JPH03206454A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE:To obtain a photosensitive polyimide resin composition good in adhesiveness, small in elasticity, high in sensitivity and heat resistance by forming the composition composed essentially of a specified polyamic acid, a specified polyfunctional aminoacrylate, a specified biscoumarin compound, and a specified glycine compound specified in each proportion. CONSTITUTION:This composition contains the polyamic acid A obtained by copolymerizing the silicone type diamine represented by formula I in an amount of 1 - 50 wt.%; the polyfunctional aminoacrylate B having 2 or 3 molecules of acrylate or methacrylate represented by formula II; the biscoumarin compound C substituted by a carbonyl group at its 3-position represented by formula III; and the glycine com pound D represented by formula IV in a proportion by weight of A : B : C : D = 100 : 20 - 200 : 1 - 10 : 1 - 20. In formulae I - IV, (n) is 1 - 50; R1 is H or methyl; R2 is - CH2CH2-, -CH2CH2CH2-, or -CH2CHOHCH2-; R3 is methyl, ethyl, propyl, or butyl; l is 2 or 3; m is 0 or 1; l + m = 3; each of R4 and R5 is H, alkoxy, or dialkyl- amino; and R6 in formula IV is H, methyl, ethyl, phenyl, or the like, thus permitting the obtained photosensitive resin composition to be enhanced in adhesion, and reduced in elasticity, however, superior in photosetting performance with high sensitivity and superior in heat resistance of the hardened film.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a photosensitive polyimide resin parallax with good adhesion, low elastic modulus, high sensitivity and high heat resistance.

(Conventional technology) Conventionally, surface protection films and interlayer insulating films of semiconductor elements, etc.
Polyimide resin is used because it has excellent heat resistance and outstanding electrical and mechanical properties. However, in recent years, semiconductor devices have become more highly integrated and larger, sealing resin packages have become thinner and smaller, and solder With the shift to surface mounting methods using reflow, there is a demand for significant improvements in heat cycle resistance, heat shock resistance, etc., and conventional polyimide resins have
It has become difficult to respond.

As a countermeasure against this problem, it is known that, for example, a silicone component is introduced into polyimide resin to increase adhesion and lower the elastic modulus. (Unexamined Japanese Patent Publication No. 61-64730, Unexamined Japanese Patent Application No. 64730,
2-223228, etc.) On the other hand, a technique for imparting photosensitivity to polyimide resin itself has recently attracted attention.

Using these photosensitive polyimide resins not only simplifies the pattern creation process compared to non-photosensitive polyimide resins, but also eliminates the need to use highly toxic etching solutions. It is also superior in terms of safety and pollution, and photosensitization of polyimide resin is expected to become an even more important technology in the future, along with the development of high adhesion and low elastic modulus of polyimide resin.

As the photosensitive polyimide resin, for example, the following formula (R1:
Megumi R●: {n. A polyimide precursor composition to which a photosensitive group is provided with an ester group having a structure as shown in Ben 9 (Japanese Patent Publication No. 55-30207, Japanese Patent Publication No. 55-41422) or the following formula (
R,: Esha, R,. : A set in which a compound containing a carbon-carbon double bond and an amino group or a quaternized salt thereof that can be dimerized or polymerized by actinic radiation is added to polyamic acid having a structure as shown in <<Screw O<<1)>. Bomono (for example, Japanese Unexamined Patent Publication No. 145794/1983) is known.

All of these are dissolved in a suitable organic solvent, applied as a varnish, dried, exposed to ultraviolet light through a photomask, developed and rinsed to obtain the desired pattern, and then heat-treated to form a polyimide. It is a coating.

However, when such conventional photosensitization technology is applied to a polyimide resin with high adhesion and low elastic modulus, in which a silicone group is introduced into the polyimide resin, it is difficult to pattern even when irradiated with ultraviolet rays, or the sensitivity is extremely low. However, the exposure equipment commonly used in the semiconductor industry was insufficient for processing.

Furthermore, when the film thickness of these photosensitive polyimide resins is increased, the photosensitivity is extremely reduced and the proper exposure time becomes extremely long.

(Problems to be Solved by the Invention) The purpose of the present invention is to improve adhesion by introducing silicone groups into polyamic acid, and to achieve high sensitivity photocurability despite lowering the elastic modulus. It is an object of the present invention to provide a photosensitive resin composite having the following properties and further having an excellent heat resistance of the film after curing.

