JPH03206639A - Semiconductor inspection handling apparatus - Google Patents

Semiconductor inspection handling apparatus

Info

Publication number
JPH03206639A
JPH03206639A JP2002273A JP227390A JPH03206639A JP H03206639 A JPH03206639 A JP H03206639A JP 2002273 A JP2002273 A JP 2002273A JP 227390 A JP227390 A JP 227390A JP H03206639 A JPH03206639 A JP H03206639A
Authority
JP
Japan
Prior art keywords
chamber
test
temperature
temperature state
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002273A
Other languages
Japanese (ja)
Inventor
Hiroshi Nakagawa
博 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2002273A priority Critical patent/JPH03206639A/en
Publication of JPH03206639A publication Critical patent/JPH03206639A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To remove a trouble, to exchange a type and to open a thermostatic bath at an inspection operation for a short time and to increase the rate of operation of an apparatus by a method wherein the thermostatic bath is divided according to a requirement and a temperature can be adjusted at individual baths. CONSTITUTION:When a test board 11 and a contact head 13 are replaced in order to exchange a type while the inside of a thermostatic bath 14 is kept in a low-temperature state, partitioning sheets 15a, 15b are raised by using partitioning-sheet drive parts 16a, 16b, and the bath 14 is divided into a test-part front chamber 17, a test-part chamber 17b and test-part rear chamber 17c. While the chambers 17a and 17c are kept in the low-temperature state, their temperature is raised to a room-temperature state which does not generate frost and dew even when only the chamber 17b is opened. Then, the chamber 17b reaches the room-temperature state, an IC test head 3, the test board 11 and the contact head 13 are replaced by those for another type, they are mounted again on the bath 14 and the chamber 17b is returned to the low- temperature state.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体装置を検査するハンドリング装置に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a handling device for inspecting semiconductor devices.

〔従来の技術〕[Conventional technology]

第2図は従来の半導体検査ハンドリング装置を示す部分
断面正面図で、図において、(1)ζよローダ部、(2
)は本体部、(3)は本体部(1)に着脱可能なICテ
スターヘッド、(4)はアンローダ部、(5)は検査す
る半導体装置、(6)は半導体装置(5)を複数個搭載
するパレット、(71はブリヒートエレベーション、(
8a) .(8bl、(8c)はパレット(6)が移動
するパレットレール、(9a) , (9b)はパレッ
1・駆動爪、叫は押上アーム、01)はICテストヘッ
ド(3)に着脱可能なテストボード、(自)はコンタク
ター、a3)はコンタクター(自)を複数個備えたコン
タクターヘッド、0@は本体部{2}を覆う恒温槽であ
る。
FIG. 2 is a partially sectional front view showing a conventional semiconductor inspection handling device. In the figure, (1) ζ is the loader section, (2
) is the main body, (3) is an IC tester head that can be attached to and detached from the main body (1), (4) is an unloader part, (5) is a semiconductor device to be tested, and (6) is a plurality of semiconductor devices (5). The pallet to be loaded, (71 is Briheat Elevation, (
8a). (8bl, (8c) are the pallet rails on which the pallet (6) moves, (9a) and (9b) are the pallet 1/drive claws, and the push-up arm is the push-up arm. 01) is a test that can be attached to and detached from the IC test head (3) Board, (self) is a contactor, a3) is a contactor head equipped with a plurality of contactors (self), and 0@ is a constant temperature bath that covers the main body part {2}.

次に動作について説明する。ローダ部(1)より供給さ
れたパレット(6)はブリヒートエレペーション(7)
に移動し、恒温槽qO内で温度上昇あるいは温度下降し
ながらパレットレール(8a)まで上昇する。
Next, the operation will be explained. The pallet (6) supplied from the loader section (1) is transferred to the briheat elevator (7).
and rises to the pallet rail (8a) while increasing or decreasing the temperature in the constant temperature oven qO.

