JPH03220741A - Wireless bonder - Google Patents
Wireless bonderInfo
- Publication number
- JPH03220741A JPH03220741A JP2017414A JP1741490A JPH03220741A JP H03220741 A JPH03220741 A JP H03220741A JP 2017414 A JP2017414 A JP 2017414A JP 1741490 A JP1741490 A JP 1741490A JP H03220741 A JPH03220741 A JP H03220741A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- bonding
- laser light
- laser oscillator
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 6
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、ワイヤレスボンディング装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a wireless bonding device.
(従来の技術)
従来、T A B (Tape Automated
Bonding)方式においてシングルポイントボンデ
ィングを行う場合、特殊加工を施したり超音波のかかる
方向性を考慮した専用のボンディングツールを必要とし
ていた。(Prior art) Conventionally, T A B (Tape Automated
When single-point bonding is performed using the bonding method, it is necessary to use a dedicated bonding tool that is specially processed and takes into consideration the directionality of ultrasonic waves.
すなわち、ICチップを下部より加熱するとともに、上
部に設けられたバンプ上にインナリードを位置させ、そ
の上から専用のボンディングツルにより加圧することが
行われていた。That is, the IC chip is heated from the bottom, inner leads are positioned on the bumps provided on the top, and pressure is applied from above using a dedicated bonding crane.
しかしながらこの場合、専用のボンディングツルが必要
であるために、製造コストに影響を与えるという問題が
あった。However, in this case, since a dedicated bonding tool is required, there is a problem in that the manufacturing cost is affected.
また、ボンディングツールによる加圧によりバンプにク
ラックが発生するという問題もあった。There was also the problem that cracks were generated in the bumps due to the pressure applied by the bonding tool.
(発明が解決しようとする課題)
このように従来のTAB方式におけるシングルポイント
ボンディングを行う装置においては、専用のボンディン
グツールが必要であるため製造コストに影響を与え、ま
たボンディングツールによる加圧によりバンプにクラッ
クが発生するという問題があった。(Problems to be Solved by the Invention) As described above, in the conventional single point bonding device using the TAB method, a dedicated bonding tool is required, which affects manufacturing costs, and the pressure applied by the bonding tool causes bumps to be removed. There was a problem that cracks occurred.
本発明は、このような量論を解決するために成されたも
ので、TAB方式におけるシングルポイントボンディン
グを製造コストに影響を与えることなく行うことができ
、しかもクラック等の不具合の発生を抑えることができ
るワイヤレスボンディング装置を提供することを目的と
している。The present invention has been made to solve such stoichiometric problems, and allows single point bonding in the TAB method to be performed without affecting manufacturing costs, while suppressing the occurrence of defects such as cracks. The purpose is to provide a wireless bonding device that can perform
[発明の構成コ
(課題を解決するための手段)
本発明は、上述した目的を遠戚するために、キャリアフ
ィルムより導出される各リードを各被接続部に個別にワ
イヤレスボンディングを行う装置において、前記被接続
部上に位置する前記リド上にワイヤ導出口が接触するキ
ャピラリと、レザ光を発振するレーザ発振器と、このレ
ーザ発振器より出力されるレーザ光を前記キャピラリの
ワイヤ導入口に導入するファイバケーブルとを具備する
ものである。[Structure of the Invention (Means for Solving the Problem)] In order to achieve the above-mentioned object, the present invention provides an apparatus for individually wirelessly bonding each lead derived from a carrier film to each connected part. , a capillary whose wire outlet is in contact with the lid located on the connected part, a laser oscillator that oscillates laser light, and a laser light output from the laser oscillator that is introduced into the wire inlet of the capillary. A fiber cable is provided.
(作 用)
本発明では、汎用の治具であるキャピラリを用いてワイ
ヤレスボンディングを行っているので、製造コストに影
響を与えることはない。また、レザ光を用いてワイヤレ
スボンディングを行っているので、加圧を行う必要がな
く、従ってクラック等の不具合の発生を抑えることがで
きる。(Function) In the present invention, since wireless bonding is performed using a capillary, which is a general-purpose jig, manufacturing costs are not affected. Furthermore, since wireless bonding is performed using laser light, there is no need to apply pressure, and therefore it is possible to suppress the occurrence of defects such as cracks.
(実施例) 以下、本発明の実施例を図面に基づき説明する。(Example) Embodiments of the present invention will be described below based on the drawings.
第1図は本発明の一実施例に係るワイヤレスボンディン
グ装置の構成を示す図である。FIG. 1 is a diagram showing the configuration of a wireless bonding device according to an embodiment of the present invention.
同図において、1はワイヤボンディングに使用される汎
用のキャピラリ、2はこのキャピラリ1に接続された超
音波ホーンを示している。In the figure, 1 is a general-purpose capillary used for wire bonding, and 2 is an ultrasonic horn connected to this capillary 1.
また、3はレーザ光を発振するレーザ発振器であり、こ
のレーザ発振器3より出力されるレーザ光はファイバケ
ーブル4を介してキャピラリ1のワイヤ導入口に導入さ
れる。Further, 3 is a laser oscillator that oscillates a laser beam, and the laser beam output from this laser oscillator 3 is introduced into the wire introduction port of the capillary 1 via a fiber cable 4.
更に、5はキャピラリ1の先端がリードに接触したこと
を検出するタッチセンサであり、このタッチセンサ5に
よる検出結果は中央処理装置(CPU)6に伝えられる
。中央処理装置6はこの検出結果基づきレーザ発振器3
のオン/オフを制御する。Furthermore, 5 is a touch sensor that detects when the tip of the capillary 1 comes into contact with a lead, and the detection result by this touch sensor 5 is transmitted to a central processing unit (CPU) 6. The central processing unit 6 controls the laser oscillator 3 based on this detection result.
control on/off.
