JPH03202281A - 任意の微細凹凸パターンを表面上に有する研磨テープの製造方法 - Google Patents
任意の微細凹凸パターンを表面上に有する研磨テープの製造方法Info
- Publication number
- JPH03202281A JPH03202281A JP33835789A JP33835789A JPH03202281A JP H03202281 A JPH03202281 A JP H03202281A JP 33835789 A JP33835789 A JP 33835789A JP 33835789 A JP33835789 A JP 33835789A JP H03202281 A JPH03202281 A JP H03202281A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing layer
- manufacturing
- layer
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 79
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 20
- 239000003082 abrasive agent Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33835789A JPH03202281A (ja) | 1989-12-28 | 1989-12-28 | 任意の微細凹凸パターンを表面上に有する研磨テープの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33835789A JPH03202281A (ja) | 1989-12-28 | 1989-12-28 | 任意の微細凹凸パターンを表面上に有する研磨テープの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03202281A true JPH03202281A (ja) | 1991-09-04 |
| JPH0530594B2 JPH0530594B2 (enrdf_load_stackoverflow) | 1993-05-10 |
Family
ID=18317392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33835789A Granted JPH03202281A (ja) | 1989-12-28 | 1989-12-28 | 任意の微細凹凸パターンを表面上に有する研磨テープの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03202281A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0984846A4 (en) * | 1997-01-13 | 2000-03-15 | Rodel Inc | POLYMERIC POLISHING DISC COMPRISING A PATTERN (S) PRODUCED BY PHOTOLITHOGRAPHY ON ITS SURFACE AND RELATED METHODS |
| JP2009269147A (ja) * | 2008-05-09 | 2009-11-19 | Fujitsu Ltd | 研磨体及びその製造方法 |
| JP2011067946A (ja) * | 2000-12-01 | 2011-04-07 | Toyo Tire & Rubber Co Ltd | 研磨パッド用クッション層の製造方法 |
| JP2014509957A (ja) * | 2011-04-05 | 2014-04-24 | イファ・ダイヤモンド・インダストリー・カンパニー・リミテッド | 非伝導性物質のパターニング処理方式を用いた電着ダイヤモンドワイヤーソー及びその製造方法 |
-
1989
- 1989-12-28 JP JP33835789A patent/JPH03202281A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0984846A4 (en) * | 1997-01-13 | 2000-03-15 | Rodel Inc | POLYMERIC POLISHING DISC COMPRISING A PATTERN (S) PRODUCED BY PHOTOLITHOGRAPHY ON ITS SURFACE AND RELATED METHODS |
| JP2001507997A (ja) * | 1997-01-13 | 2001-06-19 | ローデル ホールディングス インコーポレイテッド | 光露光製版によって形成された表面パターンを有する重合体研磨パッド及びこれに関連する方法 |
| JP2011067946A (ja) * | 2000-12-01 | 2011-04-07 | Toyo Tire & Rubber Co Ltd | 研磨パッド用クッション層の製造方法 |
| JP2009269147A (ja) * | 2008-05-09 | 2009-11-19 | Fujitsu Ltd | 研磨体及びその製造方法 |
| JP2014509957A (ja) * | 2011-04-05 | 2014-04-24 | イファ・ダイヤモンド・インダストリー・カンパニー・リミテッド | 非伝導性物質のパターニング処理方式を用いた電着ダイヤモンドワイヤーソー及びその製造方法 |
| US9776306B2 (en) | 2011-04-05 | 2017-10-03 | Ehwa Diamond Industrial Co., Ltd. | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530594B2 (enrdf_load_stackoverflow) | 1993-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |