JPH03214597A - Jet ionizer - Google Patents

Abstract

PURPOSE:To make serviceable an already existing high pressure gas piping by furnishing a needle-shaped electrode in a specified place on a cylindrical member, whose open end is connected to the high pressure gas piping, wherein the needle electrode is made in such an arrangement that its base is insulatedly embedded in the direction perpendicular to the axis of the cylindrical member and that the tip reaches the axis substantially. CONSTITUTION:The large wall thickness structural part 11a of a cylindrical member 11 is provided with a thread hole 11b which opens to the outside, an insulation part 12 formed between the backmost part in this thread hole 11b and the pipeline 11c of this cylindrical member 11, and a needle-shaped electrode 13 whose base is embedded in the insulation part 12. The base of this needle electrode 13 is embedded in the insulation part 12 so that the tip reaches substantially the axis X-X of the cylindrical member 11, and a terminal 13a is exposed from the insulation part 12 at the backmost in the thread hole 11b. When a high voltage is impressed between the needle electrode 13 and cylindrical member 11, the high speed air stream flowing through the pipeline 11c is ionized with electric discharging at the tip of the needle electrode 13 and blown to a resin molded semiconductor element on a parts feeder, and electric charges are neutralized to deelectrify it. This permits use of an already existing high pressure gas piping.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention relates to a jet ionizer for removing static electricity from pellet-shaped semiconductor elements, resin-molded semiconductor elements, etc. This is a device that eliminates static charges caused by friction between semiconductor devices and semiconductor manufacturing equipment, and is based on electrostatic repulsion.
The present invention relates to a jet ionizer for preventing scattering of semiconductor elements and preventing electrical breakdown of semiconductor elements due to discharge of charged charges.

(Example) Conventional technology The semiconductor device manufacturing process after the wafer process generally involves a dicing process in which the wafer is cut into pieces of 0.35 mm to 10 mm on a side and the semiconductor devices are separated into pellets, and a pellet-shaped semiconductor device is heated to a lead frame. A berent bonder process for welding, a wire bonder process for connecting semiconductor elements and lead frame terminals, a resin molding process, a cutting process for separating individual semiconductor elements from the frame, and an inspection process for each process. Consists of etc. Further, for micro-sized semiconductor elements whose external dimensions are 3 mm or less, an alignment film-back process for the completed semiconductor elements is added in consideration of mounting by an automatic machine on the user's side.

Now, due to the nature of the process, it is inevitable that the resin-molded semiconductor elements after the cutting process of separating the individual semiconductor elements from the frame will be randomly oriented.

Therefore, prior to the subsequent film packing process and furthermore the inspection process, it becomes necessary to align the resin molded semiconductor elements front to back and in orientation using various parts feeders.

Figure 6 conceptually explains the structure and operation of one of these parts feeders that applies vibration to resin-molded semiconductor elements to align the front and back sides and feed the parts feeder. ．． The parts feeder (51) is vibrated by a device not shown, and random kinetic energy is imparted to a large number of resin-molded semiconductor elements (52) randomly placed in the center of the parts feeder (51).

In addition, the resin molded semiconductor element (52) is agitated with air,
In order to improve the efficiency of this alignment operation, high pressure gas (mainly dry air is used hereafter referred to as high pressure air) is blown from the nozzle (53) to the parts feeder (51).

The randomly moving resin-molded semiconductor elements (52) diffuse to the periphery of the bart feeder (51) according to the laws of mathematics and physics, and are further guided to the lamp part (54). Although not detailed, resin molded semiconductor element (52)
is guided to the lamp part (54), and the lamp part (
In 54), the resin molded semiconductor element (52) facing down and in a direction other than the predetermined direction falls from the lamp part (54) to the parts feeder (51), and the resin molded semiconductor element (52) passes through the lamp part (54). The front and back sides are aligned. These aligned resin molded semiconductor elements (5
2) is sent from the lamp section (54) to an electrical property testing device and a film pack device (not shown). It is known that in such parts feeders, resin-molded semiconductor elements (52) often fly off from the parts feeder (51). Conventionally, the cause of this problem was the nozzle (53
), the pressure of the high-pressure air has been carefully adjusted, but good results have not been obtained so far with this pressure adjustment. Also,
Subsequent electrical property tests have confirmed that electrical defects occur depending on the structure of the semiconductor element.

The inventor's research on this point revealed that the above phenomenon is related to frictional electrification caused by repeated collision and repulsion of resin-molded semiconductor elements on the parts feeder (51). ,nozzle(
So far, some results have been obtained by using an ion blower instead of the high-pressure air according to 53). (c) Problems to be Solved by the Invention Hitherto, there has been no ionizer suitable for this type of purpose. Therefore, ion blowers used for other purposes are being used, but these ion blowers are generally box-shaped and relatively large, making it difficult to support existing semiconductor device manufacturing equipment. . Furthermore, it is difficult to control the ion blowing direction and the ion flow rate precisely, and since a fan is provided, there is a risk of failure.

