JPH0356962A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE:To obtain the compsn. having a good adhesive property, small modulus of elasticity, high sensitivity, and high heat resistance by using polyamic acid copolymerized with a specific silicone diamine, amine compd., styryl compd., and a glycine compd. as essential components. CONSTITUTION:This compsn. contains the polyamic acid (A) copolymerized with 1 to 50wt.% silicone diamine expressed by formula I, the amine compd. (B) expressed by formula II as a photosensitive agent, the styryl compd. (C) expressed by formula III as a sensitizer, and the glycine compd. (D) expressed by formula IV as an initiator as its essential components and is formed by compounding 20 to 200 pts. wt. photosensitive agent (B), 1 to 10 pts. wt. sensitizer (C) and 1 to 20 pts. wt. initiator (D) per 100 pts. wt. (A)/ In the formulas I to V; n denotes 1 to 50; R1 denotes -H, -H3, -2H5, etc.; R2 denotes -H, -CH3, X, etc.; R3 denotes -H, -CH3, -C2H6, etc.; R4 denotes formula V, etc.; R5 denotes -H, -CH3, -C2H5, -C6H5, etc. The comps. which has a photosetting property of a high degree in spite of lowering of the modulus of elasticity and has the excellent heat resistance of the film after curing is obtd. in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a photosensitive polyimide resin material that has good adhesion, low elastic modulus, high sensitivity, and high heat resistance.

(Conventional technology) Conventionally, surface protection films and interlayer insulating films of semiconductor elements, etc.
Polyimide resin is used because it has excellent heat resistance and excellent electrical and mechanical properties, but in recent years, semiconductor devices have become more highly integrated and larger, and sealing resin packages have become thinner and smaller. With the shift to surface mounting methods using solder reflow, there is a demand for significant improvements in heat cycle resistance, heat shock resistance, etc., and conventional polyimide resins have
It has become difficult to respond.

As a countermeasure against this problem, it is known that, for example, a certain amount of silicone is introduced into the polyimide resin to increase the adhesion and lower the elastic modulus. (JP-A-61-64730, JP-A-62-223228, etc.) On the other hand, a technique for imparting photosensitivity to polyimide resin itself has recently attracted attention.

Using these photosensitive polyimide resins not only simplifies the pattern creation process compared to non-photosensitive polyimide resins, but also eliminates the need to use the highly toxic Ni-Tinda liquid. It is also superior in terms of safety and pollution, and photosensitization of polyimide resin is expected to become an even more important technology in the future, along with the development of high adhesion and low elastic modulus of polyimide resin.

As the photosensitive polyimide resin, for example, a polyimide precursor composition to which a photosensitive group is added with an ester group having a structure as shown in the following formula (R.: R7: -41422) or polyamicoxylic acid having a structure as shown in the following formula by actinic radiation.
Compositions containing a compound containing a quantifiable or polymerizable carbon-carbon double bond and an amine group or a quaternized salt thereof (for example, Japanese Patent Application Laid-Open No. 145794/1983) are known.

All of these are dissolved in a suitable organic material,
After being applied in a varnish state and dried, it is irradiated with ultraviolet rays through a photomask, developed and rinsed to obtain a desired pattern, and then heat-treated to form a polyimide film.

However, when such conventional photosensitization technology is applied to a polyimide resin with high adhesion and low elastic modulus in which silicone groups are introduced into the polyimide resin section, buttering is unlikely to occur even when irradiated with ultraviolet rays, or the sensitivity is significantly increased. was low and insufficient for processing with exposure equipment commonly used in the half-body industry.

Furthermore, when the film thickness of these photosensitive polyimide resins is increased, the photosensitivity decreases to the 8i end, and the proper exposure time becomes extremely long.

(Problems to be Solved by the Invention) The purpose of the present invention is to improve adhesion by introducing silicone groups into polyamic acid, and to achieve high sensitivity photocurability despite lowering the elastic modulus. It is an object of the present invention to provide a photosensitive resin composition which has the following properties and further has an excellent heat resistance of a film after curing.

