JPH03217256A - Electrode plate of collector - Google Patents

Abstract

PURPOSE:To increase the efficiency of collection of dust, to prevent spark and to restrict a leakage current by forming an electrically semiconductive layer on the surface of an electrode substrate. CONSTITUTION:An electrically semiconductive layer 10 is formed on the surface of an electrode substrate 5 molded from an insulating sheet of PP, PVC, etc., by coating with electrically semiconductive coating having about 10<6>-10<10>OMEGA electric resistance. The efficiency of collection of dust can be increased, spark can be prevented and a leakage current can be restricted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a collector electrode plate used for assembling a collector of an electrostatic precipitator incorporated into an air cleaner.

[Conventional technology]

An electric precipitator is composed of an ionizer that charges dust particles contained in the air sucked into the machine, and a collector that collects the dust particles charged by the ionizer.

This collector is assembled in such a manner that ground electrode plates and high voltage electrode plates are alternately stacked with gaps in between in a frame.

In the conventional collector electrode plate, as shown in FIGS. 14 to 16, a conductive paint is applied to the central part of one plate surface of an electrode substrate 1 formed of an insulating sheet such as polypropylene to form a conductive surface 2. is formed, and both sides of the conductive surface 2 are used as insulating surfaces 3, 3, and spacer protrusions 4, 4 are often formed on the other plate surface of the electrode substrate 1 at the portions corresponding to the insulating surfaces 3, 3. has been done.

[Problem to be solved by the invention]

In the conventional collector electrode plate described above, when the collector electrode plates are stacked in a frame and assembled, each conductive surface 2
The insulating surfaces 3, 3 on both sides of the conductive surfaces 2, 2 serve to prevent spark generation by increasing the linear spatial distance between the conductive surfaces 2, 2, and to prevent leakage current by increasing the creepage distance between the conductive surfaces 2, 2. It plays the role of making it as small as possible.

In order to increase the efficiency of dust collection in this collector, the following steps should be taken: ■ Increasing the electric field generated between each electrode plate, ■ Widening the part of each electrode plate that generates an electric field, ■ Increasing the laminated spacing between each electrode plate. However, in method (2), it is necessary to increase the voltage applied between each electrode plate, and if it is increased too much, sparks may occur and safety problems may occur. , (2), the pressure loss of the air passing through the collector increases. On the other hand, method (2) can increase the collection efficiency without causing the problems of methods (2) and (3), but if this method is applied to the production of the conventional collector electrode plate described above,
Since the width of the conductive surface 2 is widened and the width of the insulating surfaces 3, 3 is narrowed, the insulating surfaces 3, 3 cannot fulfill the above-mentioned role.

On the other hand, if the width of the conductive surface 2 is widened without narrowing the width of the insulating surfaces 3, 3, the width of the collector electrode plate will be expanded by that amount, which is the current strong demand for smaller and thinner collectors. become unable to respond to changes.

The present invention essentially does not require a current to form an electric field.
Taking advantage of the fact that an electric field can be formed by a layer with relatively high electrical resistance, that is, it has sufficient conductivity to form an electric field, and to prevent sparks and limit leakage current.
The purpose of the present invention is to provide a collector electrode plate that can simultaneously achieve high efficiency of dust collection, prevention of sparks, and limitation of leakage current by using a semiconductive layer having sufficiently high insulation properties. That is.

[Means to solve the problem]

In order to achieve the above object, the present invention is characterized in that (1) a semiconducting layer is formed on the plate surface of the electrode substrate; It is characterized by forming a semiconductive layer by applying a semiconductive paint on the plate surface of an electrode substrate formed from another insulating sheet, (3) the plate surface of an electrode substrate formed from an insulating sheet made of polypropylene or an equivalent material; An insulating surface is formed by applying an olefin-based insulating paint or an insulating paint containing an olefin-based paint, and a semiconducting layer is formed on this insulating surface by applying a non-olefin-based semiconductive paint. (Medium) A semiconducting layer is formed by coating an olefin-based semiconductive paint or a semiconductive paint containing an olefin-based paint on the plate surface of an electrode substrate formed from an insulating sheet made of polypropylene or a material with the same effect as polypropylene. It is characterized in that a semiconductive layer is formed on the layer by coating a semiconductive paint other than olefin.

