JPH0321882B2 - - Google Patents
Info
- Publication number
- JPH0321882B2 JPH0321882B2 JP13180078A JP13180078A JPH0321882B2 JP H0321882 B2 JPH0321882 B2 JP H0321882B2 JP 13180078 A JP13180078 A JP 13180078A JP 13180078 A JP13180078 A JP 13180078A JP H0321882 B2 JPH0321882 B2 JP H0321882B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- electrical
- pin
- optical signal
- signal transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 claims 4
- 239000000835 fiber Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/381—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres
- G02B6/3817—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres containing optical and electrical conductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Description
【発明の詳細な説明】
本発明は結合装置（コネクタあるいはピン）に
関し、特に光信号と電気信号を同一結合装置によ
つて接続する電気−光複合結合装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a coupling device (connector or pin), and more particularly to an electrical-optical composite coupling device that connects optical signals and electrical signals through the same coupling device.
近年、高速度化を目的とする電気回路および通
信方式の研究が活発に行なわれているが、高速度
化の究極としては伝送遅延時間が最も小さい光の
利用が確実視されている。通信方式としてはフア
イバーを利用した光通信が実用化の段階まで到達
しているが、これらの方式においては光と電気と
は通常別個に扱われ、同時に電気信号（一定電圧
ないしは一定電流を含む）と光信号（同様一定の
ものを含む）を伝達することはあまり考えられて
いなかつた。 In recent years, research has been actively conducted on electrical circuits and communication systems aimed at increasing speed, and it is certain that the ultimate method for increasing speed will be the use of light, which has the smallest transmission delay time. As a communication method, optical communication using fiber has reached the stage of practical use, but in these methods, light and electricity are usually treated separately, and at the same time electrical signals (including constant voltage or constant current) are and the transmission of optical signals (including constant ones) was not given much thought.
光の高速性を最大限に利用するには外部伝送装
置のみならず回路部分にも光回路を導入するのが
有利であることは明らかである。同時に電気信号
として入出力する方が便利な信号もある。従つて
電気信号と光信号とを並列に伝達することがより
好ましい。 It is clear that in order to make maximum use of the high speed of light, it is advantageous to introduce an optical circuit not only into the external transmission device but also into the circuit portion. There are some signals that are more convenient to input and output as electrical signals at the same time. Therefore, it is more preferable to transmit the electrical signal and the optical signal in parallel.
本発明の目的は、取扱いが便利な電気−光複合
結合装置を提供することである。 An object of the present invention is to provide an electrical-optical composite coupling device that is convenient to handle.
本発明の他の目的は従来の回路装置形式と両立
し得る電気−光複合結合装置を提供することであ
る。 Another object of the invention is to provide a combined electrical-optical coupling device that is compatible with conventional circuitry types.
以下図面を参照して本発明を詳細に説明する。 The present invention will be described in detail below with reference to the drawings.
第１図は従来の実施例による電気−光共用コネ
クタを示す。コネクタの雄型１にはオプテイカル
フアイバから成る光信号用ピンＰ１１，Ｐ１２と
電気信号用ピンＰ１３，Ｐ１４，Ｐ１５とが設け
られている。コネクタの雌型２にも同様に光信号
用ピンＰ２１，Ｐ２２と電気信号用ピンＰ２３，
Ｐ２４，Ｐ２５とが設けられており、雄型雌型の
対応する光信号用ピン同志、電気信号用ピン同志
が結合する。 FIG. 1 shows a conventional electrical-optical connector. The male type 1 of the connector is provided with optical signal pins P11, P12 and electrical signal pins P13, P14, P15 made of optical fiber. Similarly, the female type 2 of the connector has optical signal pins P21, P22 and electrical signal pins P23,
P24 and P25 are provided, and the corresponding optical signal pins and electrical signal pins of the male and female types are coupled together.