Gun-shaped ionizers are also known, but they are more difficult to support in existing semiconductor device manufacturing equipment. The present invention aims to solve the above-mentioned problems with conventional ion blowers or ionizers, and provides a jet ionizer that can utilize existing high-pressure air piping in semiconductor device manufacturing equipment and is simple in installation and structure. With the goal. (2) Means for Solving the Problems The above-mentioned problems are solved by: At least one open end of the cylindrical member is connected to a high-pressure gas pipe at a predetermined portion of the cylindrical member, the base of which is insulated and buried in a direction perpendicular to its axis; This problem is solved by the jet ionizer of the present invention, which includes a needle-like electrode whose tip almost reaches the axis.

(E) Function The jet ionizer of the present invention is capable of cutting both ends of an existing high-pressure gas pipe obtained by cutting any part, or at least one open end of the cylindrical part of the existing high-pressure gas pipe. The ion flow sprayed through the Gesoto ionizer of the present invention neutralizes and eliminates the electric charge on the semiconductor element, or reduces the electric charge to only a single polarity. Splashing and electrical damage are avoided.

Additionally, since it uses existing high-pressure gas piping, there are no moving parts, so there is no risk of failure. Furthermore, the existing high-pressure gas piping is equipped with a flow rate control mechanism, making it extremely easy to control the ion flow rate. (F) Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 shows a first embodiment of the present invention, FIG. 1(A) is a cross-sectional view thereof, and FIG. 1(B) is a longitudinal cross-sectional view taken along line Y-Y in FIG. 1(A). Show the diagram.

The cylindrical member (11) formed of a metal material has a thick wall structure at a predetermined portion thereof, and the thick wall structure portion (I+.) has a screw hole (11.) opening outward, and this screw hole (llb). ) and an insulating part (12) formed between the deepest part of the pipe (11.) of the cylindrical member (11), and a needle-shaped electrode (13) whose base is embedded in this insulating part (12). We are prepared. Needle electricity +! (13) has its tip aligned with the axis of the cylindrical member (11)
-X, its base is buried in the insulating part (12), and the terminal (13.) is inserted from the insulating part (12) into the screw hole (n
b) is exposed in the deepest part. Therefore, the connection mechanism (4) to which the cable (14.) of one polarity of the high voltage generator (not shown) is connected is fitted in the screw hole (llb), and its terminal (14b) and the needle electrode (13. ) terminal (13.
) and connect the cable (14.) connected to the terminal of the other polarity of the high voltage generator to the terminal (lid) of an appropriate method provided on the cylindrical member (11). Electric discharge is possible between the electrode (13) and the cylindrical member (11). A jet ionizer with such a structure is needle-shaped ionizer 4! <13) Generates an ion flow with the same polarity as the voltage applied to it. Note that it is also possible to use a BNC connector or an M-type connector as the connection mechanism (14). The jet ionizer of the present invention cuts an existing high-pressure air pipe in a parts feeder, etc. at an appropriate location, and then cuts the cut end (1
5. ) (15.) at the open end (
11. ) (+.1+). In addition, if the diameter of the high pressure air piping is large, as shown by the broken line in the figure, the high pressure air piping (15.') (1sb')
The cylindrical member (11) is press-fitted and connected. In addition, when the jet ionizer of the present invention is used at the end of an existing high-pressure air piping, that is, at the position of the high-pressure air blowing nozzle, the open end of the cylindrical member (11) (
11. > (11,) is connected, and the other open end is used as a nozzle. Then, a needle electrode (13
) and the cylindrical member (11), the discharge at the tip of the needle electrode (13) causes the cylindrical member (11) to
The high-speed airflow flowing through the pipe (11.) is ionized,
It is sprayed onto the resin-molded semiconductor elements on the parts feeder. Note that when the cylindrical member (11) is made of insulating resin, the insulating portion (12) is not necessary.

Here, the charging mechanism of the resin-molded semiconductor element on the parts feeder and the static elimination function of the jet ionizer of the present invention will be explained.

