JPH03208326A - Production of semiconductor device - Google Patents

Abstract

PURPOSE:To automatically sort semiconductor substrates in a lot by product type so as to machine by providing a product type bar code on the semiconductor substrate back plane. CONSTITUTION:A product type bar code 3 is marked in the vicinity of the orientation flat 2 on the back plane of a semiconductor substrate 1. The semiconductor substrate 1 is set at a sender 4 and is taken out by a carrying belt 5. Then, a bar code reader 7 reads the bar code 3 on the semiconductor substrate 1, compares the code 3 with the product type code and judges whether to machine at a semiconductor substrate machining part 8 or to store in a buffer 9. Thus, the semiconductor substrates in a lot are sorted and machined without the attendance of an operator.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing semiconductor devices in low-volume, high-mix production.

Conventional technology Generally, in a semiconductor manufacturing factory, several semiconductor substrates are grouped together to form a lot, which is then housed in a case.However, in the case of low-volume, high-mix production, there are multiple types of semiconductor substrates within 10 lots. Sometimes. When manufacturing a semiconductor device using a conventional manufacturing method, as shown in FIG. Workers were sorting and manufacturing.

Problems to be Solved by the Invention In such conventional semiconductor device manufacturing methods, when there are multiple types in one lot, it is necessary to separate the semiconductor substrates for each type depending on the semiconductor substrate processing process. To separate the semiconductor substrates in this lot by type, a manufacturing worker must check and sort them one by one based on board number 15, and then set the semiconductor substrates in the manufacturing equipment by type. However, there have been problems in that the work burden on manufacturing workers is large and it is difficult to automate the manufacturing of semiconductor devices. The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to automatically sort semiconductor substrates within a lot by type and perform processing operations without the intervention of manufacturing workers.

Means for Solving the Problems In order to achieve the above object, the present invention attaches a type bar code to the back side of a semiconductor substrate, and uses the par code to automatically sort the semiconductor substrates by type and perform processing operations. This is the solution to the problem.

Effects of the present invention By using the above-mentioned problem solving means, the type code of semiconductor substrates can be read by a barcode reader, sorting can be automatically performed, and semiconductor substrates can be loaded into semiconductor device manufacturing equipment in units of lots.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.

As shown in the figure, a product type bar code 3 is stamped near the orientation flat 2 on the back surface of the semiconductor substrate 1. This semiconductor substrate 1 is set on a sender 4 and taken out from a carry-in belt 5. The orientation flat alignment portion 6 aligns the orientation flats 2 of the semiconductor substrate 1. The barcode reader 7 reads the barcode 3 of the semiconductor substrate]-, compares it with the product code, and determines whether to process the semiconductor substrate in the semiconductor substrate processing section 8 or to store it in the buffer 9. The receiver 10 stores the semiconductor substrate 1 processed by the semiconductor substrate processing section 8 . In the above configuration,
First, set the product code on the barcode reader 7.

The semiconductor substrate 1 set on the sender 4 is transferred to the carrying belt 5
is taken out and moved to the orientation flat matching portion 6. When the orientation flats 2 of the semiconductor substrate 1 are aligned at the orientation flat alignment section 6, the carry-in belt 5 moves the semiconductor substrate 1 to the top of the barcode reader 7. Before reading the barcode, the barcode reader 7 compares the product type code set and the product type barcode read, and if the product code is the same, the barcode reader 7 moves to the semiconductor substrate processing section 8 by the carrying belt 5 to perform processing work. , the receiver 10 by the post-processing delivery belt 11.
is stored in

If the product code is different, it is stored in the buffer 9 by the bypass belt 12. In this embodiment, processing/non-processing is determined based on the product type code, but the determination may also be made using the ROM code.

Effects of the Invention As is clear from the above embodiments, in the method for manufacturing a semiconductor device of the present invention, processing work can be performed by automatically sorting semiconductor substrates in a lot by type without the intervention of a manufacturing worker. Even if there are multiple types of semiconductor substrates within a 10-pack, processing operations can be performed without any problem, and this has the effect of lowering costs and contributing to the automation of semiconductor device manufacturing.

[Brief explanation of drawings]

FIG. 1 is a back view of an embodiment of a semiconductor substrate manufactured by the semiconductor device manufacturing method of the present invention, and FIG. 2 is a top view of an embodiment of a manufacturing apparatus used in the semiconductor device manufacturing method of the present invention. FIG. 3 is a back view of a semiconductor substrate manufactured by a conventional semiconductor device manufacturing method. 1...Semiconductor substrate, 3...Type barcode, 7...Barcode reader 8...
...Semiconductor substrate processing department.

Claims (1)

[Claims] A method for manufacturing a semiconductor device, in which a type bar code is attached to the back side of a semiconductor substrate, and semiconductor substrates in a lot are automatically sorted by type based on the bar code to perform processing operations.