雌型２に用いる光信号用ピンの構造を拡大して
第２図に示してある。ガイド３は雄型の対応する
ピンＰ１１の進入方向を案内する筒状のものであ
り、端部にオプテイカルフアイバから成る導光路
４が接続されている。ガイド３の内壁面は高反射
率の金属（たとえば金、銀あるいはその他の金
属）で鍍金されていることが好ましい。第１図の
構成で光信号用ピンの長さが電気信号用ピンの長
さより短かくしてあるのは、結合時にはじめに電
気信号用ピンが係合し、機械的に弱い光信号用ピ
ンが結合前に所定の位置に配置されるようにする
ためである。他の適当な手段で光信号用ピンが破
壊から守られていれば同一長の構成としてもよ
い。導光路は、集束形、クラツド形、Ｗ形、均一
屈折率形等のいずれでもよい。ただし、非常に高
速度の動作を行なう集積回路の場合には、伝送す
るパスルの形が崩れない集束形やＷ形導光路にす
ることが望ましい。光信号用ピンの導光路として
光集束性フアイバを用いれば多数個の光信号を一
本のフアイバで伝送できるので、所定の数の光信
号を伝送するのに必要な光伝送用フアイバの数を
減少させることができる。 The structure of the optical signal pin used in the female mold 2 is shown in an enlarged scale in FIG. The guide 3 has a cylindrical shape that guides the male pin P11 in the direction of entry, and a light guide path 4 made of an optical fiber is connected to the end thereof. The inner wall surface of the guide 3 is preferably plated with a highly reflective metal (for example, gold, silver, or other metal). In the configuration shown in Figure 1, the length of the optical signal pin is made shorter than the length of the electrical signal pin, because the electrical signal pin engages first during coupling, and the optical signal pin, which is mechanically weaker, is engaged before coupling. This is to ensure that it is placed at a predetermined position. The same length configuration may be used if the optical signal pins are protected from destruction by other suitable means. The light guide path may be of a convergent type, clad type, W type, uniform refractive index type, or the like. However, in the case of an integrated circuit that operates at a very high speed, it is desirable to use a converging type or W-shaped light guide that does not distort the shape of the transmitted pulses. If an optical convergence fiber is used as the light guide path for the optical signal pin, many optical signals can be transmitted with one fiber, so the number of optical transmission fibers required to transmit a given number of optical signals can be calculated by can be reduced.
本発明は、上記の光信号用ピンと電気信号用ピ
ンが一体化された複合型ピンを有することを特徴
とする。 The present invention is characterized by having a composite pin in which the optical signal pin and the electrical signal pin described above are integrated.
第３図に本発明の電気−光複合結合装置におけ
る光信号と電気信号を同時に伝達する複合型ピン
の構成を示す。芯線１１、外管１３はコーバル等
の導電性物質で成り、電気信号を伝達し、中間層
１２はガラス等あるいはその他の透光性物質で成
り導光路を形成する。雄型、雌型結合時に、芯線
同志、外管同志は機械的電気的に係合する必要が
あるが、中間層同志は光学的に係合すれば機械的
には少し隔離していてもよい。また、最近開発さ
れている各種フアイバ結合器を用いてもよいこと
はもちろんである。 FIG. 3 shows the configuration of a composite pin that simultaneously transmits optical signals and electrical signals in the electrical-optical composite coupling device of the present invention. The core wire 11 and the outer tube 13 are made of a conductive material such as Kobal and transmit electrical signals, and the intermediate layer 12 is made of glass or other transparent material to form a light guide path. When connecting the male and female molds, the core wires and outer tubes must be mechanically and electrically engaged, but the intermediate layers may be mechanically separated a little as long as they are optically engaged. . It goes without saying that various recently developed fiber couplers may also be used.
第３図の構成では導光路の内側と外側とに導電
性物質が配置されているが、その一方を除いた構
成も目的によつては便利である。特に外管内に集
束性フアイバを装架する型は外管がフアイバの保
護と電気信号の伝達線を兼ねるので利用価値が高
い。又フアイバの外周に金属層を鍍金、蒸着等に
よつて形成することもできる。たとえば少なくと
も外周がSiO2で形成されたフアイバにCr，Cu，
Auをこの順に蒸着することによつて外側導電層
を形成できる。 In the configuration shown in FIG. 3, conductive materials are placed on the inside and outside of the light guide, but a configuration in which one of the conductive materials is removed may be convenient depending on the purpose. Particularly, the type in which the focusing fiber is mounted within the outer tube has high utility value because the outer tube serves both as a protection for the fiber and as a transmission line for electrical signals. A metal layer can also be formed on the outer periphery of the fiber by plating, vapor deposition, or the like. For example, a fiber whose outer periphery is made of SiO 2 is coated with Cr, Cu,
The outer conductive layer can be formed by depositing Au in this order.
最も簡略化した構造としては、内空の金属管を
そのまま光−電気伝達ピンとして用いることもで
きる。 In the simplest structure, a hollow metal tube can be used as it is as a light-electrical transmission pin.
次に本発明を半導体集積回路に適用した実施例
を説明する。第４図にその一例を示す。 Next, an embodiment in which the present invention is applied to a semiconductor integrated circuit will be described. An example is shown in FIG.
セラミツク基板２１は、所定形状の凹部及び溝
を有し、凹部には光集積回路の半導体ペレツト２
２が、溝には複合型ピン２３、および光信号用フ
アイバ２４が載置される。フアイバ２５は単に入
力から出力に光信号を伝える。複合型ピン２３は
半導体ペレツトの所定の場所とAuまたはAl線で
ボンデイングされ、電気信号を伝達する。フアイ
バ２４はエポキシ樹脂等で半導体ペレツトに結合
される。その後全体をレジンモールドして光およ
び電気用ピンを持つ光集積回路装置を形成する。
もちろん、導光路が直接半導体ペレツトの入出力
端子に届くように構成することもできる。 The ceramic substrate 21 has recesses and grooves of a predetermined shape, and the semiconductor pellets 2 of the optical integrated circuit are placed in the recesses.