(Means for Solving the Problems) The present invention provides a polyamic acid (A) containing 1 to 50% by weight of silicone diamine represented by the following general formula (1).
And, as a photosensitizer, a polyfunctional aminoacrylate having 2 to 3 acrylic or methacrylic groups in one molecule is represented by the general formula Cl) below! -(B) R, and a biscoumarin compound (C) n represented by the following general formula (I[l) as a sensitizer and a glycine compound CD) represented by the following general formula [■] as an initiator. per 100 parts by weight of (A), photosensitizer (
B) A photosensitive resin composition containing 20 to 200 parts by weight, 1 to 10 parts by weight of a sensitizer (C), and 1 to 20 parts by weight of an initiator (D) is used.

(Function) The silicone diamine represented by the general formula [E] used in the present invention has the effect of improving the density and M property of the polyimide coating and lowering the elastic modulus.

The degree of polymerization n of the silicone diamine needs to be 1 to 50, and when n is less than 1, the adhesion is improved,
If a long-chain silicone diamine that is not effective in lowering the elastic modulus and has n exceeding 50 is used, the reaction with tetracarboxylic dianhydride will be difficult to proceed quantitatively, and it will remain as an unreacted product. This is not preferable because it not only does not increase the molecular weight but also reduces flexibility and makes cracks more likely to occur.

The amount of silicone diamine used is preferably 1 to 50% by weight based on the polyamic acid component.

If it is less than 1% by weight, the effects of improving adhesion and lowering the elastic modulus cannot be obtained, and if it exceeds 50% by weight, the heat resistance is significantly reduced and the characteristics inherent to polyimide resins cannot be obtained, which is not preferable.

As the diamine used in the present invention, in addition to the above-mentioned silicone diamines, aromatic diamines such as those listed below can also be used to impart various properties.

For example, m-7 enylene diamine, l-ingrobyl-2,4-phenylene diamine, p-7 enylene diamine, 4,4'-cyaminodiphenylpropane, 3.
3'-diaminodiphenylpropane, 4.4'-diaminodiphenylethane, 3.3'-diaminodiphenylethane, 4.4'-diaminodiphenylmethane, 3.
3'-diaminodi7enylmethane, 4,4'-diaminodiphenylsul7iF, 3,3'-cyamino-di7
enyl sulfide, 4.4'-diaminodiphenyl sulfone, 3.3'-diaminodi7enylsnorrefone, 4.4'-diaminodi7enyl ether, 3.3
'-diaminodi7enyl ether, benzidine, 3.
3'-Diaminobi-7enyl, 3,3'-dimethyl-4
．． 4'-Diaminobiphenyl, 3.3'-dimethoxybenzidine, 4.4''-diamino-p-tel7enyl, 3.31-diamino-p-tel7enyl, bis(p-tel7enyl)
-aminosichexyl)methane, bis(p-β-amino-t-butylphenyl)ether, bis(p-β-
methylatoaminopentyl)benzene, p-his(2-
Methyl-4-aminobentyl)benzene, p-his(
1.1-dimethyl-5-aminopentyl)benzene,
1,5-diaminonaphthalene, 2,6-diaminona 7talene, 2,4-his(β-amino/-1-butynole)
Tonolene, 2.4-diaminotoluene, m-xylene-2.5-diamine, p-xylene-2.5-diamine, m-xylylene-diamine, p-quinrylene-diamine, 2.6-diamino Pyridine, 2,5-diamino-pyridine, 2,5-diamino-1,3,4-oxadiazole, 1,4-diamino-hexane, viperazine, methylene diamine, ethylene diamine, propylene diamine, 2. 2-dimethyl-propylene-diamine, tetramethylene-diamine, pentamethylene-diamine, hexamethylene-diamine, 2.5-dimethyl-hexamethylene-diamine, 3-methoxyhexamethylene-diamine, hebutamethylene-diamine, 2
．． 5-dimethyl-hebutamethylene-diamine, 3-methyl-hebutamethylene-diamine, 4,4-dimethyl-hebutamethylene-diamine, octamethylene-diamine,
nonamethylene diamine, 5-methylnonamethylene diamine, 2,5-dimethylnonamethylene diamine, decamethylene diamine, 1,10-diamino-1,
Examples include, but are not limited to, to-dimethyl-decane, 2,11-diaminodecane, 1,12-diamino-octadecane, 2,12-diamino-octadecane, 2,17-diamino-deicosane, etc. .

