JPH03205895A - Electronic parts mounting method - Google Patents
Electronic parts mounting methodInfo
- Publication number
- JPH03205895A JPH03205895A JP180590A JP180590A JPH03205895A JP H03205895 A JPH03205895 A JP H03205895A JP 180590 A JP180590 A JP 180590A JP 180590 A JP180590 A JP 180590A JP H03205895 A JPH03205895 A JP H03205895A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- laser irradiation
- soldered
- laser
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 238000007796 conventional method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板への電子部品実装方法に関し、特
にレーザー照射による半田付けに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting electronic components onto a printed circuit board, and particularly to soldering by laser irradiation.
従来、この種のプリント基板への電子部品実装方法は、
第２図に示すようにリフロー可能な比較的大きな電子部
品１とリフロー可能なチップ部品３ではフローもしくは
りフローの条件が異るため、部品搭載およびフローもし
くはりフローをそれぞれ個別に行っていた。Conventionally, the method for mounting electronic components on this type of printed circuit board is
As shown in FIG. 2, the relatively large electronic component 1 that can be reflowed and the chip component 3 that can be reflowed have different flow conditions, so component mounting and flow or reflow were performed separately.
上述した従来のプリント基板への電子部品実装方法では
、リフロー可能な比較的大きな電子部品のフローもしく
はりフロー条件と、リフロー可能なチップ部品のフロー
もしくはりフロー条件が異なるため半田付けを無人化す
るためには、数回の部品搭載及びリフローが必要であっ
た。またこの問題を改善するためにレーザー照射による
半田付けを用いても、レーザー照射により半田付けされ
る部品の外周のうち、レーザー照射により半田付けされ
る端子を含む辺をレーザー光で掃引する際、その辺の近
傍にチップ部品等が存在すると、チップ部品にレーザー
光があたらないように、レーザー照射を断続的に行わな
くてはならず、非効率的であった。In the conventional method of mounting electronic components on a printed circuit board as described above, the flow conditions for relatively large reflowable electronic components are different from the flow conditions for reflowable chip components, so soldering is automated. This required several parts mounting and reflow steps. In addition, even if soldering by laser irradiation is used to improve this problem, when sweeping the side of the outer circumference of the component to be soldered by laser irradiation that includes the terminal to be soldered by laser irradiation with laser light, If there are chip components or the like in the vicinity, laser irradiation must be performed intermittently to prevent the laser beam from hitting the chip components, which is inefficient.
またレーザー照射により半田付けされる端子の近傍にチ
ップ部品等が存在するとその端子にレーザーを照射する
際チップ部品を破壊する危険性があった。Furthermore, if a chip component or the like exists near a terminal to be soldered by laser irradiation, there is a risk that the chip component will be destroyed when the laser irradiates the terminal.
本発明の目的は、レーザー照射により半田付けされる部
品の端子を含む辺に、部品配置禁止帯を設けることによ
り、レーザー照射による部品破壊を防止する電子部品実
装方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting method that prevents parts from being destroyed by laser irradiation by providing a component placement prohibition zone on the side including a terminal of a component to be soldered by laser irradiation.
本発明のプリント基板への電子部品実装方法は、レーザ
ー照射により半田付けされる部品の外周のうちレーザー
照射により半田付けされる端子を含む辺には、レーザー
光線のスポット径の幅だけフロー及びリフロー部品の実
装を行なわないことを特徴とする。In the method for mounting electronic components on a printed circuit board according to the present invention, on the outer periphery of the component to be soldered by laser irradiation, on the side including the terminal to be soldered by laser irradiation, flow and reflow components are applied by the width of the spot diameter of the laser beam. It is characterized by not implementing.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例によるプリント板上に部品を
搭載した時の平面図である。FIG. 1 is a plan view of parts mounted on a printed board according to an embodiment of the present invention.
第１図はレーザー半田付部品１と、チップ部品２と、リ
フロー可能はチップ部品３と、部品配置禁止帯４と、レ
ーザースポット径５と、プリント板６からなる。FIG. 1 consists of a laser soldered component 1, a chip component 2, a reflowable chip component 3, a component placement prohibition zone 4, a laser spot diameter 5, and a printed board 6.
第１図においてレーザー半田付用部品１の端子をレーザ
ー照射にて半田付けする場合、レーザースポット径５の
掃引領域である部品配置禁止帯４を設け、この部品配置
禁止帯には他のりフロー可能チップ部品２及びリフロー
可能チップ部品３の実装を禁止する。これにより、レー
ザー照射は断続的でなく連続して掃引することができる
。In Fig. 1, when the terminals of the laser soldering component 1 are soldered by laser irradiation, a component placement prohibition zone 4, which is a sweep area with a laser spot diameter of 5, is provided, and other glue can flow in this component placement prohibition zone. Mounting of chip components 2 and reflowable chip components 3 is prohibited. Thereby, laser irradiation can be swept continuously instead of intermittently.
