JPH03220741A - Wireless bonder - Google Patents

Wireless bonder

Info

Publication number
JPH03220741A
JPH03220741A JP2017414A JP1741490A JPH03220741A JP H03220741 A JPH03220741 A JP H03220741A JP 2017414 A JP2017414 A JP 2017414A JP 1741490 A JP1741490 A JP 1741490A JP H03220741 A JPH03220741 A JP H03220741A
Authority
JP
Japan
Prior art keywords
capillary
bonding
laser light
laser oscillator
cracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017414A
Other languages
Japanese (ja)
Inventor
Toshiya Nemoto
根本　俊哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2017414A priority Critical patent/JPH03220741A/en
Publication of JPH03220741A publication Critical patent/JPH03220741A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To inhibit the generation of defects, such as cracks without affecting manufacturing cost by carrying out wireless bonding, using capillary which is a general purpose tool and laser light. CONSTITUTION:This device is provided with a general purpose capillary 1 used for wire bonding and a supersonic phone 2 connected with the capillary 1. It is also provided with a laser oscillator 3 which oscillates laser light. The laser light which is output from the laser oscillator 3 is introduced into a wire intake port of the capillary 1 by way of a fire cable 4. it is further provided with a touch sensor 5 which detects the contact of the tip of the capillary 1 with the lead and hence on/off controls the laser oscillator. In this manner, the present invention eliminates the need for a special bonding tool and is capable of inhibiting the generation of defects, such as cracks.

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、ワイヤレスボンディング装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a wireless bonding device.

（従来の技術） 従来、Ｔ　Ａ　Ｂ　（Ｔａｐｅ　Ａｕｔｏｍａｔｅｄ　
Ｂｏｎｄｉｎｇ）方式においてシングルポイントボンデ
ィングを行う場合、特殊加工を施したり超音波のかかる
方向性を考慮した専用のボンディングツールを必要とし
ていた。(Prior art) Conventionally, T A B (Tape Automated
When single-point bonding is performed using the bonding method, it is necessary to use a dedicated bonding tool that is specially processed and takes into consideration the directionality of ultrasonic waves.

すなわち、ＩＣチップを下部より加熱するとともに、上
部に設けられたバンプ上にインナリードを位置させ、そ
の上から専用のボンディングツルにより加圧することが
行われていた。That is, the IC chip is heated from the bottom, inner leads are positioned on the bumps provided on the top, and pressure is applied from above using a dedicated bonding crane.

しかしながらこの場合、専用のボンディングツルが必要
であるために、製造コストに影響を与えるという問題が
あった。However, in this case, since a dedicated bonding tool is required, there is a problem in that the manufacturing cost is affected.

また、ボンディングツールによる加圧によりバンプにク
ラックが発生するという問題もあった。There was also the problem that cracks were generated in the bumps due to the pressure applied by the bonding tool.

（発明が解決しようとする課題） このように従来のＴＡＢ方式におけるシングルポイント
ボンディングを行う装置においては、専用のボンディン
グツールが必要であるため製造コストに影響を与え、ま
たボンディングツールによる加圧によりバンプにクラッ
クが発生するという問題があった。(Problems to be Solved by the Invention) As described above, in the conventional single point bonding device using the TAB method, a dedicated bonding tool is required, which affects manufacturing costs, and the pressure applied by the bonding tool causes bumps to be removed. There was a problem that cracks occurred.

本発明は、このような量論を解決するために成されたも
ので、ＴＡＢ方式におけるシングルポイントボンディン
グを製造コストに影響を与えることなく行うことができ
、しかもクラック等の不具合の発生を抑えることができ
るワイヤレスボンディング装置を提供することを目的と
している。The present invention has been made to solve such stoichiometric problems, and allows single point bonding in the TAB method to be performed without affecting manufacturing costs, while suppressing the occurrence of defects such as cracks. The purpose is to provide a wireless bonding device that can perform