次いで、パレット(6)はパレッ}・駆動爪(9a) 
+C ヨって、パレッ1・レール(8a)上を移動しパ
レットレール(8b)に達すると、押上アーム001が
上昇しパレット(6)上の半導体装置(5)をコンタク
ターOに押し付けて電気的接触を取り、コンタクタ−(
自)と配線導通したテストボード01)を通して、IC
テスターヘッド(3)で電気的検査が行われる。
Next, the pallet (6) is attached to the pallet/drive claw (9a)
+C When it yaws and moves on the pallet 1 rail (8a) and reaches the pallet rail (8b), the push-up arm 001 rises and presses the semiconductor device (5) on the pallet (6) against the contactor O, electrically connecting it. Make contact and use the contactor (
IC) through the test board 01) with wiring continuity
Electrical testing is performed with the tester head (3).

検査が終了すると、押上アーム00)が下降して半導体
装置(5)はパレット(6)上に戻り、パレット(6)
はパレット駆動爪(9b)によってパレットレール(8
C)上を移動してアンローダ部(4)に収納される。
When the inspection is completed, the push-up arm 00) is lowered and the semiconductor device (5) is returned to the pallet (6).
The pallet rail (8) is moved by the pallet drive claw (9b).
C) moved above and stored in the unloader section (4).

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の半導体検査ハンドリング装置は以上のように構成
されていたので、恒温槽内部で搬送系等の故障、品種交
換、あるい(よ、ICテスターヘッド点検の為コンタク
トブロックを取り外す際、恒温槽内全体の渇度が変化し
てしまい、再度検査を開始するのに、一定扇度に安定す
るまでの時間を必要とし、特に低温検査の場合は、恒温
槽を開放する前に露、霜が発生しないように恒温槽を室
内?W度まで昇温しなければならず、装置の稼働率を低
下させるという問題点があった。
Conventional semiconductor testing and handling equipment was configured as described above. When the overall thirst level changes, it takes time for the temperature to stabilize to a certain degree before starting the test again. Especially in the case of low-temperature tests, dew and frost occur before the thermostatic chamber is opened. In order to prevent this, the temperature of the thermostatic chamber had to be raised to ?W degrees indoors, which caused the problem of lowering the operating rate of the device.

この発明は上記のような問題点を解消するためになされ
たもので、故障解除、点検、品種交換が短時間で容易に
できるとともに、装置稼働率を向上できる半導体検査ハ
ンドリング装置を得ることを目的とする。
This invention was made to solve the above-mentioned problems, and its purpose is to provide a semiconductor inspection and handling device that can easily perform troubleshooting, inspection, and product replacement in a short time, and can improve the device operating rate. shall be.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る半導体検査ハンドリング装置は、必要な
時に恒温槽内を分割し、この分割された恒渇槽内だけを
温度上昇、あるいは、温度下降ができるようにしたもの
である。
The semiconductor inspection and handling device according to the present invention divides the inside of the constant temperature chamber when necessary, and is capable of raising or lowering the temperature only in the divided constant temperature chamber.

〔作用〕[Effect]

この発明における半導体検査ハンドリング装置は、分割
可能な恒温槽により必要最小限な部分のみの恒温槽の開
放を可能にする。
The semiconductor inspection handling device according to the present invention uses a divisible thermostatic chamber to open only the minimum necessary portion of the thermostatic chamber.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第1
図において、(15a)、(15b)は恒温槽仕切り板
、(16aL(16b)はこの恒温槽仕切り板(15a
)、(15b)に取り付けられた仕切り板駆動部、(1
7a)はテス1・部前室、(17b)はテスト部室、(
17c)はテスト部後室である。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (15a) and (15b) are constant temperature chamber partition plates, (16aL (16b) is this constant temperature chamber partition plate (15a)
), the partition plate drive unit attached to (15b), (1
7a) is the test 1/department front room, (17b) is the test department room, (
17c) is the rear chamber of the test section.

なお、その他の符号は前記従来のものと同一につき説明
は省略する。
Note that the other symbols are the same as those of the prior art, so the explanation will be omitted.

次に動作について説明する。恒温槽(+4)内部は低渇
状態に保たれており、品種交換の為にテストボード01
)及びコンタクターヘッド03)を交換する場合につい
て説明する。
Next, the operation will be explained. The inside of the thermostatic chamber (+4) is kept in a low drought state, and test board 01 is used for product replacement.
) and contactor head 03) will be explained.