The resin molded semiconductor elements on the parts feeder improve the alignment operation efficiency of the parts feeder due to the friction between the resin molded semiconductor elements and the stainless steel normally used for the parts feeder body, and the friction between the resin molded semiconductor elements each other. It is charged by charging the high-pressure air. Among these charging mechanisms, the charging by the first and third charging mechanisms is a single-polarity charge determined by the type of resin of the molded semiconductor element, etc., and is relatively mild since there is a saturation level of the charge amount. It is predicted that it is electrostatically charged. Therefore, it does not become a main cause of scattering of resin-molded semiconductor elements. Further, if necessary, this type of charge can be easily neutralized. On the other hand, according to the second charging mechanism, resin molded semiconductor elements are charged with different polarities for each part of the resin, and a plurality of resin molded semiconductor elements are bonded together by electrostatic attraction due to charges of different polarities. The alignment operation of the puff feeder is hindered. In addition, if the mutual positional relationship of resin-molded semiconductor elements bonded together is forcibly changed by vibration or high-pressure air agitation, the same-polarity charges of the resin-molded semiconductor elements may instantaneously approach each other, resulting in electrostatic repulsion. The force causes resin-molded semiconductor elements to scatter. Furthermore, charges of different polarities on the resin-molded semiconductor element sometimes cause partial discharge on its surface, destroying the MOS-structured semiconductor element. When an ion stream is sprayed onto a resin-molded semiconductor element by the jet ionizer of the present invention, among the portions of the resin that are charged with different polarities, charges with a polarity opposite to that of the ion stream are neutralized and eliminated. Parts that are charged to a polarity different from that of the ion flow usually have reached a saturation level, and because of electrostatic repulsion, they are not charged to a higher level by the ion flow. There is no increase. Furthermore, since this residual charge has the same polarity at all locations on all resin-molded semiconductor elements, no electrostatic attraction occurs, and therefore, deterioration of alignment due to the parts feeder is avoided, and charge discharge occurs. Even if this happens, it will be a macroscopic discharge, and electrical breakdown of the semiconductor element of the MOS structure can be avoided.

FIG. 2 shows a modification of the first embodiment in which the connection between the jet ionizer and the high-pressure air piping is improved. It has a reference number. In this embodiment, the open end (11.) (1
11) with PT thread processing or metric thread processing, etc., making it possible to use a general-purpose quick joint (16). High pressure air piping (
15. ), the lock claw (16') of the quick joint (16) penetrates or is pressed against the outer wall of the high pressure air pipe (15.), and the connection between the high pressure air pipe (15.) and the quick joint (16) is established. After the high pressure air line (15.) is pressed into the quick fitting (16), the high pressure air line (15.) is released by pushing in the release ring (16'').

FIG. 3 shows another modification of the first embodiment, in which the same parts as in the first embodiment are given the same reference numerals. In this embodiment, the discharge gap and the high voltage cable connected thereto are integrally molded during the molding of the cylindrical member (11), and such a structure includes the coaxial cable (16) connected to the high voltage generator. Needle electrode (13) on the core wire (16.)
is obtained by integral resin molding after connecting the annular counter electrode (17) to the outside wire (1sb). Note that the cable (16) connected to the high voltage generator does not need to be a coaxial cable, and the shapes of the needle electrode (13) and the annular counter electrode (17) are not limited to the shapes shown in the figure. ．． Furthermore, the figure shows an example in which the direction in which the coaxial cable (16) is pulled is perpendicular to the axis of the cylindrical member (11).
A jet ionizer having such a shape can be supported relatively easily by supporting the high voltage cable (16), and is particularly suitable for use at a blow nozzle position of a parts feeder. However, it is also possible to form the coaxial cable (16) so that it is drawn out in parallel, and a jet ionizer having such a shape is suitable for connection to the middle of high-pressure air piping.

Still another embodiment of the present invention will be described with reference to FIG.

This example focuses on the fact that many of the existing high-pressure air piping in parts feeders, etc. are made of resin pipes, and the high-pressure air piping is made by penetrating the needle-like electrodes into such piping, which has relatively low strength. There is a needle electrode (l) for ionization inside the
3). In this embodiment, the counter electrode may also be passed through at the same time, or even if the counter electrode is not formed, there is no problem in basic operation.

Similar to the previous embodiment, the semi-cylindrical member (21) of this embodiment has a needle-like electrode (not shown) attached to the core wire (16.) of the coaxial cable (16), and its outer wire (21) facing the core wire (16.). It is obtained by integrally molding it with an insulating resin after being connected to an electrode, for example, a locking mechanism (17). In this example, the needle-like electrode of the semi-cylindrical member (21) is connected to a high-pressure air pipe (15) made of resin.
It is used by passing it through and being locked by the locking mechanism (17). As shown in the figures, this embodiment is extremely simple in structure and installation.

Another embodiment of the present invention will be described with reference to FIGS. 5(A) and 5(B). Note that FIG. 5(B) is a sectional view taken along the Y-Y line of FIG. 5(A). This example also uses needle-shaped electrodes (13) for piping with relatively low strength.
The purpose is to form a needle-like electrode (13) for ionization in the high-pressure air piping by penetrating the pipe, and it is used in the same manner as the embodiment shown in FIG.