[Effect]

Collector electrode plates having the above configuration are stacked in a collector frame with gaps provided by spacers to assemble a collector, and when the high voltage side and the ground side of a high voltage power supply are connected alternately to each collector electrode plate, the gaps between each semiconducting layer An electric field is formed between the electrode plates, and at the same time, the electric field formation area extends over the entire area between the electrode plates, and at the same time, the electrical resistance of both side portions of each semiconducting layer prevents sparks between the electrode plates and controls leakage current.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 13. Reference numeral 5 denotes an electrode substrate molded from an insulating sheet of polypropylene, vinyl chloride, or other material, and one end has a narrow width. Conductive terminal pieces 7 are connected to each other via a connecting piece 6, and an insulating terminal piece 9 is connected to the other end via a narrow connecting piece 8. Reference numeral 10 denotes a semiconductive layer 108 that covers the entire one side of the substrate 1 and one side of the connecting piece 6 and the conductive terminal piece 7.
It is formed by applying a semiconductive paint having an electrical resistance of Ω to 1010 Ω. Reference numerals 11 and 11 denote spacer protrusions, which are integrally molded, for example, so as to protrude in an appropriate number from both sides of the substrate 1 on which the semiconductive layer 10 is not formed at an appropriate interval. 12 is a collector electrode plate having the above structure.

In this collector electrode plate 12, when using the electrode substrate 5 formed from an insulating sheet made of polypropylene or a material with the same effect, the adhesive strength must be maintained unless the paint applied thereto is an olefin-based paint or a paint containing an olefin-based paint. Because these paints are weak and the surfaces coated with these paints are susceptible to melting and deterioration if dust such as oil or cigarette tar adheres to them, an olefin-based paint is applied to the entire surface of one side of the electrode substrate 5 as shown in Figure 4. An insulating surface 31 is formed by coating an insulating paint containing an insulating paint or an insulating paint containing an olefin-based paint, and a semiconductive paint other than an olefin-based paint is applied on the insulating surface 31, and the adhesive strength to the surface coated with the olefin-based paint is The semiconducting layer 10' may be formed by coating a semiconductive paint that is strong and resistant to the adhesion of dust such as oil or cigarette tar, such as a urethane-based or acrylic semiconductive paint, or a semiconductive layer 10' as shown in FIG. A semiconductive layer 10A is formed by applying an olefin-based semiconductive paint or a semiconductive paint containing an olefin-based paint on the entire one side of the electrode substrate 5, and a semiconductive layer 10A other than an olefin-based semiconductive paint is formed on the semiconductive layer 10A. It is a paint,
The semiconductive layer 10B is formed by applying a semiconductive paint such as a urethane-based or acrylic semiconductive paint that has strong adhesion strength to the surface coated with the olefin paint and is resistant to adhesion of dust such as oil and cigarette tar. form.

Note that in the collector electrode plate 12 shown in the fourth figure, the electrode substrate 5
When applying paint to the plate surface by printing, each hole 3 opened on the back surface of the electrode substrate 5 when forming each spacer protrusion 11.
As shown in FIG.
A misalignment 33 occurs between the insulating surface 31 and the semiconducting layer 10''.
may come into contact with the electrode substrate 5. In order to prevent this possibility, the semiconductive paint is applied so that the diameter of each opening 34 in the semiconductive layer 10' is larger than the diameter of each opening 35 in the insulating surface 31. For the same reason, in the collector electrode plate 12 shown in FIG. 6, the semiconductive paint is applied so that the diameter of each opening 36 of the semiconductive layer 10B is larger than the diameter of each opening 37 of the semiconductive layer 10A. .

Next, an example of the process of assembling the collector using the collector electrode plate 12 will be explained.
is a collector frame, which is a bottom frame 14 and a hollow vertical frame that stands upright from both ends of the bottom frame 14, and has entrances 1.5 and 16 into which the connecting pieces 6 and 8 of the collector electrode plate 12 are respectively inserted into the inner surfaces thereof. It consists of vertical frames 17 and 18 provided in the vertical direction, and an upper side frame 19 that spans between the upper ends of the vertical frames 17 and 18, and conductive pieces 20 and 21 are installed in the hollow parts of the vertical frames 17 and 18, respectively. Insert it.

