JPH03218646A - Tape carrier, semiconductor integrated circuit device and aging method therefor - Google Patents

Abstract

PURPOSE:To contrive the improvement of productivity in a tape assembly operation by a method wherein the title device is provided with a jumper pellet bonded on a tape carrier in such a way that it is individually connected with at least one of a first group of conductor patterns and a second group of conductor patterns. CONSTITUTION:Individual inner end parts 13a of a group of a plurality of conductor patterns 13 on a tape carrier 10 are bonded on bonding pads 20a, which correspond to the inner end parts 13, on a product pellet 20. At the same time as that, connection ends 131 to 133 of an individual group of conductor patterns 13 are brought into a state that they are respectively connected electrically in parallel to conductor patterns 15a to 15c of a group 15 of conductor patterns common to a plurality of product pellets 20 via a jumper pellet 30. Accordingly, operating power, an actuating signal and the like can be impressed en bloc on a plurality of the product pellets 20 from one end of the carrier 10, for example, via the group 15. Thereby, productivity in a tape assembly operation including an aging process, in which the carrier 10 is used, and an aging process is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape carrier, a semiconductor integrated circuit device, and an aging technique thereof, and particularly to a technique effective when applied to a tape assembly technique using a tape carrier.

[Conventional technology]

For example, Kogyo Kenkyukai Co., Ltd., November 20, 1982.
Published by Japan, [Electronic Materials J November 1984 issue special issue P12
1 to P124, etc.,
In the assembly process of semiconductor integrated circuit devices, efforts are being made to improve mass productivity by using so-called tape assembly technology, which combines wireless bonding and continuous assembly using tape carriers.

That is, a finger-shaped conductor pattern is formed in the perforated part of an insulating long tape, and external connection electrodes of a product pellet (IC pellet) with bumps are continuously bonded to this pattern all at once. During transportation and shipping during each assembly process, long tapes are wound around reels to facilitate handling and loading of products into automatic assembly or automatic mounting equipment.
This is intended to improve mass productivity in the assembly and mounting process of a large number of semiconductor integrated circuit devices.

On the other hand, when shipping or receiving semiconductor integrated circuit devices, a number of characteristic screenings are carried out to determine whether the product is good or bad, and to rank it. In order to stabilize the characteristics, products are subjected to aging by storing them at high temperatures or operating them continuously for a predetermined period of time.

By the way, when implementing such a process in the manufacturing process of a semiconductor integrated circuit device using tape assembly technology, conventionally, each conductor pattern group to be individually connected to a product pellet is individually provided. For,
It is impossible to supply operating power to individual product pellets while the long tape is wound on a reel.

[Problem to be solved by the invention]

For this reason, for example, by unrolling a long tape from a reel, dividing it into relatively short lengths, and installing the product pellets belonging to each division unit into a predetermined socket, each division unit can be Aging is performed by charging each product pellet into a heating furnace and applying operating power and operating signals to each individual product pellet. After aging is completed, the divided units are reconnected as before and restored to a long table. However, this would require extra work such as dividing and restoring the long tape, and it would not be possible to take advantage of the tape assembly technology's inherent advantages of handling multiple products at once while still using the long tape. There is a problem.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a tape carrier that can improve productivity in tape assembly.

Another object of the present invention is to provide a semiconductor integrated circuit device that can reduce manufacturing costs.

Still another object of the present invention is to provide an aging method that can improve productivity in tape assemblies.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the tape carrier according to the present invention includes a long insulating tape, a plurality of first through holes drilled at desired intervals in the longitudinal direction of the insulating tape, and the first through hole. A tape carrier comprising a plurality of first conductor patterns arranged to surround each of the insulating tapes and to which a product pellet is bonded to one end protruding inside the first through hole, the tape carrier comprising an insulating tape. a second conductor pattern group provided in common to the plurality of first conductor pattern groups along the longitudinal direction; and at least a portion of each of the second conductor pattern groups and the first conductor pattern groups. It has a wiring structure that connects individually, and includes jumper pellets that are bonded to connect at least a part of the first conductor pattern group and the second conductor pattern group individually. .