(Means for Solving the Problems) The present invention comprises a polyamic acid (A) containing 1 to 50% by weight of a silicone diamine represented by the following general formula [■], and a photosensitive agent of the following general formula ('ID). The following amine compound (B), a stinol compound (C) represented by the following general formula (II!) as a sensitizer, and a glyc/phosphorus compound (D) represented by the following general formula [■] as an initiator are essential. Prescription: (A) 100 parts by weight, photosensitizer (B) 20-200 parts by weight, sensitizer (C) !~1
0 parts by weight and 1 to 20 parts by weight of the initiator (D).

(Function) The general formula used in the present invention [. The silicone diamine represented by I] improves the adhesion of the polyimide film,
It has the effect of lowering the elastic modulus.

The degree of polymerization n of the silicone diamine needs to be 1 to 50, and when n is less than 1, the adhesion is improved,
If the effect of lowering the elastic modulus cannot be obtained and a long chain silicone diamine with n exceeding 50 is used, the reaction with tetracarboxylic dianhydride will proceed quantitatively and the reaction will proceed as unreacted material. This is not preferable because it remains and not only does the molecular weight not increase, but also reduces flexibility and makes cracks more likely to occur.

The amount of silicone diamine used is preferably 1 to 50% by weight based on the polyamic acid content.

If it is less than 1% by weight, the effects of improving adhesion and lowering the elastic modulus cannot be obtained, and if it exceeds 50% by weight, the heat resistance will be significantly lowered and the characteristics inherent to polyimide resins will not be obtained, which is not preferable.

As the diamine used in the present invention, in addition to the above-mentioned silicone-based diamines, the following aromatic diamines can also be conveniently used in order to impart various properties.

For example, m-phenylene diamine, 1-isobrobyl-
2.4-7 enylene diamine, p-phenylene diamine 7,4.4'-'; aminodiphenylpropane, 3
3'diamino=di7enylpropane. 4.4'-diamino-diphenylethane, 33'-diamino-diphenylethane, 4.4'-diamino-diphenylethane, 3.
3'-Diaminodiphenylsulfone, 4.4'-diaminodi7enylsulfine}', 3.3'-cyaminodiphenylsulfine F, 4.4'-cyaminodiphenylsulfone, 3.3'-dia Minodiphenylsulfone, 4.4'-siaminodiphenyl ether, 3.3
'-Diaminodi7enyl ether, bensiscine. 3
．． 3'-'; aminobiphenyl, 3.3'-dimethyl-4,4'-diaminobiphenyl, 3.3'-dimethyne-benzidine, 4.4''-diamino-p-terphenyl, 3. 3”-diaminop-terphenyl, bis(
p-aminosichexyl)methane, bis(p-β-
Amino-butyl 7-enyl) ether, bis(p-β
-methyl-δ-aminopentyl)benzene, p-his(
2-Methyl-4-aminopentyl)benzene, p-bis(1,1-dimethyl-5-aminobentyl)benzene, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene. 2.4-his(β-amino-t-phthyl)toluene, 2.4-diaminotoluene, m-xylene-2.5-diamine, p-quinlene-2.5-diamine, m-xylylene-diamine, p-quinrylene diamine, 2,6-diaminor pyridine, 2,5-diaminor pyridine, 2,5-diamino-1,3,4-oxadiazole, 1,4-diaminone clohexane, piperazine, methylene -diamine, ethylene-diamine, propylene-diamine, 2,2-dimethyl-propylene-diamine, tetramethylene-diamine, pentamethylene-diamine, hexamethylene-diamine, 2,5-dimethyl-hexamethylene-diamine, 3- Methoxyhexamethylene diamine, hebutamethylene diamine, 2.
5-dimethyl-hebutamethylene-diamine, 3-methyl-hebutamethylene-diamine, 4,4-dimethyl-hebutamethylene-diamine, octamethylene-diamine,
nonamethylene diamine, 5-methylnonamethylene diamine, 2.5=dimethylnonamethylene diamine, decamethylene diamine, l,10-diamino-1
．． 10-dimethyl-decane, 2.11-diaminodecane, 1.12-diaminooctadecane, 2.12-
Examples include, but are not limited to, diamino L-octadecane and 2,17-diaminoicosane.

The tetracarboxylic dianhydride fraction to be reacted with the diamine component may be one type or a mixture of two or more types, but examples of the tetracarboxylic dianhydride used include biromelli/tonic dianhydride, benzene-1. 2, 3, 4
,-tetracarboxylic dianhydride, 3.3', 4.4
'Monobenzophenonetetracarboxylic dianhydride, 2.2
'． 3.3'-henzo7enonetetracarboxylic dianhydride, 2.3.3'. 4'-benzophenonetetracarboxylic dianhydride, naphthalene-2.3,6.7-
Tetracarboxylic dianhydride, naphthalene-1.2,5.
6-te}racarboxylic dianhydride, naphthalene-1.2,
4.5-Tetracarboxylic dianhydride, naphthalene-1.
4.5.8 Tetracarboxylic dianhydride, naphthalene-1
．． 2.6 7-tetracarboxylic dianhydride, 4.8-dimethyl-l,2,3,5,6.7-hexahydronaphthalene-1.2,5.6-tetracarboxylic dianhydride, 4.
8,-Dimethyl-1.2,3,5.6.7-hexahide naphthalene-2.3,6.7-tetracarphonic dianhydride, 2.6-dichloronaphthalene-l. 4,5,8-
Tetracarboxylic dianhydride, 2.7-dichlorona7talene-1.4,5.8-tetracarboxylic dianhydride, 2.
3.6.7-Tetrachlornaphthalene-1.4,5.8
-Tetracarboxylic dianhydride, 1,4.5.8-tetracarboxylic naphthalene-2.3.6.7-tetracarboxylic dianhydride, 3.3',4.4'-di7enyltetracarpon Acid dianhydride, 2.2',3.3''-diphenyltetracarboxylic dianhydride, 2.3.3'.4'-
Diphenyltetracarboxylic dianhydride, 3.3”, 4
．． 4″'-p-tel7enyltetracarboxylic dianhydride, 2.2″. 3.3"-p-terphenyltetracarboxylic dianhydride, 2.3.3". 4”-p-
Terphenyltetracarboxylic dianhydride, 2,2-bis(2,3-dicarpoxy7enyl)monopropanide anhydride L
2.2-bis(3.4,-dicarpoxyphenyl) monofuropani anhydride, bis(2,3-dicarpoxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, Bis(2.3-dicarpoxyphenyl)methane dianhydride, bis(3.4-dicarpoxyphenyl)methane dianhydride, bis(2.3-dicarpoxyphenyl)sulfone dianhydride, bis(3.4-dicarpoxyphenyl)methane dianhydride -dicarboxin 7enyl)sulfone dianhydride, 1.1-bis(2.3-dicarpoxyphenyl)ethane dianhydride,
1.1-bis(3,4-dicarpoxyphenyl)ethane dianhydride, berylene-23.8.9-tetracarboxylic dianhydride, perylene-3.4,9.10-tetracarboxylic dianhydride, Perylene-4.5,10.11-tetracarboxylic dianhydride, Perylene-5,6,11.12-
Tetracarboxylic dianhydride, phenanthrene-1.2,
7.8-Tetracarboxylic dianhydride, 7-enanthrene-
1.2,6.7-tetracarboxylic dianhydride, phenanthrene-1.2,9.10-tetracarboxylic dianhydride, cyclopentane-1.2.3.4-tetracarboxylic dianhydride, pyrazine-2 .3,5.6-tetracarboxylic dianhydride, pyrrolidine-2.3.4.5-tetracarboxylic dianhydride, thiophene-2.3.4.5-tetracarboxylic dianhydride, etc. It is not limited to these.

The photosensitive agent (B) in the present invention is an amine compound having an amino group and an acrylic or methacrylic group in one molecule.

Examples of the amine compound include N,N-dimethylaminoethyl methacrylate, N,N-dimethylaminoethyl acrylate, N,N-diethylaminoethyl methacrylate, N,N-diethylaminoethyl acrylate, and N,N-dimethylaminopropyropropylene. viracrylamide,
Examples include, but are not limited to, N,N-jethylaminoglobil acrylamide.

The blending ratio of the amine compound (B) is that of the polyamic acid (A
) The amount is desirably 20 parts by weight or more and 200 parts by weight or less per 100 parts by weight.

If the amount of the amine compound is less than 20 parts by weight, a sufficient photocrosslinked product will not be obtained and will all dissolve during development, which is not preferred.

Moreover, if the blending amount exceeds 200 parts by weight, the added amount is so large that even if photocrosslinking is effected, scattering shrinkage will be large and cracks will easily occur during heat treatment, which is not preferable.

The sensitizer of the precept (C) in the present invention has the following formula (I[I)
(In the formula R.: -H. CH., -C, H., C●H, Ru.

Sensitizers used in photosensitive resin compositions include benzophenone, acetophenone, anthrone, p. p'~tetramethyldiaminobenzophenone (Michler's ketone),
Phenanthrene, 2-nitro-7-luorene, 5-nitroacenaphthene, penzoquinone, N-acetyl-p-nitroaniline, p-nitroaniline, 2-ethylanthraquinone, 2-tert-butylanthraquinone, N-acetyl-4-nitro-l-na 7-thylamine, biclamide, I,2-penzanthraquinone, 3-methyl-1,3
- Diazar 1,9 ~ Penzuanthrone, p. p'-tetraethyldiaminobenzo7enone, 2-chloro4-
Nitroaniline, dibenzalacetone, 1,2-naphthoquinone, 2,5-bis-(4′-diethylaminobenzanole)-cyclopentane, 2,6-bis-(4°-diethylaminobenzal)-cyclohexanone, 2 .6bis-(4'-dimethylaminobenzal)-4-methyl-cyclohexanone, 2.6-bis-(4'-diethylaminobenzal)4-methyl-cyclohexanone, 4.4'
-bis-(simethylamino)monochalcone, 4.4'-bis-(diethylamino)monochalcone, p-dimethylaminobenzylideneindanone, l,3-bis-(4'-dimethylaminobenzal)monoacetone, 1, 3-bis=(
Examples include 4'-diethylaminobenzal)-acetone, N-7enyl-diethanolamine, N-p-trinoradiethynoleamine, etc., but the styryl compound discovered in the present invention is It shows a surprisingly excellent sensitizing effect only when used in combination with a glycine compound used as an agent.

The reason for this surprising synergistic effect is not yet clear.

In addition, the blending amount of the styryl compound is polyamic acid 100
Most preferably, the amount is 1 part by weight or more and 101 parts by weight or less based on the weight part, and sensitizers other than styryl compounds may also be used in combination.

If the amount of the styryl compound is less than 1 part by weight, the amount of absorption of the optical fiber will be insufficient, resulting in insufficient crosslinking, and
If the amount exceeds IO parts by weight, the amount of light energy transmitted will be insufficient, and photocuring in deep portions will not proceed quickly, which is undesirable.

The initiator of component (D) in the present invention has the following formula [■] (wherein R s : -H , -C H s , -C zH s
, -C *H s, -OCH1, -00CCHi , -
○C2H. ,00CC2Hs. -N(CH))z. -N
(C2Hs)2, N H C O O C H s ,
- C O C H s , - C O C 2
H sNHCONH2 , -CHtOH, -OH, -C
H (C H!)! ．． -C(CHs)x) is a glycine compound having a 7-enyl group.

Examples of initiators used in photosensitive resin compositions include 22-dimethoxy 2-7 enynolacetophenone! -Hydroxy-hexynolephenyleneketone, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propane, 3.3'4.4'-tetra(L-butylperoxyl) (rubonyl) penzophenone, benzyl, penzoin-imbrovinoleate,
Penzoin isobutyl ether, 4.4'-dimethoxybenzyl, l4-dibenzoinolebenzene, 4-penzoinolebiphenyl, 2-penzoylnaphthalene, methyl 10-penzoylbenzoate, 2.2'-bis(o-
chlorophenyl)-4.4'5.5'-tetraphenyl,2'-biimidazole. 10-7'thi-2-chloroacridone, ethyl 4-dimethylaminobenzoate, dibenzoylmethane, 2,4-diethylthioxanthone, 3,3-dimethyl-4-methquine-benzo7enone, 2-hydroxy-2-methynole- 1-7 enynolepropan-1-one, l-(4-isobrobylphenyl)-2-hydroxy-2-methylpropane-1-
1-(4-dodecylphenyl)-2-hydroxy-2-methylbroban-1-one, l-7enyl-I,
2-butanedione-2-(o-methoxyluponyl)oxime, l-phenylpropanebutanedione-2-(
．． -benzoyl)oxime, 1.2-diphenylethanedione-1-(o-benzoyl)oxime, 1.3
-di7-engine dilupropanetrione-2(o-benzoyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(o-bezoyl)oxime, etc. have been used, but the compounds found in the present invention When combined with a styryl compound as a sensitizer, the glycine compound obtained showed a remarkable photoreaction initiation effect compared to other initiators.

The reason for how this surprising effect is expressed is currently not clear.

The amount of glycine compound is polyamic acid 10
It is essential to use 1 to 20 parts by weight relative to 0 parts by weight, and initiators other than glycine compounds may also be used in combination.

If the amount of glycine compound as an initiator is less than 1 part by weight, the photosensitivity will be insufficient, which is not preferable.

Moreover, if it exceeds 20 weight, the properties of the film after silent curing will deteriorate.

The present invention will be specifically explained below using Examples.

Example l Siloxane X Yoshiai was used as silicone diamine with 15 (n
=15) 35gCH, C
}l, (35% by weight in polyamic acid) and 3.3', 4.4
'-benzophenonetetracarboxylic dianhydride 45g
and 20 g of 4,4'-diaminodi7enyl ether in NM
60 g (60 parts by weight) of N,N-dimethylamine ethyl methacrylate and 2-(p-dimethylaminostylinole) were added to the resulting polyamic acid solution (solid content: 100 parts by weight). ) benzoxazole 4g (4
(parts by weight) and 8 g (8 parts by weight) of N-7 enylglycine were added and dissolved and mixed at room temperature.

The obtained solution was applied onto an aluminum plate using a spinner and dried at 80° C. for 1 hour using a drier.

This film is coated with Kodak's 7 Photographic Step Tablet No. 2.21 step (in this gray scale, as the number of steps increases, the amount of transmitted light increases from the previous step's t.
#"2, so the larger the remaining stage after development, the better the sensitivity) was stacked, irradiated with 500 mj/cm ultraviolet rays, and treated with 60% by weight of N-methylpyrrolidone and 4% methanol.
When developed using a 0% by weight developer and further rinsed with isobrobyl alcohol, the pattern remained up to 16 steps, indicating high sensitivity.

Next, the coating was applied onto a silicone wafer in the same manner as described above, the entire surface was exposed, development and rinsing steps were performed, and then
Heat curing was carried out at 50, 250 and 350°C for 30 minutes each.

For the adhesion test, 100 pieces were cut into 1 mm squares and an attempt was made to peel them off using cellophane tape, but not a single piece was peeled off, indicating high adhesion.

Separately, it was coated on an aluminum plate, exposed to light over the entire surface, developed, rinsed, and cured with heat, and then the aluminum plate was removed by etching to obtain a film.

Tensile modulus of the obtained film (JIS K-6760
) was as low as 1 10 Kg/mm', and the thermal decomposition onset temperature was as high as 4200C.

In this way, the extremely excellent effects of high sensitivity, high adhesion, low elastic modulus, and high heat resistance were simultaneously obtained.

Comparative Examples 1 to 13 Similar experiments were carried out according to the method of Example 1, changing the number of siloxane bonds in the silicone diamine, the amount added, and the type and amount of the photosensitizer, sensitizer, and initiator, and the results shown in Table 1 were obtained. Obtained.

In Comparative Example 1, the amount of initiator added was 0.8 parts by weight, and the photosensitivity was extremely low.

Comparative Example 2 is the opposite of Comparative Example 1, with 28 parts by weight.
In this case, the initiator remained in the film, resulting in a low thermal decomposition initiation temperature.

Comparative Example 3 used an initiator other than the one according to the invention, had low photosensitivity, and was not practical.

In Comparative Example 4, the amount of sensitizer added was 0.4 parts by weight, and in this case, the photosensitivity was extremely low.

In Comparative Example 5, the amount of sensitizer was 24 parts by weight, and in this case, the amount of gold light transmitted was insufficient, and voids were generated, making it impossible to form a uniform film.