In this embodiment, the semi-cylindrical member (21) is made of insulating resin, and a predetermined portion thereof has a thick wall structure. The thick structure part (21.) has a screw hole (21b) opening outward, and a needle-shaped electrode (21.) whose base is buried in the deepest part of the screw hole (21.).
13), packing (16) and high pressure air piping (15)
A locking mechanism (17) is provided for coupling the semi-cylindrical member (21) to the semi-cylindrical member (21). Needle electricity! The base of (13) is buried so that its tip almost reaches the axis X-X of the semi-cylindrical member (21), and the terminal (13.) is exposed at the deepest part of the screw hole (21.). There is. Therefore, the connection mechanism (14) that is connected to one cable (14.) of a high voltage generator (not shown) is inserted into the screw hole (2lb), and the terminal (14b) and the needle electrode (11.) are connected. By connecting the terminal (llf), discharge between the needle electrode (11.) and the cylindrical member (11) becomes possible.

In this embodiment, the needle-like electrode (13) is passed through appropriate locations of the resin high-pressure air piping installed in the parts feeder, etc., and is further locked by the locking mechanism (17) to complete the installation. Above, the jet ionizer of the present invention has been described using as an example the neutralization and removal of the charged charges of a semiconductor element, but as is already clear, the present invention is applicable to, for example, the neutralization of the charged charges during air transport of pellets in the plastic manufacturing process, Alternatively, it can be used to charge any material, and is not limited to the examples. (}) Effects of the Invention As described above, the jet reducer of the present invention can cut both ends of an existing high-pressure gas pipe, which can be obtained by cutting arbitrary points.
Alternatively, it can be used simply by press-fitting the end of an existing high-pressure gas pipe into at least one open end of the cylindrical part, and no special support structure is required.

Additionally, since it uses existing high-pressure gas piping, there are no moving parts, so there is no risk of failure.

Furthermore, when used in semiconductor manufacturing processes, scattering of semiconductor elements and electrostatic damage can be avoided. Furthermore, when a quick joint is used, the connection to the high pressure air piping becomes simple and reliable.

[Brief explanation of drawings]

FIG. 1(A) is a cross-sectional view of the first embodiment of the present invention;
Figure (B) is a sectional view taken along the Y-Y line in Figure 1 (A), Figure 2 is a cross-sectional view of the second embodiment, which is a modification of the first embodiment, and Figure 3 is a cross-sectional view of the second embodiment, which is a modification of the first embodiment. A cross-sectional view of the third embodiment, which is another modification of the embodiment, FIG. 4 is a cross-sectional view of the fourth embodiment of the present invention,
FIG. 5(A) is a cross-sectional view of the fifth embodiment of the present invention;
Figure (B) is a sectional view taken along the Y--Y line in Figure 5 (A), and Figure 6 is a top view of a parts feeder that aligns the front and back sides of resin-molded semiconductor elements. 11... Cylindrical member, 12-... Insulating part, 13
...acicular electrode, 14...connection mechanism.

Claims (7)

[Claims] (1) At least one open end of the cylindrical member is connected to a high-pressure gas pipe, at a predetermined portion of the cylindrical member, and is provided with a needle-like electrode whose base is insulated and buried in a direction perpendicular to its axis, and whose tip almost reaches the axis. jet ionizer. (2) The jet ionizer according to claim 1, wherein the cylindrical member is formed of an insulating resin, and the open ends of cut high-pressure gas piping are press-fitted into both open ends of the cylindrical member. (3) A predetermined portion of the cylindrical member has a thick wall structure, and the thick wall structure includes the needle electrode and a mechanism for externally connecting the needle electrode to a high voltage power source. jet ionizer. (4) The jet ionizer according to claim 1, wherein the needle electrode and its external lead wire are integrally molded with the cylindrical member. (5) The jet ionizer according to claim 1, wherein the open end is threaded and a quick joint is connected thereto. (6) At least one semi-cylindrical part that comes into contact with the outer circumferential surface of the high-pressure gas pipe, and a needle that extends perpendicularly to the axis of the first semi-cylindrical part and whose tip reaches approximately the axis of the semi-cylindrical part. A jet ionizer characterized in that a needle-shaped electrode is arranged in an insulated manner, and the needle-shaped electrode is penetrated by a high-pressure gas pipe. (7) Gas transportation in automatic machines in the semiconductor device manufacturing process;
The jet ionizer according to claim 1 or claim 6, wherein the jet ionizer is connected to a high pressure gas pipe for alignment.