［発明の構成コ （課題を解決するための手段） 本発明は、上述した目的を遠戚するために、キャリアフ
ィルムより導出される各リードを各被接続部に個別にワ
イヤレスボンディングを行う装置において、前記被接続
部上に位置する前記リド上にワイヤ導出口が接触するキ
ャピラリと、レザ光を発振するレーザ発振器と、このレ
ーザ発振器より出力されるレーザ光を前記キャピラリの
ワイヤ導入口に導入するファイバケーブルとを具備する
ものである。[Structure of the Invention (Means for Solving the Problem)] In order to achieve the above-mentioned object, the present invention provides an apparatus for individually wirelessly bonding each lead derived from a carrier film to each connected part. , a capillary whose wire outlet is in contact with the lid located on the connected part, a laser oscillator that oscillates laser light, and a laser light output from the laser oscillator that is introduced into the wire inlet of the capillary. A fiber cable is provided.

（作　用） 本発明では、汎用の治具であるキャピラリを用いてワイ
ヤレスボンディングを行っているので、製造コストに影
響を与えることはない。また、レザ光を用いてワイヤレ
スボンディングを行っているので、加圧を行う必要がな
く、従ってクラック等の不具合の発生を抑えることがで
きる。(Function) In the present invention, since wireless bonding is performed using a capillary, which is a general-purpose jig, manufacturing costs are not affected. Furthermore, since wireless bonding is performed using laser light, there is no need to apply pressure, and therefore it is possible to suppress the occurrence of defects such as cracks.

（実施例） 以下、本発明の実施例を図面に基づき説明する。(Example) Embodiments of the present invention will be described below based on the drawings.

第１図は本発明の一実施例に係るワイヤレスボンディン
グ装置の構成を示す図である。FIG. 1 is a diagram showing the configuration of a wireless bonding device according to an embodiment of the present invention.

同図において、１はワイヤボンディングに使用される汎
用のキャピラリ、２はこのキャピラリ１に接続された超
音波ホーンを示している。In the figure, 1 is a general-purpose capillary used for wire bonding, and 2 is an ultrasonic horn connected to this capillary 1.

また、３はレーザ光を発振するレーザ発振器であり、こ
のレーザ発振器３より出力されるレーザ光はファイバケ
ーブル４を介してキャピラリ１のワイヤ導入口に導入さ
れる。Further, 3 is a laser oscillator that oscillates a laser beam, and the laser beam output from this laser oscillator 3 is introduced into the wire introduction port of the capillary 1 via a fiber cable 4.

更に、５はキャピラリ１の先端がリードに接触したこと
を検出するタッチセンサであり、このタッチセンサ５に
よる検出結果は中央処理装置（ＣＰＵ）６に伝えられる
。中央処理装置６はこの検出結果基づきレーザ発振器３
のオン／オフを制御する。Furthermore, 5 is a touch sensor that detects when the tip of the capillary 1 comes into contact with a lead, and the detection result by this touch sensor 5 is transmitted to a central processing unit (CPU) 6. The central processing unit 6 controls the laser oscillator 3 based on this detection result.
control on/off.

次に、このように構成された装置の動作を説明する。Next, the operation of the device configured in this way will be explained.

まず、ＩＣチップ７のバンプ８上にキャリアフィルム９
より導出されるインナリード１０を位置させる。First, a carrier film 9 is placed on the bump 8 of the IC chip 7.
The inner lead 10 that is led out is positioned.

次に、インナリード１０上にキャピラリ１のワイヤ導出
口を垂直に接触させる。Next, the wire outlet of the capillary 1 is vertically brought into contact with the inner lead 10 .

そして、キャピラリ１のワイヤ導出口がインチリード１
０上に接触すると、タッチセンサ５によりこのことが検
出され、この検出結果は中央処理装置６に伝えられる。Then, the wire outlet of capillary 1 is set to inch lead 1.
0, this is detected by the touch sensor 5 and the detection result is transmitted to the central processing unit 6.

すると、中央処理装置６は、レーザ発振器３をオンとす
る制御を行う。Then, the central processing unit 6 performs control to turn on the laser oscillator 3.

これによりレーザ発振器３よりレーザ光は出力され、こ
のレーザ光はファイバケーブル４を介してキャピラリ１
のワイヤ導入口に導入される。As a result, laser light is output from the laser oscillator 3, and this laser light is transmitted to the capillary 1 via the fiber cable 4.
is introduced into the wire inlet.

