under the surface of the semiconductor element 1. The liquid resin 5 is filled deep inside.

[Problem to be Solved by the Invention J] However, if the viscosity of the liquid resin 5 is high, the semiconductor element 1
It does not penetrate deep into the interior under the surface, resulting in unfilled portions 6. Furthermore, when the semiconductor element 1 is enlarged, there is a distance between the opening and the center of the interior under the surface of the semiconductor element 1, which makes it difficult to fill with the liquid resin 5, resulting in an unfilled portion 6.

If there is an unfilled portion 6 of the liquid resin 5 under the surface of the semiconductor element 1, the air inside the unfilled portion 6 expands or contracts when thermal stress is applied, and the stress generated at this time expands or contracts.
This applies to the joint between the hump 4 and the semiconductor element 1, causing disconnection (peeling) or cracking of the hump 4, resulting in a decrease in joint reliability.

Furthermore, since the unfilled portion 6 exists, the stress caused by the difference in linear expansion coefficient between the semiconductor element 1 and the substrate 2 is not evenly distributed.
The wires will be concentrated in a certain area, and the rehammer 4 will be more likely to break. Furthermore, since there is no liquid resin 5 in the portion where the unfilled portion 6 exists, there is a drawback that sufficient adhesive strength cannot be obtained.

The present invention has been made to solve the above problems, and its purpose is to provide a filling method that can eliminate unfilled areas when filling liquid resin between a semiconductor element and a substrate. It is about providing.

[Means for Solving the Problems 1] In order to solve the above problems, the present invention provides a semiconductor device in which a semiconductor device is mounted on a substrate by a face-down bonding method, and a liquid resin is filled between the semiconductor device and the substrate. In mounting, the liquid resin is filled by press-fitting the liquid resin through a hole provided at a position corresponding to the semiconductor element surface of the substrate, and the gap between the semiconductor element and the substrate is filled. Apply liquid resin to the opening, then
This is characterized in that the liquid resin is suctioned through a hole provided at a position corresponding to the semiconductor element surface of the substrate.

[Function] According to the present invention, the hole provided in the substrate is filled with liquid resin by press-fitting, and the liquid resin applied to the gap opening between the semiconductor element and the substrate can be sucked through the hole. Since the filling is performed using the above-mentioned method, there is no unfilled portion as described above.

Therefore, the liquid resin is evenly filled under the surface of the semiconductor element, and the stress caused by the difference in linear expansion coefficient between the semiconductor element and the substrate is evenly transmitted to the semiconductor element and the hump, eliminating stress concentration. , stress is alleviated. Therefore, the reliability of the bond between the semiconductor element and the substrate is improved.

Furthermore, in the conventional resin filling method using osmotic pressure, there is a limit to permeability, so it becomes possible to fill resin with high viscosity that could not be filled under the surface of the semiconductor element. Therefore, it is now possible to use a resin with a low coefficient of linear expansion and high viscosity that contains a large amount of filler (SiO Since the stress caused by the difference in coefficient of linear expansion can be reduced, the compatibility between the semiconductor element and the substrate is improved. Moreover, even a fairly large semiconductor element can be filled under the surface of the semiconductor element regardless of the viscosity of the resin.

[Embodiment] FIGS. 1 and 2 show an embodiment of the present invention, in which a method of filling liquid resin 5 by press-fitting under the surface of a semiconductor element 1 that is face-down-ponded to a base plate 2 is shown. I will explain about it.

A hole 7 provided at a position corresponding to one surface of the semiconductor element of the group Fi2
The liquid resin 5 is press-fitted from the opening on the back side of the base Fi using, for example, a dispenser (not shown). The press-fitted liquid resin 5 gradually spreads from the center below the surface of the semiconductor element 1 and seeps out from the gap between the semiconductor element 1 and the substrate 2.

When this oozing liquid resin 5 reaches an appropriate amount,
Finish filling by press fitting.

In this way, the liquid resin 5 can be filled by the press-fitting method, but the inflow pressure of the liquid resin 5 is applied to the surface of the semiconductor element 1 during press-fitting, and therefore stress may be applied to the joint surface between the semiconductor element 1 and the hump 4. , depending on the inflow pressure and viscosity of the liquid resin 5. Further, the amount of liquid resin 5 seeping out from the gap between the semiconductor element 1 and the substrate 2 is as shown in FIG.
It is not necessarily uniform around the semiconductor element 1. For this reason, it is desirable to form a liquid barrier on the substrate 2 around the semiconductor element 1 at a certain distance from the semiconductor element 1.

Next, FIGS. 3 and 4 show different embodiments of the present invention, and a method of filling the liquid resin 5 under the surface of the semiconductor element 1 face-down bonded to the substrate 2 by suction will be described.

Liquid resin 5 is applied to the opening of the gap between semiconductor element 1 and substrate 2. This opening is located around the semiconductor element 1, and a fixed amount of liquid resin 5 is applied thereto as shown in FIG.