以上説明したように本発明は、レーザー照射により半田
付けを行いかつフロー又はリフローによる半田付けも併
用する場合に、レーザー照射により半田付けされる部品
の外周のうち、レーザー照射により半田付けされる端子
を含む辺に部品配置禁止帯を設けることで、レーザー照
射の際部品の破壊を防止できると共に効率的は無人半田
付けシステムを構築することができる効果がある。As explained above, when soldering is performed by laser irradiation and flow or reflow soldering is also used, the present invention provides terminals to be soldered by laser irradiation among the outer periphery of parts to be soldered by laser irradiation. By providing a prohibited zone for parts placement on the side including the part, it is possible to prevent parts from being destroyed during laser irradiation, and it is possible to efficiently construct an unmanned soldering system.
第１図は本発明の一実施例を示すプリント基板上に部品
を搭載した時の平面図、第２図は従来の部品搭載時の平
面図である。
１・・・レーザー半田付け用部品、２．３・・・リフロ
ー可能チップ部品、４・・・部品配置禁止帯、５・・・
゜レーザースポット径、６・・・プリント基板。FIG. 1 is a plan view showing an embodiment of the present invention when components are mounted on a printed circuit board, and FIG. 2 is a plan view when components are mounted in a conventional manner. 1... Parts for laser soldering, 2.3... Reflowable chip parts, 4... Parts placement prohibited zone, 5...
゜Laser spot diameter, 6...Printed circuit board.
Claims (1)
による半田付け法を併用するプリント基板への電子部品
実装方法において、レーザー照射により半田付けされる
部品の外周のうちレーザー照射により半田付けされる端
子を含む辺には、レーザー光線のスポット径の幅だけフ
ロー及びリフロー部品の実装を行なわない部品配置禁止
帯を設けることを特徴とする電子部品実装方法。In a method of mounting electronic components on a printed circuit board that uses a combination of flow or reflow soldering and laser irradiation soldering, the side of the outer periphery of the component soldered by laser irradiation that includes the terminals to be soldered by laser irradiation. An electronic component mounting method characterized by providing a component placement prohibition zone in which flow and reflow components are not mounted by a width of a spot diameter of a laser beam.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP180590A JPH03205895A (en) | 1990-01-08 | 1990-01-08 | Electronic parts mounting method |
| EP91300037A EP0437312B1 (en) | 1990-01-08 | 1991-01-03 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| DE69104734T DE69104734T2 (en) | 1990-01-08 | 1991-01-03 | Electronic component mountable on the surface of a printed circuit board and assembly method. |
| US07/637,557 US5148349A (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| AU68683/91A AU644395B2 (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| CA002033699A CA2033699C (en) | 1990-01-08 | 1991-01-07 | Electronic part with heat radiating member |
| KR1019910000091A KR910015207A (en) | 1990-01-08 | 1991-01-07 | Structures of electronic components that can be mounted on the surface of a printed circuit board and mounting methods thereof |
| HK85397A HK85397A (en) | 1990-01-08 | 1997-06-19 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP180590A JPH03205895A (en) | 1990-01-08 | 1990-01-08 | Electronic parts mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03205895A true JPH03205895A (en) | 1991-09-09 |
Family
ID=11511791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP180590A Pending JPH03205895A (en) | 1990-01-08 | 1990-01-08 | Electronic parts mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03205895A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074493A (en) * | 1984-09-03 | 1985-04-26 | 株式会社東芝 | Method of producing printed circuit board |
| JPS6193693A (en) * | 1984-10-15 | 1986-05-12 | キヤノン株式会社 | Electronic component and electronic circuit board |
| JPS62104192A (en) * | 1985-10-31 | 1987-05-14 | キヤノン株式会社 | Printed wiring board for laser soldering |
-
1990
- 1990-01-08 JP JP180590A patent/JPH03205895A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074493A (en) * | 1984-09-03 | 1985-04-26 | 株式会社東芝 | Method of producing printed circuit board |
| JPS6193693A (en) * | 1984-10-15 | 1986-05-12 | キヤノン株式会社 | Electronic component and electronic circuit board |
| JPS62104192A (en) * | 1985-10-31 | 1987-05-14 | キヤノン株式会社 | Printed wiring board for laser soldering |
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