Further, a semiconductor integrated circuit device according to the present invention is manufactured using the tape carrier according to claim 1 or 2.

Furthermore, in the aging method of the present invention, after bonding a plurality of product pellets and jumper pellets, the tape carrier wound on a reel is put into an aging furnace at a desired temperature, and the ends of the tape carrier are Aging is performed by collectively applying at least one of an operating power and an operating signal to a plurality of product pellets through the second conductor pattern group.

[Effect]

According to the tape carrier of the present invention described above, for example,
By bonding the jumper pellets when bonding multiple product pellets to the insulating tape, it is possible to avoid making the tape carrier an unnecessarily complex and expensive multi-layer structure. At least a portion of each first conductor pattern group to which individual product pellets are bonded can be connected in parallel to the second conductor pattern group.

Therefore, during aging, which is carried out at a desired time after bonding, the long insulating tape is placed into a heating furnace at the desired temperature while still being wound around a reel. Power can be collectively supplied from the second conductor pattern group at one end to each of a plurality of product pellets that are commonly connected to the second conductor pattern group via jumper pellets, and the tape can be Complicated work such as separating and restoring the carrier is completely unnecessary, and productivity in tape assembly can be greatly improved.

Further, according to the semiconductor integrated circuit device of the present invention described above, for example, assembly can be performed using a tape assembly in which the aging process is greatly simplified without using a tape carrier with a complicated and expensive multilayer structure. Therefore, manufacturing costs can be reduced.

Further, according to the aging method of the present invention described above, there is no need to perform complicated operations such as dividing and restoring the tape carrier, and productivity in tape assembly is improved.

〔Example〕

FIG. 1 is a perspective view schematically showing an example of a tape carrier according to an embodiment of the present invention and a semiconductor integrated circuit device assembled using the tape carrier, and FIG. 2 is a schematic perspective view of a part thereof. FIG. 3 is a perspective view schematically showing an example of an aging method according to an embodiment of the present invention.

Long insulating tape 11 constituting tape carrier 10
A plurality of through holes 1 are formed at a desired pitch in the longitudinal direction in the center of the
2 (first through holes) are bored, and a conductor is formed in a position surrounding each through hole 12 almost radially around the through hole 12 by, for example, etching a metal foil or the like. Pattern group 13 (first conductor pattern group)
is located.

The inner end portions 13a of the plurality of conductor patterns constituting the conductor pattern group 13 protrude by a desired length into the through hole 12, and are formed with, for example, an integrated circuit structure having a desired function. It has a structure in which it is collectively bonded to each of the plurality of bonding pads 20a of the product pellet 20 at the time of bonding. The outer end of each of the plurality of conductor patterns constituting the conductor pattern group 13 is widened to a desired width, and serves as a test pad 13b to which a probe or the like is contacted in, for example, a characteristic selection process.

Perforations 14 are perforated at a desired pitch on the outer edge of the insulating tape 11 in the longitudinal direction, and if necessary, by fitting a feeding claw or the like (not shown) into the perforations 14, the tape carrier Ten longitudinal feeding movements are performed.

Then, the product pellet 20 for the conductor pattern group l3
After bonding, for example, each product pellet 20 is bonded to a desired area of the conductor pattern group l3 connected to the product pellet 20 at a desired time after a desired sealing process, aging and characteristic selection as described below. Individual semiconductor integrated circuit devices 10A are formed by punching out the tape carrier 10.

In this case, on one outer edge in the longitudinal direction of the tape carrier 10, a plurality of electrically independent conductor patterns 15a, 15b are provided along the front and near the inside of the perforation 14.
, 15c (second conductor pattern group) is formed.