Thereafter, by connecting a resin suction device as shown in FIG. 5 to the opening on the back side of the substrate of the hole 7 provided at a position corresponding to the first surface of the semiconductor element of the substrate 2, and sucking the resin, the first surface of the semiconductor element is The pressure in the internal space below is lowered, and the liquid resin 5 applied to the gap opening between the semiconductor element 1 and the substrate 2 is sucked deep into the interior of the semiconductor element 1 and filled therein.

The resin suction device consists of a device main body lO and a vacuum pump 18, as shown in FIG. A filter 11 whose mesh is finer than the particle size of the liquid resin and a resin reservoir 12 for storing the liquid resin are provided. Further, the device main body 10 is provided with a connecting tube 13 made of a transparent material, and at the tip of the connecting tube 13,
A suction portion 14 is provided that comes into contact with the opening periphery of the hole 7 formed in the substrate 2. In addition, 15 in the figure is the device main body 10.
Transparent windows 15 and I6 are pipes connecting the device main body 10 and the vacuum pump 18, and 17 is a pressure adjusting plug.

The liquid resin 5 is sucked by operating the suction portion 14 of the resin suction device having such a configuration in contact with the opening periphery of the hole 7 formed in the substrate 2. At this time, since the connecting tube 13 is transparent as described above, it is possible to observe how the liquid resin 5 reaches the open end of the hole 7. Therefore, when the liquid resin 5 reaches the open end of the hole 7, the operation of the vacuum pump 18 is stopped, and the filling of the liquid resin 5 below the surface of the semiconductor element 1 is completed.

The liquid resin 5 filled under the surface of the semiconductor element 1 is cured by heating or standing at room temperature, and the semiconductor element 1 and the substrate 2 are bonded to each other with the resin interposed.

[Effects of the Invention] As described above, the present invention is characterized in that the liquid resin is filled by press-fitting into the hole provided at the position corresponding to the surface of the face-down bonded semiconductor element. Since the liquid resin applied to the gap opening between the element and the substrate is filled by suctioning through the hole, there is no unfilled part when filling the gap between the semiconductor element and the substrate with the liquid resin. We can provide a filling method that can

Therefore, the following effects can be achieved by using the present invention.

■ There will be no unfilled areas under the surface of the semiconductor element, and the liquid resin will be uniformly filled under the surface of the semiconductor element, and the stress caused by the difference in linear expansion coefficient between the semiconductor element and the substrate will be evenly distributed between the semiconductor element and the hump. is transmitted, there is no stress concentration, and the stress is alleviated. Therefore, the reliability of the bond between the semiconductor element and the substrate is improved.

■ Since conventional resin filling methods using osmotic pressure have limited permeability, it becomes possible to fill resins with high viscosity that could not be filled beneath the surface of semiconductor elements. Therefore, it is now possible to use a resin with a low linear expansion coefficient and high viscosity that contains a large amount of Fisi (S10□) as a resin filler, and the difference in linear expansion coefficient between the semiconductor element and the substrate can be reduced. Since the stress caused by the difference in coefficient of linear expansion can be reduced, the compatibility between the semiconductor element and the substrate is improved.

■ Even fairly large semiconductor devices can be filled under the surface of the semiconductor device regardless of the viscosity of the resin. Therefore,
A large semiconductor element can be mounted on a substrate by face-down bonding, and the bonding reliability is sufficiently ensured.

■ Generally speaking, if the content of SiOz, which is a filler in liquid resin, is increased in order to lower the coefficient of linear expansion and reduce stress, the viscosity of the liquid resin increases, making it difficult to penetrate under the surface of the semiconductor element. Become. For this reason, it is difficult to design a liquid resin with low stress and low viscosity, but in the present invention, the liquid resin can be filled under the surface of the semiconductor element regardless of the viscosity of the liquid resin, so the design of the liquid resin becomes easy.

[Brief explanation of drawings]

1 is a sectional view of a semiconductor device mounted according to an embodiment of the present invention, FIG. 2 is a top view of the same, and FIG. 3 is a sectional view of a semiconductor device mounted according to a different embodiment of the present invention. 4
The figure is a top view of the same as above, Figure 5 is a simplified diagram showing an example of the resin suction device used in the present invention, Figure 6 is a simplified diagram of the main body of the same device, and Figure 7 is mounted by the conventional resin filling method. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Substrate, 3... Conductor metal, 4... Protruding connection electrode (hump), 5... Liquid resin, 6... Resin unfilled part, 7... ...hole.

Claims (2)

[Claims] (1) In mounting a semiconductor element by mounting a semiconductor element on a substrate using the face-down bonding method and filling liquid resin between the semiconductor element and the substrate, the filling of the liquid resin corresponds to the semiconductor element surface of the substrate. 1. A method for mounting a semiconductor element, characterized in that the semiconductor element is press-fitted through a hole provided at a position where the semiconductor element is mounted. (2) In mounting a semiconductor element by mounting a semiconductor element on a substrate using the face-down bonding method and filling a liquid resin between the semiconductor element and the substrate, the liquid resin is filled into the gap between the semiconductor element and the substrate. 1. A method for mounting a semiconductor device, comprising applying a liquid resin to an opening, and then sucking the liquid resin through a hole provided at a position corresponding to the semiconductor device surface of a substrate.