次に、このように構成された装置の動作を説明する。Next, the operation of the device configured in this way will be explained.
まず、ICチップ7のバンプ8上にキャリアフィルム9
より導出されるインナリード10を位置させる。First, a carrier film 9 is placed on the bump 8 of the IC chip 7.
The inner lead 10 that is led out is positioned.
次に、インナリード10上にキャピラリ1のワイヤ導出
口を垂直に接触させる。Next, the wire outlet of the capillary 1 is vertically brought into contact with the inner lead 10 .
そして、キャピラリ1のワイヤ導出口がインチリード1
0上に接触すると、タッチセンサ5によりこのことが検
出され、この検出結果は中央処理装置6に伝えられる。Then, the wire outlet of capillary 1 is set to inch lead 1.
0, this is detected by the touch sensor 5 and the detection result is transmitted to the central processing unit 6.
すると、中央処理装置6は、レーザ発振器3をオンとす
る制御を行う。Then, the central processing unit 6 performs control to turn on the laser oscillator 3.
これによりレーザ発振器3よりレーザ光は出力され、こ
のレーザ光はファイバケーブル4を介してキャピラリ1
のワイヤ導入口に導入される。As a result, laser light is output from the laser oscillator 3, and this laser light is transmitted to the capillary 1 via the fiber cable 4.
is introduced into the wire inlet.
そして、レーザ光は、第2図に示すように、キャピラリ
1の内部を通りワイヤ導出口よりインチリード10に照
射され、インナリード10はバンプ8に接続される。Then, as shown in FIG. 2, the laser beam passes through the inside of the capillary 1 and is irradiated onto the inch lead 10 from the wire outlet, and the inner lead 10 is connected to the bump 8.
このように本実施例のワイヤレスボンディング装置によ
れば、汎用の治具であるキャピラリ1を用いてワイヤレ
スボンディングを行っているので、従来の専用の治具を
用いる場合に比べ製造コストに与える影響は極めて小さ
い。また、レーザ光を用いてワイヤレスボンディングを
行っているので、従来のように加圧を行う必要がなく、
従ってクラック等の不具合の発生を抑えることができる
。As described above, according to the wireless bonding apparatus of this embodiment, since wireless bonding is performed using the capillary 1, which is a general-purpose jig, the impact on manufacturing costs is less than when using a conventional dedicated jig. Extremely small. In addition, since wireless bonding is performed using laser light, there is no need to apply pressure as in conventional methods.
Therefore, occurrence of defects such as cracks can be suppressed.
尚、上述した実施例においては、インナリードをボンデ
ィングする場合について説明したが、アウタリードをボ
ンディングする場合ついても同様に実施することができ
る。In the above-mentioned embodiment, the case where the inner lead is bonded has been described, but the case where the outer lead is bonded can be implemented in the same manner.
[発明の効果]
以上説明したように、本発明によれば、TAB方式にお
けるシングルポイントボンディングを製造コストに影響
を与えることなく行うことができ、しかもクラック等の
不具合の発生を抑えることができる。[Effects of the Invention] As described above, according to the present invention, single point bonding in the TAB method can be performed without affecting manufacturing costs, and the occurrence of defects such as cracks can be suppressed.
第1図は本発明の一実施例に係るワイヤレスボンディン
グ装置の構成を説明するための図、第2図は第1図の一
部拡大断面図である。
1・・・キャピラリ、2・・・超音波ホーン、3・・・
レザ発振器、4・・・ファイバケーブル、5・・タッチ
センサ、6・・・中央処理装置(CPU) 、7・・・
ICチップ、8・・・バンプ、9・・・キャリアフィル
ム、10・・・インナリード。FIG. 1 is a diagram for explaining the configuration of a wireless bonding device according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of FIG. 1. 1... Capillary, 2... Ultrasonic horn, 3...
Laser oscillator, 4... Fiber cable, 5... Touch sensor, 6... Central processing unit (CPU), 7...
IC chip, 8... bump, 9... carrier film, 10... inner lead.
Claims (1)
に個別にワイヤレスボンディングを行う装置において、 前記被接続部上に位置する前記リード上にワイヤ導出口
が接触するキャピラリと、 レーザ光を発振するレーザ発振器と、 このレーザ発振器より出力されるレーザ光を前記キャピ
ラリのワイヤ導入口に導入するファイバケーブルと を具備することを特徴とするワイヤレスボンディング装
置。[Scope of Claims] An apparatus for individually performing wireless bonding of each lead led out from a carrier film to each connected part, comprising: a capillary whose wire outlet comes into contact with the lead located on the connected part; A wireless bonding device comprising: a laser oscillator that oscillates laser light; and a fiber cable that introduces the laser light output from the laser oscillator into the wire introduction port of the capillary.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017414A JPH03220741A (en) | 1990-01-25 | 1990-01-25 | Wireless bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017414A JPH03220741A (en) | 1990-01-25 | 1990-01-25 | Wireless bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03220741A true JPH03220741A (en) | 1991-09-27 |
Family
ID=11943347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017414A Pending JPH03220741A (en) | 1990-01-25 | 1990-01-25 | Wireless bonder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03220741A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501043B1 (en) * | 1999-10-22 | 2002-12-31 | Medtronic, Inc. | Apparatus and method for laser welding of ribbons |
-
1990
- 1990-01-25 JP JP2017414A patent/JPH03220741A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501043B1 (en) * | 1999-10-22 | 2002-12-31 | Medtronic, Inc. | Apparatus and method for laser welding of ribbons |
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