Comparative Example 6 used a sensitizer other than the one according to the invention and had low photosensitivity, making it impractical.

In Comparative Example 7, the amount of photosensitizer added was 15 parts by weight.
In this case, not only was the photosensitivity low, but also the film loss was large due to insufficient crosslinking.

In Comparative Example 8, the amount of photosensitive agent added was 250 parts by weight, and in this case, there was a large amount of scattering during high temperature curing, cracking occurred, and a uniform film could not be obtained.

Comparative Example 9 used a photosensitizer other than the one according to the invention, and in this case, it did not have an amine group, so it was not compatible with the polyamic acid, and a uniform film could not be obtained.

In Comparative Example 10, the amount of silicone diamine added was 0.5% by weight, and in this case, the elastic modulus could not be lowered.

In Comparative Example 11, the amount of silicone diamine added was 70% by weight.
In this case, the film became blurred.

In Comparative Example 12, the number of silochitin bonds in the silicone diamine was set to n-0, and in this case, cracks occurred at the time of forming 7 layers due to lack of flexibility.

In Comparative Example 13, the number of siloxane bonds in the siloxane diamine was set to n-too, and in this case, the reactivity was low, unreacted silicone was exposed at the time of 7 irradiation, and the sensitivity was not improved.

(Effects of the Invention) Attempts have been made to improve adhesion and reduce elastic modulus by introducing siloxane bonds into the main chain structure of polyimide resins.

However, with conventional photosensitization technology, not only are the photosensitive groups not compatible with the silicone moiety, but there is also a lack of suitable sensitizers and initiators to improve photosensitivity, making it impossible to obtain good patterns. .

However, in the present invention, not only the photosensitizer is uniformly dispersed in the silicone-modified polyamic acid, but also a combination of a special sensitizer with extremely high photosensitivity and an initiator is used, so that it can be processed with a small amount of light irradiation. Now I can get a good pattern.

Furthermore, the heat-cured polyimide resin has excellent heat resistance as all the photo-cured acrylates scatter, and since it has been modified with silicone, it has a low elastic modulus and high adhesion. I got it at the same time.

Claims (1)

[Claims] (1) (A) Polyamic acid containing 1 to 50% by weight of silicone diamine represented by the following formula [I] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ------- [ I ] (In the formula, n is 1 to 50) (B) Amine compound represented by the following formula [II] ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ ------- [II] (In the formula, R_1: -H, -CH_3, -C_2H_5, R
_2: -H, -CH_3, X: -O-, -NH-, n:
2-3] (C) Styryl compound represented by the following formula [III] ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ −−−−−−− [
III] (in the formula R_3: -H, -CH_3, -C_2H_5, -
C_6H_5R_4;▲There are mathematical formulas, chemical formulas, tables, etc.▼,▲There are mathematical formulas, chemical formulas, tables, etc.▼,▲There are mathematical formulas, chemical formulas, tables, etc.▼,▲There are mathematical formulas, chemical formulas, tables, etc.▼ ▲Mathematical formulas, chemical formulas, There are tables, etc.▼,▲mathematical formulas, chemical formulas,
There are tables, etc.▼、▲There are mathematical formulas, chemical formulas, tables, etc.▼
, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ , ▲ Mathematical formulas, chemical formulas,
There are tables etc.▼(R;H,CH_3,C_2H_5)
(D) Glycine compound represented by the following formula [IV] ▲ Formula,
There are chemical formulas, tables, etc. ▼−−−−−−[IV] (R_5 in the formula: -H, -CH_3, -C_2H_5, -
C_6H_5, -OCH_3, -OOCCH_3, -O
C_2H_5, -OOCC_2H_5, -N(CH_3
)_2,-N(C_2H_5)_2,-NHCOOCH
_3, -COCH_3, -COC_2H_5, -NHC
ONH_2, -CH_2OH, -OH, -CH(CH_
3)_2,-C(CH_3)_3) is an essential component and (A
) 20 to 200 parts by weight of (B) to 100 parts by weight, (
A photosensitive resin composition comprising C) 1 to 10 parts by weight and (D) 1 to 20 parts by weight.