Remove the upper side frame 19 from this collector frame 13, and attach the first collector electrode plate 12 to the vertical frames 17, 1.
Insert the connecting pieces 6 and 8 into the inlets 15 and 18 from the upper end side of 8, and lower the conductive terminal piece 7 and the insulating terminal piece 9 while inserting them into the hollow parts of the vertical frames 17 and 18, until they are lowered onto the bottom frame 14. Overlay on. Next, insert the second collector electrode plate 12 from the upper end side of the vertical frames 17 and 18 so that the conductive terminal piece 7 and the insulating terminal piece 9 are in the opposite direction to those of the first collector electrode plate 12. , 6 to inlet 15, 1
At the same time, the insulating terminal piece 9 and the conductive terminal piece 7 are inserted into the hollow parts of the vertical frames 17 and 18 and lowered, leaving a gap between the spacer protrusions 11 and 11 on top of the first collector electrode plate 12. Overlap. The above operation is repeated for each of the third and subsequent collector electrode plates 12, and the conductive terminal pieces 7 and the insulating terminal pieces 9 are stacked one after another with the conductive terminal pieces 7 and insulating terminal pieces 9 facing in opposite directions, and finally the upper side frame 1
9 is fixed by extending it between the upper ends of the vertical frames 17 and 18. Next, the conductive pieces 20 and 21 are respectively inserted into the hollow parts of the vertical frames 17 and 18 from the entrances (not shown) provided at the lower ends thereof, and each conductive terminal piece 7 is brought into electrical contact with the conductive pieces 20 and 21. Assemble the collector by bending it as shown.

The present invention is not limited to the above-mentioned embodiments, and, for example, the semiconductive layer 10 may be formed on both sides of the substrate 5, the semiconductive layer may be formed of a material other than paint, or the spacer protrusion ILI may be formed.
I may be deformed into another shape and molded, or may be molded and attached separately from the substrate 5, or as shown in Figure 9, the substrate 22 and An insulating sheet 24, which is an insulating sheet having the same width and having spacer protrusions 23, 23 on both sides thereof, may be adhered, or a substrate 22 formed of a semiconductive material as shown in FIG. 10 may be bonded. Spacer protrusions 25, 25 molded from an insulating material may be attached to both sides, or the electrode substrate 22 and spacer protrusions 26, 26 may be integrally molded from a semiconductive material as shown in FIG. It can be covered with a cover 2727 made of an insulating material, or as shown in FIG. Attach the insulating spacer protrusions 30, 30,
3. As shown in the figure, an electrode substrate 28 formed of a conductive material is covered with a semiconductive layer 29 made of a semiconductive material from one side to the opposite side, and insulating spacer projections are provided on both sides of the electrode substrate 28. The design can be changed as appropriate, such as by attaching 30 and 30.

〔Effect of the invention〕

Since the present invention is configured as described above, it is possible to simultaneously achieve high efficiency in dust collection, prevention of sparks, and limitation of leakage current, and also to provide a collector electrode plate that can be made smaller and thinner. can be provided. Further, the time and effort required to form a conductive surface and an insulating surface on the electrode plate and the time and effort required to form a conductive surface and a semiconductive layer can be saved, and the manufacturing process of the collector electrode plate can be simplified.

[Brief explanation of drawings]

Drawings 1 to 3 show one embodiment of the present invention, and FIG. 1 is a plan view of an electrode substrate, FIG. 2 is a plan view of a state in which a semiconducting layer is formed on the electrode substrate, and FIG. The figure is A- in Figure 2.
4 is a diagram showing another embodiment of the present invention, FIG. 5 is a diagram illustrating the misalignment between the semiconducting layer and the insulating surface in the same embodiment, and FIG. 6 is a diagram showing a further embodiment of the present invention. A diagram showing another embodiment, FIG. 7 is a diagram showing an example of a state in which collector electrode plates are laminated within the collector frame, FIG. 8 is a plan view with the upper side frame of the collector frame removed, and FIGS. Fig. 13 is a diagram showing still another embodiment of the present invention, Fig. 14 is a plan view of a conventional collector electrode plate, Fig. 15 is a side view of the same collector electrode plate, and Fig. 16 is the same as Fig. 14. B
-B is an enlarged sectional view. 5... Electrode substrate, 10... Semiconductive layer.

Claims (3)

[Claims] (1) A collector electrode plate characterized by forming a semiconducting layer on the plate surface of the electrode substrate. (2) The collector electrode plate according to claim 1, characterized in that a semiconductive layer is formed by coating a semiconductive paint on the plate surface of the electrode substrate formed from an insulating sheet of polypropylene, vinyl chloride, or other material. collector electrode plate. (3) An insulating surface is formed by coating an olefin-based insulating paint or an insulating paint containing an olefin-based paint on the plate surface of an electrode substrate formed from an insulating sheet made of polypropylene or a material with the same effect as that, and on this insulating surface. Collector electrode plate characterized by forming a semiconductive layer by applying a semiconductive paint other than olefin-based (4) Olefin-based semiconducting on the plate surface of an electrode substrate molded from an insulating sheet made of polypropylene or an equivalent material. A collector characterized in that a semiconductive layer is formed by applying a paint or a semiconductive paint containing an olefin-based paint, and a semiconductive layer is formed by applying a semiconductive paint other than an olefin-based paint on the semiconductive layer. Electrode plate.