恒温槽仕切り板(15a)、(15b)が仕切り板駆動
部(16a)、(16b)によって上昇し、恒温槽q@
内をテスト部前室(17a)、テスト部室(+7b3及
びテス1・部後室(17c)に分割し、テス1・部前室
(17a)及びテスト部後室(17e)は低温状態を保
ったままテスト部室(17b)のみを開放しても霜、露
の発生しない室温状態まで昇渇する。テス1・部室(1
7b)  が室温状態になると、ICテストヘッド(3
)、テスl・ボード01)、及びコンタクトヘッド03
)を上昇させて、テスl−ボード01)とコンタク1・
ヘッド03)を他の品種用に交換し、再び恒温槽0褐に
装着し、テスト部室(17b)を低温状態に戻す。
The thermostatic chamber partition plates (15a) and (15b) are raised by the partition plate drive parts (16a) and (16b), and the thermostatic chamber q@
The interior is divided into a test section front chamber (17a), a test section room (+7b3) and a test section rear chamber (17c), and the test section front chamber (17a) and test section rear chamber (17e) are kept at a low temperature. Even if only the test room (17b) is left open, the temperature will rise to a room temperature where no frost or dew will occur.
7b) is at room temperature, the IC test head (3
), tesl board 01), and contact head 03
) and contact 1.
The head 03) is replaced with one for another type, and the head 03 is again attached to the constant temperature oven 0, and the test chamber (17b) is returned to a low temperature state.

なお、上記実施例では恒謳槽仕切り板(15a)(15
b)が2枚の場合について説明したが、恒温槽内は必要
に応じてさらに細分割しても良いことはいうまでもない
In addition, in the above embodiment, the memorial tank partition plate (15a) (15
Although the case where b) has two sheets has been described, it goes without saying that the inside of the thermostatic chamber may be further subdivided as necessary.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、恒渇槽を必要に応じて
分割し各分割恒渇槽ごとに温度調整が可能な様に構成し
たので、故障解除、品種交換、及び点検の際の恒温槽開
放が短時間で実施でき、また装置の稼働率を向上できる
という効果が得られる。
As described above, according to the present invention, the constant temperature drying tank is divided as necessary and the temperature can be adjusted for each divided constant drying tank. The effect is that the tank can be opened in a short time and that the operating rate of the device can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による半導体検査ハンドリ
ング装置を示す部分断面正面図、第2図は従来の半導体
検査ハンドリング装置を示す部分断面正面図である。 図において、(15a)、(15b)は恒温槽仕切り板
、(16a) , (16b)は仕切り板駆動部。 なお、図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a partially sectional front view showing a semiconductor testing and handling device according to an embodiment of the present invention, and FIG. 2 is a partially sectional front view showing a conventional semiconductor testing and handling device. In the figure, (15a) and (15b) are thermostatic chamber partition plates, and (16a) and (16b) are partition plate drive units. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims]  半導体装置を検査するハンドリング装置において、恒
温槽を分割しこの分割恒温槽ごとに温度調整を可能にし
たことを特徴とする半導体検査ハンドリング装置。
1. A semiconductor testing and handling device for inspecting semiconductor devices, characterized in that a constant temperature chamber is divided and the temperature can be adjusted for each divided constant temperature chamber.
JP2002273A 1990-01-08 1990-01-08 Semiconductor inspection handling apparatus Pending JPH03206639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002273A JPH03206639A (en) 1990-01-08 1990-01-08 Semiconductor inspection handling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002273A JPH03206639A (en) 1990-01-08 1990-01-08 Semiconductor inspection handling apparatus

Publications (1)

Publication Number Publication Date
JPH03206639A true JPH03206639A (en) 1991-09-10

Family

ID=11524761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002273A Pending JPH03206639A (en) 1990-01-08 1990-01-08 Semiconductor inspection handling apparatus

Country Status (1)

Country Link
JP (1) JPH03206639A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306957B2 (en) * 2003-12-22 2007-12-11 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306957B2 (en) * 2003-12-22 2007-12-11 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device
US7422914B2 (en) 2003-12-22 2008-09-09 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device

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