Further, a plurality of through holes 16 (second through holes) are bored in the insulating tape 11 along the path of the conductor pattern group 15 at positions adjacent to each of the plurality of through holes 12 .

The conductive pattern group 15 is cut at the passing portion in each of the through holes 16, and the connecting ends 150A. Connection end 15
0B. Connection end 150C and connection end 150a. Connection end 1
50b, forming a connecting end 150C.

Each of the plurality of conductor pattern groups l3 is formed by extending the test pads 13b at the outer ends of some of the conductor patterns belonging to the conductor pattern group 13 so as to protrude into the corresponding through holes 16. Multiple connections made #131
．． A connecting end 132 and a connecting end 133 are provided.

Then, connection ends 1508 to 150 of the conductor pattern group 15
The jumper pellets 30
They are individually electrically connected by bonding.

That is, this jumper pellet 30 includes the connection ends 150A to 150B of the conductor pattern group 15 and the connection end 1.
50a to 150c, a plurality of bonding pads 300A. Bonding pad 300B,
Bonding pad 300C, bonding pad 300a, bonding pad 300b
．． Bonding pad 300C and bonding pad 301. A bonding pad 302 and a bonding pad 303 are provided.

These bonding pads are electrically connected to each other as shown in the circuit diagram shown in FIG. 4 by a circuit pattern formed inside the jumper pellet 30 by, for example, a well-known multilayer wiring technique. .

As a result, by bonding the jumper pellets 30, the connection ends 150A to 150C of the conductor pattern group 15 common to the plurality of conductor pattern groups 13 and the corresponding connection ends 150a to 150C are connected to each other, and The plurality of connection ends 131 to 133 of each of the plurality of conductor pattern groups 13 to which the plurality of product pellets 20 are respectively bonded are individually parallel to each of the corresponding conductor patterns 15a to 15c of the conductor pattern group 15. It will be connected to.

On the other hand, the aging apparatus 50 in which the aging method of this embodiment is carried out includes, for example, a heating furnace 51 capable of heating the inside to a desired temperature, as shown in FIG.
, a power supply section 52 that generates desired operating power and operation signals to be applied to the product pellet 20 bonded to the tape carrier IO; this power supply section 52; and the tape carrier 10 wound around the reel 40. and a cable 53 connecting one end of the .

Further, a socket 54 is provided at the connection end of the cable 53 to the tape carrier 10, and is provided in the longitudinal direction of the tape carrier 10, and is provided with a jumper as described above.
It serves to electrically connect the conductor pattern group 15, which is commonly and parallelly connected to a plurality of product pellets 20 by bonding the pellets 30, to the cable 53.

An example of the operation of this embodiment will be described below.

First, a tape carrier 1 having a structure as illustrated in FIG.
0, multiple product pellets 20 and Jamba
Bonding of the pellets 30 is performed.

As a result, the inner end portions 13a of each of the plurality of conductor pattern groups 13 are bonded to the bonding pads 20H corresponding to the product pellets 20, and each of the connection ends 131 to 133 of the individual conductor pattern groups 13 is connected to the jumper. - They are electrically connected in parallel via the pellets 30 to the conductor patterns 158 to 15C of the conductor pattern group 15 common to the plurality of product pellets 20, respectively.

Although not particularly illustrated, the above-described bonding is usually performed by passing the tape carrier 10, which is sequentially fed out from the feed reel to the take-up reel side, through the bonding area, and after the bonding is completed, the tape carrier 10 is It is wound on the reel 40 on the take-up side.

In the case of this embodiment, during the aging treatment after bonding as described above, for example, the tape carrier 10 wound around the reel 40 is placed inside the heating furnace 51 shown in FIG. At the same time, the conductor pattern group 15 at one end of the tape carrier 10 is connected to the power supply unit 52 via the socket 54 and the cable 53, and the jumper pellets held by the tape carrier 10 are heated to a desired aging temperature. Aging is performed while simultaneously applying operating power, operating signals, etc. from the power supply unit 52 to each of the plurality of product pellets 20 connected in parallel to the conductor pattern group 15 via the conductor pattern group 15 via the conductor pattern group 15 .