2, a composite pin 23 and an optical signal fiber 24 are placed in the groove. Fiber 25 simply carries optical signals from input to output. The composite pin 23 is bonded to a predetermined location of the semiconductor pellet with Au or Al wire, and transmits an electrical signal. Fiber 24 is bonded to the semiconductor pellet with epoxy or the like. Thereafter, the entire structure is resin molded to form an optical integrated circuit device having optical and electrical pins.
Of course, it is also possible to configure the light guide path to directly reach the input/output terminals of the semiconductor pellet.
レジンモールドの代わりにカン封入型とするこ
ともできる。又上記実施例では単一の光集積回路
ペレツトを用いたが、同一の基板上に複数のペレ
ツトを配したハイブリツド構造とすることもでき
る。 Instead of a resin mold, a can encapsulation type can also be used. Further, although a single optical integrated circuit pellet was used in the above embodiment, a hybrid structure in which a plurality of pellets are arranged on the same substrate may also be used.
第５図ａ乃至ｃに他のピン形状を示す。 Other pin shapes are shown in Figures 5a-c.
第５図ａではピンがモールドの上下面から突出
し、第５図ｂではモールドの片側側面から出て下
方へ屈曲し、第５図ｃではモールドの両側面から
出て共に下方へ屈曲している。第５図ｂ，ｃのよ
うにピンが屈曲している構造のものは第３図に開
連して説明したような複合構造のピンが適する。 In Fig. 5a, the pin protrudes from the upper and lower surfaces of the mold, in Fig. 5b, it protrudes from one side of the mold and bends downward, and in Fig. 5c, it protrudes from both sides of the mold and bends downward. . For the structure in which the pin is bent as shown in FIGS. 5b and 5c, a compound structure pin as explained in connection with FIG. 3 is suitable.
以上説明したように、本発明によれば光信号を
電気信号と同様に接続、供給できるため電気−光
回路の設計、実装が非常に容易となる。 As described above, according to the present invention, optical signals can be connected and supplied in the same way as electrical signals, making it extremely easy to design and implement electrical-optical circuits.
第１図は従来の一実施例による電気−光複合コ
ネクタの部分破断斜視図、第２図は第１図のコネ
クタの光信号用ピンの拡大針視図、第３図は本発
明の一実施例による光信号用複合型ピンの斜視
図、第４図は本発明の他の実施例による電気−光
集積回路装置の斜視図、第５図ａ乃至ｃは本発明
の他の実施例による電気−光集積回路装置のピン
配列を示す斜視図である。
FIG. 1 is a partially cutaway perspective view of a conventional electrical-optical composite connector according to an embodiment, FIG. 2 is an enlarged needle perspective view of an optical signal pin of the connector of FIG. 1, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a perspective view of an electrical-optical integrated circuit device according to another embodiment of the present invention, and FIGS. - It is a perspective view showing the pin arrangement of the optical integrated circuit device.
Claims (1)
芯線を同心円状に囲む透光性物質からなる光信号
伝達用導波路を有し、該芯線と該光信号伝達用導
波路を一体に同心円状に囲む金属筒からなる電気
信号伝達部を有する雄型電気光信号伝達用端子を
複数個同一装置内に並列配置した電気−光複合結
合装置。1. Having a core wire made of a conductive material in the center, and having an optical signal transmission waveguide made of a transparent material concentrically surrounding the core wire, and integrating the core wire and the optical signal transmission waveguide. An electric-optical composite coupling device in which a plurality of male electro-optical signal transmission terminals each having an electric signal transmission portion made of a metal tube surrounded by concentric circles are arranged in parallel within the same device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13180078A JPS5559413A (en) | 1978-10-25 | 1978-10-25 | Electricity-light composite coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13180078A JPS5559413A (en) | 1978-10-25 | 1978-10-25 | Electricity-light composite coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5559413A JPS5559413A (en) | 1980-05-02 |
| JPH0321882B2 true JPH0321882B2 (en) | 1991-03-25 |
Family
ID=15066399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13180078A Granted JPS5559413A (en) | 1978-10-25 | 1978-10-25 | Electricity-light composite coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5559413A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121914U (en) * | 1981-01-23 | 1982-07-29 | ||
| JPS6217764Y2 (en) * | 1981-01-23 | 1987-05-08 | ||
| JPS6263951U (en) * | 1985-10-11 | 1987-04-21 |
-
1978
- 1978-10-25 JP JP13180078A patent/JPS5559413A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5559413A (en) | 1980-05-02 |
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