そして、レーザ光は、第２図に示すように、キャピラリ
１の内部を通りワイヤ導出口よりインチリード１０に照
射され、インナリード１０はバンプ８に接続される。Then, as shown in FIG. 2, the laser beam passes through the inside of the capillary 1 and is irradiated onto the inch lead 10 from the wire outlet, and the inner lead 10 is connected to the bump 8.

このように本実施例のワイヤレスボンディング装置によ
れば、汎用の治具であるキャピラリ１を用いてワイヤレ
スボンディングを行っているので、従来の専用の治具を
用いる場合に比べ製造コストに与える影響は極めて小さ
い。また、レーザ光を用いてワイヤレスボンディングを
行っているので、従来のように加圧を行う必要がなく、
従ってクラック等の不具合の発生を抑えることができる
。As described above, according to the wireless bonding apparatus of this embodiment, since wireless bonding is performed using the capillary 1, which is a general-purpose jig, the impact on manufacturing costs is less than when using a conventional dedicated jig. Extremely small. In addition, since wireless bonding is performed using laser light, there is no need to apply pressure as in conventional methods.
Therefore, occurrence of defects such as cracks can be suppressed.

尚、上述した実施例においては、インナリードをボンデ
ィングする場合について説明したが、アウタリードをボ
ンディングする場合ついても同様に実施することができ
る。In the above-mentioned embodiment, the case where the inner lead is bonded has been described, but the case where the outer lead is bonded can be implemented in the same manner.

［発明の効果］ 以上説明したように、本発明によれば、ＴＡＢ方式にお
けるシングルポイントボンディングを製造コストに影響
を与えることなく行うことができ、しかもクラック等の
不具合の発生を抑えることができる。[Effects of the Invention] As described above, according to the present invention, single point bonding in the TAB method can be performed without affecting manufacturing costs, and the occurrence of defects such as cracks can be suppressed.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例に係るワイヤレスボンディン
グ装置の構成を説明するための図、第２図は第１図の一
部拡大断面図である。 １・・・キャピラリ、２・・・超音波ホーン、３・・・
レザ発振器、４・・・ファイバケーブル、５・・タッチ
センサ、６・・・中央処理装置（ＣＰＵ）　、７・・・
ＩＣチップ、８・・・バンプ、９・・・キャリアフィル
ム、１０・・・インナリード。FIG. 1 is a diagram for explaining the configuration of a wireless bonding device according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of FIG. 1. 1... Capillary, 2... Ultrasonic horn, 3...
Laser oscillator, 4... Fiber cable, 5... Touch sensor, 6... Central processing unit (CPU), 7...
IC chip, 8... bump, 9... carrier film, 10... inner lead.

Claims (1)

【特許請求の範囲】 キャリアフィルムより導出される各リードを各被接続部
に個別にワイヤレスボンディングを行う装置において、 前記被接続部上に位置する前記リード上にワイヤ導出口
が接触するキャピラリと、 レーザ光を発振するレーザ発振器と、 このレーザ発振器より出力されるレーザ光を前記キャピ
ラリのワイヤ導入口に導入するファイバケーブルと を具備することを特徴とするワイヤレスボンディング装
置。[Scope of Claims] An apparatus for individually performing wireless bonding of each lead led out from a carrier film to each connected part, comprising: a capillary whose wire outlet comes into contact with the lead located on the connected part; A wireless bonding device comprising: a laser oscillator that oscillates laser light; and a fiber cable that introduces the laser light output from the laser oscillator into the wire introduction port of the capillary.
JP2017414A 1990-01-25 1990-01-25 Wireless bonder Pending JPH03220741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017414A JPH03220741A (en) 1990-01-25 1990-01-25 Wireless bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017414A JPH03220741A (en) 1990-01-25 1990-01-25 Wireless bonder

Publications (1)

Publication Number Publication Date
JPH03220741A true JPH03220741A (en) 1991-09-27

Family

ID=11943347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017414A Pending JPH03220741A (en) 1990-01-25 1990-01-25 Wireless bonder

Country Status (1)

Country Link
JP (1) JPH03220741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons

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