The tetracarboxylic dianhydride component to be reacted with the diamine dianhydride may be one type or a mixture of two or more types, but examples of the tetracarboxylic dianhydride used include pyromellitic dianhydride, benzene-1 .2,3,4
, -tetracarboxylic dianhydride, 3.3'. 4.4
'Monobenzo7enonetetracarboxylic dianhydride, 2.2
'． 3.3'-benzophenone tetracarboxylic dianhydride, 2,3.3',4'-penzophenone tetracarboxylic dianhydride, naphthalene-2.3,6.7-
Tetracarboxylic dianhydride, naphthalene-1.2,5.
6-tetracarboxylic dianhydride, na7talene-1.2,
4.5-Tetracarboxylic dianhydride, naphthalene-1.
4.5.8 Tetracarboxylic dianhydride, naphthalene-1
．． 2.6.7-tetracarboxylic dianhydride, 4.8-dimethyl-1.2,3,5,6.7-hexahydro-naphthalene-1.2.5.6-tetracarboxylic dianhydride, 4,
8,-dimethyl-1.2.3,5,6.7-hexahydronaphthalene-2.3.6.7-tetracarboxylic dianhydride, 2.6-dichlorothalene-1.45. 8-Tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1.4,5.8-tetracarboxylic dianhydride, 2,3
,6.7-tetrac-naphthalene-1.4,5.8-
Tetracarboxylic dianhydride, 1,4.5.8-tetracronaphthalene-2.3.6.7-tetracarboxylic dianhydride, 3.3',4.4'-diphenyltetracarboxylic dianhydride , 2.2'. 3.3'-diphenyltetracarboxylic dianhydride, 2.3.3'. 4′-diphenyltetracarboxylic dianhydride, 3.3”, 4.4
"-p-tel7enyltetracarboxylic dianhydride, 2.
2'',3.3''-p-ter7enyltetracarboxylic dianhydride, 2.3.3''.4''-p-terphenyltetracarboxylic dianhydride, 2.2-bis(2 ．．
3-dicarpoxyphenyl)-propanihydride L 2.
2-bis(3.4.-dicarboxy7enyl)-furopannianhydride, bis(2.3-dicarpoxyphenyl)ether dianhydride, bis(3.4-dicarboxy7enyl)ether dianhydride, bis(2. 3-dicarboxy7enyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, bis(2,3-dicarpoxyphenyl)sulfone dianhydride, bis(3,4-dicarpoquinfer) Sulfonic anhydride, 1.1-bis(2.3
-dicarpoxy7enyl)ethane dianhydride, 1,1-bis(3.4-dicarboxyphenyl)ethane dianhydride, perylene-2.3,8.9-tetracarboxylic dianhydride, perylene-3. 4.9.10-tetracarboxylic dianhydride, berylene-4,5,10.11-tetracarboxylic dianhydride, perylene-5.6.11.12-tetracarboxylic dianhydride, 7-enanthrene-1.2 .7.8
-Tetracarboxylic dianhydride, phenanthrene-1,2
, 6.7-tetracarboxylic dianhydride, phenanthrene-1,2.9.10-tetracarboxylic dianhydride, cyclopentane-1.2.3.4-tetracarboxylic dianhydride, pyrazine-2.3. Examples include, but are not limited to, 5.6-tetracarboxylic dianhydride, pyrrolidine-2.3.4.5-tetracarboxylic dianhydride, thiophene-2.3.4.5-tetracarboxylic dianhydride, etc. It's not something you do.

The polyfunctional aminoacrylate (B) in the present invention is a tertiary amine/acrylic compound having two or three acrylic or methacrylic groups in one molecule.

Monofunctional aminoacrylates, which have one acrylic or methacrylic group in one molecule, do not form a crosslinked structure even when irradiated with light, resulting in low sensitivity, cracks in the pattern during development, and many This is not preferable because film thinning occurs.

Polyfunctional aminoacrylates CB) include N-methyldiethanolamine dimethacrylate, N-ethyldiethanolamine dimethacrylate, N-methyldiethanolamine diacrylate, N-ethyldiethanolamine diacrylate, N-n-propyldiethanolamine dimethacrylate, N-n- Examples include, but are not limited to, propyldiethanolamine diacrylate, N-methyldiprobanol dimethacrylate, N-ethyldipropanol dimethacrylate, triethanolamine trimethacrylate, triethanolamine triacrylate, and the like.

Furthermore, in addition to the polyfunctional amino acrylates mentioned above, monofunctional amino acrylates and polyfunctional acrylates without amino groups can also be used in combination with the amino acrylates used in the present invention in order to impart various properties. .

Further, the blending amount of the polyfunctional amino acrylate is preferably 20 to 200 parts by weight based on 100 parts by weight of the solid content of the polyamic acid.

If the amount is less than 20 parts by weight, a sufficient photocrosslinked product will not be obtained and will all dissolve during development, which is not preferred.

Moreover, if the blending amount exceeds 200 parts by weight, the added amount is so large that even if effective photocrosslinking is carried out, scattering shrinkage will be large during heat treatment, and the crank will become brittle, which is undesirable.

The sensitizer of component (C) in the present invention has the following formula (II[)
It is a biscoumarin compound substituted with carbonyl at the 3-position represented by n (in the formula, R4, RS: -H, alkoxy group, dialkylamino group).

Examples of the biscoumarin compound include 3.3'-carponyl rubis (7=diethylaminocoumarin), 3.
Examples include, but are not limited to, 3'-carponyl rubis (5,7-dimethoxy7-carponyl coumarin).

Penzo 7 is a sensitizer used in photosensitive resin compositions.
enone, acetophenone, anthrone, p. p'-tetramethyldiaminobenzophenone (Michler's ketone),
Phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, penzoquinone, N-acetyl-p-nitroaniline, p-nitroaniline, 2-ethynoleanthraquinone, 2-tert-butynolean 1-laquinone, N
-acetyl-4-1-2-l-na-7thylamine, picramide, 1,2-penzanthraquinone, 3-methyl-1
．． 3~Diazar 1.9-Penzuanthrone, p. p'-
Tetraethyldiaminobenzophenone, 2-chloro-4
-Nitroaniline, dibenzalacetone, 1,2-naphthoquinone, 2,5-bis-(4'-diethylaminobenzanoline pentane, 2+6-histo(4'-diethylaminobenzal)monocyclohexanone, 2,6- His-(4'-dimethylaminobenzal)-4-methyl-cyclohexanone, 2.6-bis-(4'-diethylaminobenzal)-4-methyl-cyclohexanone, 4.
4'-bis(dimethylamino)monochalcone, 4.4'
-bis(diethylamino)monochalcone, P-dimethylaminobenzylideneindanone, 1,3-bis-(4'
-dimethylaminobenzal) monoacetone, l,3-bis-(4'-diethynoleaminobenzanole) monoacetone,
Examples include N-phenynorediethanolamine, N-p-tolyldiethylamine, etc., but the vistamarin compound discovered in the present invention can only be used in combination with the glycine compound used as an initiator in the present invention. Surprisingly excellent I: Shows sensitizing effect. How is this amazing synergy achieved?
The reason for this is not clear at this time.

The amount of Vistamarin compound blended is most preferably 1 part by weight or more and 1 part by weight or less based on 1001 parts of boriamic acid, and sensitizers other than the Vistamarin compound may also be used in combination.

When the amount of the biscoumarin compound is less than 1 part by weight,
The amount of optical energy absorbed is insufficient, resulting in insufficient crosslinking, and beyond the loffiffi region, the amount of light energy transmitted is insufficient, which is undesirable because deep photocuring does not proceed rapidly.

The initiator (D) in the present invention is represented by the following formula (IV) (
In the formula, R a : -H, -C H ), -C tH
s, -C *H s, -OCHs. -00CCHs,-
OCxHs , -O O C C 2H S, -N (
C H x)z, -N(C!H S)2, -NHCO
OCH3. -COCH3, -COCzHs, -NHCO
N H 2 , - CH 2 0 H-OH, -
It is a glycine compound with a phenyl group represented by CH(CH3)i -C(CH3)3).

Initiators used in photosensitive resin combinations include 2.2-
Dimethoxy-2-phenyl-acetophenone, l-hydroxy-cyclohexyl-7enylketone, 2-methyl-[4-(methylthio)7enyl]-2 mol 7-olino-1-propane, 3.3'4 .4'-Tetler (
L-butylperoxycanoleponinol) penzophenone, benzinol, penzoin-isobutyl ether, penzoin-isobutyl ether, 4,4'-dimethoxybenzyl, 1,4-dibenzoylbenzene, 4-penzoylbiphenyl , 2-penzoylnaphthalene, methyl 10-penzoylbenzoate, 2.2'-bis(o-chlorophenyl)-4.4'5.5'-tetraphenyl-1,2'-biimidazole, lO-butyl-2- Chloracridone, ethyl 4-dimethylaminobenzoate, dibenzoylmethane, 2,4-diethylthioxanthone, 3,3-dimethyl-4-methoxypenzophenone, 2-hydroxy 2-methyl-1-phenylpropane-1 -one, ■-(4-impa-pil7enyl)-2-
Hydroxy-2-methylprohan-1-one, l-(4
-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, I-phenyl-l2-butanedione-2-(o-methoxylponyl)oquine, l-phenyl-propanebutanedione-2-(obenzoyl)
Oxime, 1,2-diphenylethanedione-1-(
o-benzoyl)oxime, 1,3-diphenyl-7-robantrione-2-(o-benzoyl)oxime, l-7-diphenyl-3-ethoxybrobantrione-
Although 2(0-benzoyl) oxime and the like have been used, the glycine compound discovered in the present invention, in combination with a biscoumarin compound as a sensitizer, has a much higher luminosity than other initiators. It showed a reaction initiation effect.

The reason for how this surprising effect is expressed is currently not clear.

The amount of glycine compound is polyamic acid 10
01! : 1 to 20 parts by weight is essential, and initiators other than glycine compounds may also be used in combination.

If the amount of the glycine compound used as an initiator is less than lIIJifi, the photosensitivity will be insufficient, which is not preferable.

Moreover, if it exceeds 20 parts by weight, the film properties after heat treatment and curing will deteriorate.

The present invention will be specifically explained below using Examples.

Example 1 Silicone diamine with 15 (n
= 1 5) 35 g (35% by weight in polyamic acid) of the following formula, 45 g of 3.3''.4.4'-henzophenonetetracarboxylic acid dianhydride, and 4.4'-
20 g of cyamino diphenyl ether was reacted in N-methylpyrrolidone solvent to obtain a polyamic acid solution (
(solid content: 100 parts by weight), 60 g (60 parts by weight) of N-methyldiethanolamine dimethacrylate, and 4 g of 3,3'-carbonyl rubis (7-diethylaminocoumarin).
(4 parts by weight) and 8 g (8 parts by weight) of N-phenylglycine.
were added and mixed and dissolved at room temperature.

The obtained solution was applied onto an aluminum plate using a swinner, and dried in a dryer at 80'C for 1 hour.

Kodak Photographic Step Tablet No.2.
/, '2, so the larger the residual stage after development, the better the sensitivity) was stacked, irradiated with ultraviolet rays of 500 mj/cm2, and a developer containing 60% by weight of N-methylpyrrolidone and 40% by weight of methanol was used. After development and further rinsing with isopropyl alcohol, the pattern remained up to 12 steps, indicating high sensitivity.

Next, the coating was applied onto a silicone wafer in the same manner as described above, the entire surface was exposed, development and rinsing steps were performed, and then
Heat curing was performed at 50, 250, and 350'O for 30 minutes each.

For the adhesion test, 100 pieces were cut into 1 mm squares and an attempt was made to peel them off using Sellotape, but not a single piece came off, indicating that the adhesive was highly adhesive.

Separately, it was coated on an aluminum plate, exposed to light over the entire surface, developed, rinsed, and cured with heat, and then the aluminum plate was removed by etching to obtain a film.

Tensile modulus of the obtained film (JIS K-6760
) was as low as 110 Kg/mm'', and the thermal decomposition onset temperature was as high as 420°C.

In this way, the extremely excellent effects of high sensitivity, high adhesion, low elastic modulus, and high heat resistance were simultaneously obtained.

Comparative Example 1-13 A similar experiment was carried out according to the method of Example 1, changing the number of siloxane bonds in the silicone diamine, the amount added, and the type and amount of the photosensitizer, sensitizer, and initiator, and the results shown in Table 1 were obtained. Obtained.

In Comparative Example 1, the amount of initiator added was 0.8 parts by weight, and the photosensitivity was extremely low.

Comparative Example 2 is the opposite of Comparative Example 1, with 28 parts by weight.
In this case, the initiator remained in the film, resulting in a low thermal decomposition initiation temperature.

Comparative Example 3 used an initiator other than the one according to the invention, had low photosensitivity, and was not practical.

In Comparative Example 4, the amount of sensitizer added was 0.5 parts by weight, and in this case, the photosensitivity was extremely low and the crosslinking was insufficient.

In Comparative Example 5, the amount of sensitizer was 35 parts by weight, and in this case, the amount of light transmitted to the deep part was insufficient, the curing in the deep part was insufficient, and voids were generated, and a uniform film was not obtained.

Comparative Example 6 used a sensitizer other than the one according to the invention and had low photosensitivity, making it impractical.

In Comparative Example 7, the amount of photosensitizer added was 151 iM parts, and in this case, not only the photosensitivity was low, but also the film loss was large due to insufficient crosslinking.

In Comparative Example 8, the amount of photosensitive agent added was 1 part of 2,601 tf, and in this case, the amount of scattering during high temperature curing was large, cracking occurred, and a uniform film could not be obtained.

Comparative Example 9 used a photosensitizer other than the one of the present invention, and since it was a monofunctional acrylate, it did not become three-dimensional even after exposure, and all of it ran away during development.

In Comparative Example 10, the amount of silicone diamine added was 0.5 weight.
In this case, the elastic modulus could not be lowered.

In Comparative Example II, the amount of added licone diamine was 75% by weight.
In this case, the film became blurry.

In Comparative Example 12, the number of siloxane bonds in the silicone diamine was set to n=o, and in this case, cracks occurred during film formation due to lack of flexibility.

In Comparative Example 13, the number of siloxane bonds in the siloxanediamine was set to n-100, and in this case, the reactivity was low, unreacted silicone stood out at the time of film formation, and the sensitivity did not improve.

(Effects of the Invention) Attempts have been made to improve adhesion and reduce elastic modulus by introducing siloxane bonds into the main chain structure of polyimide resins.

However, with conventional photosensitization techniques, it has not been possible to obtain good patterns because there are no suitable sensitizers or initiators to improve the photosensitivity of silicone-modified polyimide resins.

However, in the present invention, by employing a combination of a special sensitizer with extremely high photosensitivity and an initiator, it has become possible to obtain a good pattern with a small amount of light irradiation. Furthermore, the heat-cured polyimide resin has excellent heat resistance as all the photo-cured acrylates scatter, and since it has been modified with silicone, it has a low elastic modulus and high adhesion. I got it at the same time.

Claims (1)

[Claims] (1) (A) Polyamic acid containing 1 to 50% by weight of silicone diamine represented by the following formula [I] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ------- [ I ] (In the formula, n is 1 to 50) (B) Polyfunctional aminoacrylate having 2 to 3 acrylic or methacrylic groups in one molecule, represented by the following formula [II] ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ −[I
I] (in the formula R_1: -H, -CH_3 R_2: -C_2H_4-, -C_3H_6-, -CH
_2CHOHCH_2- R_3: -CH_3, -C_2H_5, -C_3H_7
, ▲There are mathematical formulas, chemical formulas, tables, etc. ▼l: 2-3, m:
0 to 1, l+m=3) (C) Biscoumarin compound substituted with carbonyl at the 3-position represented by the following formula [III]
] (In the formula, R_4, R_5: -H, alkoxy group, dialkylamino group) (D) Glycine compound represented by the following formula [IV] ▲ Numerical formula,
There are chemical formulas, tables, etc. ▼−−−−−[IV] (In the formula, R_6: -H, -CH_3, -C_2H_5, -
C_6H_5, -OCH_3, -OOCCH_3, -O
C_2H_5, -OOCC_2H_5, -N(CH_3
)_2, -N(C_2H_5)_2, -NHCOOCH
_3, -COCH_3, -COC_2H_5, -NHCONH_2, -CH_2
OH-OH, -CH(CH_3)_2, -C(CH_3
)_3) is an essential component and (A) is (100 parts by weight) (
B) 20 to 200 parts by weight, (C) 1 to 10 parts by weight, and (
D) A photosensitive resin composition comprising 1 to 20 parts by weight.