JPH0320013A - Resist coating device - Google Patents
Resist coating deviceInfo
- Publication number
- JPH0320013A JPH0320013A JP15543989A JP15543989A JPH0320013A JP H0320013 A JPH0320013 A JP H0320013A JP 15543989 A JP15543989 A JP 15543989A JP 15543989 A JP15543989 A JP 15543989A JP H0320013 A JPH0320013 A JP H0320013A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- resist
- coating
- spin head
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 18
- 238000000576 coating method Methods 0.000 title claims abstract description 18
- 230000005611 electricity Effects 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012717 electrostatic precipitator Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はレジスト塗布装置に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to a resist coating device.
従来の技術
以下に従来のレジスト塗布装置のチャンパーについて説
明する。第2図は従来の塗布装置のチャンハ一部である
。1はチャンバー、2はスピンヘッド、aはウェハ,フ
ォトマスク、4は塗布時に発生する繊維状のレジスト、
6は排気口である。2. Description of the Related Art A champer of a conventional resist coating apparatus will be described below. FIG. 2 shows a part of a conventional coating device. 1 is a chamber, 2 is a spin head, a is a wafer, a photomask, 4 is a fibrous resist generated during coating,
6 is an exhaust port.
以下その動作について説明する。テヤンバー内に設置し
たスピンヘッド上にウェハあるいはフォトマスクをセッ
トして、レジストを滴下,振シ切シを行なって塗布を行
なう。塗布時は、排気口よシ排気を行なっている。The operation will be explained below. A wafer or a photomask is set on a spin head installed in a dye bar, and resist is applied by dropping it and shaking it. When applying, exhaust air through the exhaust port.
発明が解決しようとする課題
しかしながら上記の従来の構戒では、レジスト滴下後、
振b切b時にレジストが繊維状になうチャンバー内を舞
う。これは静電気を帯びているために、チャンパー内面
以外にスピンヘッド部に付着したシ、塗布後のウェハや
フォトマスク上に付着して局所的にレジスト膜厚が厚く
な9塗布不良となっている。Problems to be Solved by the Invention However, in the above conventional structure, after dropping the resist,
During shaking b, the resist flies in the chamber where it becomes fibrous. Because this resist is charged with static electricity, it adheres to the spin head in addition to the inner surface of the chamber, and adheres to the wafer and photomask after coating, resulting in locally thick resist film and defective coating. .
本発明は上記従来の問題点を解決するもので、発生する
繊維状のレジストをチャンバーだけに付着させ、塗布時
の不良を減少させることを目的とする。The present invention solves the above-mentioned conventional problems, and aims to reduce defects during coating by causing the generated fibrous resist to adhere only to the chamber.
課題を解決するための手段
この目的を違或するために本発明のレジスト塗布装置は
、発生した繊維状のレジストとは反対に帯電したチャン
パーを有している。Means for Solving the Problems In order to achieve this object, the resist coating apparatus of the present invention has a champer that is charged oppositely to the generated fibrous resist.
作 用
この構或によって、発生した繊維状のレジストは排気に
よってチャンパー側に吸い寄せられ、電気的な作用によ
う,チャンパーだけに吸着させることができる。Function: With this structure, the generated fibrous resist is attracted to the chamber side by the exhaust gas, and can be attracted only to the chamber by the electric action.
実施例
以下本発明の実施例について図面を参照しながら説明す
る。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.
第1図は本発明の実施例に訃けるレジスト塗布装置のチ
ャンバ一部の概略図を示す。11は電極、12は電源、
1はチャンバー、2はスピンヘッド、3はウエハ,7ォ
トマスク、4は繊維状のレジスト、6は排気口である。FIG. 1 shows a schematic diagram of a portion of a chamber of a resist coating apparatus according to an embodiment of the present invention. 11 is an electrode, 12 is a power supply,
1 is a chamber, 2 is a spin head, 3 is a wafer, 7 is a photomask, 4 is a fibrous resist, and 6 is an exhaust port.
以上のように構或されたレジスト塗布装置について、以
下その動作を説明する。チャンバー内に設置したスピン
ヘッド上にウェハあるいはフォトマスクをセットしてレ
ジストを滴下させ、レジストを振9切る。その時に発生
する繊維状のレジストを排気によう、周辺に吸い寄せる
。筐たチャンパーに付設した電極に通電することによう
,チャンパーを常時帯電させておくと、レジストが静電
気を帯びているためにチャンパーだけに付着し、スピン
ヘッドや塗布したウエハやフォトマスクに再付着するこ
とはなくなる。The operation of the resist coating apparatus constructed as described above will be described below. A wafer or a photomask is set on a spin head placed in a chamber, a resist is dropped, and the resist is shaken. The fibrous resist generated at this time is sucked into the surrounding area by the exhaust gas. If the electrode attached to the chambered chamber is energized and the chamber is constantly charged, the resist will stick only to the chamber because it is charged with static electricity, and will re-attach to the spin head, coated wafer, or photomask. There will be nothing left to do.
発明の効果
以上のように本発明は、電気集塵機と類似の構造をチャ
ンパ一部に設けることによシ、スピンヘッドを常にクリ
ーンな状態に維持することができる。更に、レジスト繊
維の再付着が防止できるようになるため、塗布時の不良
を防止できるようになり、歩留シを向上させることがで
きる。Effects of the Invention As described above, the present invention can maintain the spin head in a clean state at all times by providing a part of the chamber with a structure similar to an electrostatic precipitator. Furthermore, since re-adhesion of resist fibers can be prevented, defects during coating can be prevented, and yield can be improved.
第1図は本発明の実施例におけるレジスト塗布装置のチ
ャンバ一部の概略図、第2図は従来の塗布装置のチャン
パ一部の概略図である。
11・・・・・・電極、12・・・・・・電源、1・・
・・・・チャンパ、2・・・・・・スピンヘッド、3・
・・・・・ウェハあるいはフォトマスク、4・・・・・
・塗布時に発生するレジスト、6・・・・・・排気口。FIG. 1 is a schematic diagram of a part of a chamber of a resist coating apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a part of a chamber of a conventional coating apparatus. 11... Electrode, 12... Power supply, 1...
... Champa, 2 ... Spin head, 3.
...Wafer or photomask, 4...
・Resist generated during coating, 6...exhaust port.
Claims (1)
塗布装置。A resist coating device that charges a chamber surrounding the spin head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15543989A JPH0320013A (en) | 1989-06-16 | 1989-06-16 | Resist coating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15543989A JPH0320013A (en) | 1989-06-16 | 1989-06-16 | Resist coating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0320013A true JPH0320013A (en) | 1991-01-29 |
Family
ID=15606059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15543989A Pending JPH0320013A (en) | 1989-06-16 | 1989-06-16 | Resist coating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0320013A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6352589B1 (en) | 1998-12-07 | 2002-03-05 | Nec Corporation | Apparatus for spin-coating semiconductor substrate and method of doing the same |
-
1989
- 1989-06-16 JP JP15543989A patent/JPH0320013A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6352589B1 (en) | 1998-12-07 | 2002-03-05 | Nec Corporation | Apparatus for spin-coating semiconductor substrate and method of doing the same |
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