In such a characteristic selection process after aging, the jumper pellets 30 are punched out and removed in advance to separate the individual product pellets 20 and the individual conductor pattern groups 13 bonded to the product pellets 20. After making them electrically independent, a probe or the like is brought into contact with the test pad 13b of each conductor pattern group 13, and an individual test signal is applied to each product pellet 20 to smoothly select the characteristics. .

In this way, in the case of the tape carrier 10 of the present embodiment, by using the jumper pellets 30, the plurality of layers bonded to the tape carrier 10 can be removed without having to make the tape carrier 10 have an expensive multilayer structure. Since the product pellets 20 are connected in parallel to the conductor pattern group 15 provided in common to the plurality of product pellets 20, operating power and operation are transmitted from one end of the tape carrier 10 via the conductor pattern group 15. A signal or the like can be applied to a plurality of product pellets 20 at once.

Therefore, during aging, the tape carrier 10 is placed into the heating furnace 51 while being wound around the reel 40, which is easy to handle. It is now possible to supply operating power and the like to all of the product pellets 20 at once, and for example, the tape carrier can be divided into a predetermined number of product pellets before and after aging after bonding, as in the conventional case. As a result, the complicated work of re-splicing and restoring is completely unnecessary, and as a result, the productivity in the tape assembly including the aging process and the aging process using the tape carrier 10 of this embodiment is greatly improved.

Further, when connecting the conductor pattern group 15 consisting of the plurality of conductor patterns 158 to 15C and the plurality of connection ends 131 to 133 of the conductor pattern group 13 in parallel so as to intersect with the conductor pattern group 15, the individual conductor patterns Pattern 158~15C
In order to ensure mutual electrical insulation, it is necessary to have a complex and expensive multilayer structure in which insulating layers and conductive layers are alternately laminated. However, in the case of the tape carrier 10 of this embodiment, Due to the multilayer wiring structure provided inside the jumper pellet 30, a plurality of bonding pads 301 to 303, 300a to 300c of the jumper pellet 30 are connected to each other.
．． 300, A to 300C are interconnected, and it is easy to manufacture jumper helets 30 having such a structure in large quantities at low cost using well-known photolithography technology.

As a result, after bonding the product pellets 20 to the conductor pattern group 13 formed on the tape carrier 10, compared to the case where a multilayered tape carrier is used,
The manufacturing cost of a semiconductor integrated circuit device constructed by punching out a desired region of the corresponding conductor pattern group 13 from the product pellet 20 can be significantly reduced.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the structures and shapes of the jumper pellet 30, the tape carrier, and the conductor pattern group 13 and conductor pattern group 15 formed thereon are not limited to those exemplified in the above embodiments.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

That is, according to the tape carrier of the present invention, a long insulating tape, a plurality of first through holes bored at desired intervals in the longitudinal direction of the insulating tape, and A tape carrier comprising a plurality of first conductor patterns arranged to surround each of the through holes and to which a product pellet is bonded to one end protruding inside the first through hole, the tape carrier comprising: A second conductor pattern commonly provided in the plurality of first conductor pattern groups along the longitudinal direction of the insulating tape.
a conductor pattern group, and a wiring structure that individually connects the second conductor pattern group and at least a part of each of the first conductor pattern groups; The structure consists of jumper pellets that are individually bonded to at least some of the conductor patterns of the tape carrier, so it is possible to maintain insulation properties without making the tape carrier an unnecessarily complex and expensive multilayer structure. At least a portion of each first conductor pattern group, to which individual product pellets are bonded, can be connected in parallel to a second conductor pattern group provided in the longitudinal direction of the tape.

Therefore, during aging, which is carried out at a desired time after bonding, the long insulating tape is placed into a heating furnace at the desired temperature while still being wound around a reel. Power can be collectively supplied from the second conductor pattern group at one end to each of a plurality of product pellets that are commonly connected to the second conductor pattern group via jumper pellets, and the tape can be Complicated work such as separating and restoring the carrier is completely unnecessary, and productivity in tape assembly can be greatly improved.

Further, since the semiconductor integrated circuit device of the present invention is manufactured using the tape carrier according to claim 1 or 2, it is not necessary to use, for example, a tape carrier with a complicated and expensive multilayer structure. Since assembly is performed using a tape assembly with a greatly simplified merging process, manufacturing costs can be reduced.

Further, according to the enging method of the present invention, in the manufacturing process for semiconductor integrated circuit packaging according to claim 3, after bonding the plurality of product pellets and the jumper pellets, the tape remains wound around a reel. The carrier is placed in a processing furnace at a desired temperature, and at least operating power and operating signals are applied to a plurality of Baoki product pellets at once through the second conductor pattern group at the end of the tape carrier. Since aging is performed by supplying one of the tape carriers, there is no need to perform complicated operations such as dividing and restoring the tape carrier, improving productivity in tape assembly.

[Brief explanation of drawings]

FIG. 1 is a perspective view schematically showing an example of a tape carrier according to an embodiment of the present invention and a semiconductor integrated circuit device assembled using the tape carrier, and FIG. 2 is a schematic perspective view of a part thereof. 3 is a perspective view schematically showing an example of an aging method according to an embodiment of the present invention; FIG. 4 is a circuit diagram showing an example of a connection state of a wiring structure in a jumper pellet. be. DESCRIPTION OF SYMBOLS 10... Tape carrier, IOA... Semiconductor integrated circuit device, 11... Insulating tape, l2... Through hole (first through hole), 13... Conductor pattern group (first conductor pattern group), 13a...inner end, 13b...test pad, 131-133...1 series m, l4...perforation, 15... conductor pattern group (second conductor pattern group) , 15a-15c---conductor pattern,
150A-150C...Connection end, 150a-150c
... Connection end, 16... Through hole (second through hole), 20.
...Product pellets, 20a...Bontinkuhad,
30...Jumper Beret}, 300A~300C・
. . . Bonding had, 300a to 300C . . . Bonding pad, 301 to 303 . . . Bonding pad, 40 . . Reel, 50 . , 53...cable, 54...socket.

Claims (1)

[Claims] 1. A long insulating tape, a plurality of first through holes drilled at desired intervals in the longitudinal direction of the insulating tape, and each of the first through holes arranged so as to surround the first
A tape carrier comprising a plurality of first conductor patterns to which product pellets are bonded to one end protruding inside a through hole of the insulating tape, the plurality of first conductor patterns extending along the longitudinal direction of the insulating tape. a second conductor pattern group provided in common to the conductor pattern groups, and a wiring structure that individually connects the second conductor pattern group and at least a part of each of the first conductor pattern groups. , a jumper pellet bonded to individually connect the first conductive pattern group and at least a part of the second conductive pattern group. 2. A second through hole is formed in the insulating tape at the bonding site of the jumper pellet, and
Bonding of the jumper pellet to at least a portion of the first conductive pattern group protruding into the through hole and the second conductive pattern group is performed using the same bonding device as the product pellet. The tape carrier according to claim 1. 3. A semiconductor integrated circuit device manufactured using the tape carrier according to claim 1 or 2. 4. In the manufacturing process of a semiconductor integrated circuit device according to claim 3, after bonding the plurality of product pellets and the jumper pellets, the tape carrier wound on a reel is placed in an aging furnace at a desired temperature. and aging is performed by collectively supplying at least one of an operating power and an operating signal to a plurality of the product pellets through the second conductor pattern group at the end of the tape carrier. Method.