JPH03195036A - Positioning and apparatus therefor - Google Patents

Abstract

PURPOSE:To position a flat-package IC suitably for an inspection operation and for a connection operation to an interconnection on a printed-circuit board by a method wherein the IC is positioned in a position at the tip of a lead protruding from an IC flat package. CONSTITUTION:When a QFPIC 3 is positioned, positioning claws 2a to 2d are set to a released state; the QFPIC 3 is placed on an IC cradle 1; after that, a force which has been applied to the positioning claws 2a to 2d is removed. Then, the positioning claws 2a to 2d are moved to the direction to the center (c) of the IC cradle 1 by a force of springs 4a to 4d; tip faces of leads 5, 5,... protruding from four sides of the QFPIC 3 are pushed to the centripetal direction; the QFPIC 3 is centered. When the QFPIC 3 is positioned in this manner, the IC can be positioned by using the tips of the leads 5. Thereby, when a lead bend is inspected simply, there is no danger that it cannot be inspected or an inspection accuracy is lowered; the leads 5 of the QFPIC 3 can be positioned in advance suitably when they are connected to an interconnection film on a printed wiring board.

Description

[Detailed description of the invention] The present invention will be described in the following order.

A. Industrial field of application B8 Outline of the invention Prior art Problems to be solved by the invention Examples of means and actions for solving the problems [Figs. 1 to 3] Effects of the invention (A. Industrial applications) Field of Application) The present invention relates to a method for positioning a flat package IC and a positioning device used therefor.

(B. Summary of the Invention) The present invention positions the IC based on the position of the tip of the lead in order to position the flat package IC at an appropriate position for inspection and connection to wiring on a printed circuit board, etc. It is something.

(C, Prior Art) With the increase in demand for ICs (for example, QFPICs), efforts are being made to increase the supply of ICs, but with this, it is necessary to conduct a large number of inspections of ICs that have been manufactured. . It goes without saying that testing electrical characteristics is highly important, but visual inspection to check for deformation of IC leads and defective marks on packages is becoming increasingly important. In particular, I
The importance of testing for the presence or absence of C lead deformation is increasing.

This is because as ICs become more highly integrated, the number of leads increases and the pitch of the leads tends to become smaller, and slight deviations or ups and downs of the leads can cause problems between the IC and the wiring film of the printed wiring board connected to it. This is because it interferes with the consistency of Therefore, it is necessary to inspect very accurately and in large quantities, and it is virtually impossible to meet this need by visual inspection.

Therefore, using an image processing method or
A lead bending inspection device using an optical displacement sensor has been developed, which was introduced in Japanese Patent Application Laid-open No. 126, Japanese Patent Application Laid-Open No. 63-278345, and the like.

By the way, whether the IC is inspected by an image processing method or by a method using an optical displacement sensor,
Conventionally, the positioning of the
It was done in a package as introduced in Publication No. 47. That is, the IC was positioned by positioning the IC package at a predetermined position.

(D. Problem that the invention seeks to solve) However,
According to the positioning method of positioning an IC using a package, there is a possibility that the lead to be measured cannot be positioned at an appropriate position for lead inspection. This is because, in flat package ICs, slight misalignment often occurs between the lead portion and the package during the manufacturing process. As long as such positional deviation is within an allowable range, it will not cause the product to be defective, but it may impede the inspection of the leads. In particular, in VQFPICs where each lead is small (the lead pitch is also small), unless the lead portions are positioned with high precision, inspection becomes impossible or the inspection accuracy is significantly reduced, which is a problem that cannot be overlooked.

Further, a similar problem occurs when an IC is connected to a wiring film of a printed wiring board by soldering or the like. That is, each lead cannot be accurately positioned on its corresponding wiring film, and there is a possibility that connection may not be possible.

The present invention has been made to solve these problems, and its purpose is to enable appropriate positioning for inspection and connection to wiring of a printed circuit board or the like.

(E. Means for Solving the Problems) In order to solve the above problems, the present invention is characterized in that the IC is positioned based on the position of the tip of the lead.

(F. Effect) According to the present invention, since the IC is positioned at the tip of the lead, the IC can be positioned so that the lead does not interfere with inspection or connection to the wiring film. can.

(G, Example) [Figures 1 to 3] Hereinafter, the present invention will be explained in detail according to illustrated embodiments.

1 and 2 show one embodiment of the positioning device of the present invention. FIG. 1 is a plan view, and FIG.
FIG. 2 is a cross-sectional view along line 2;

1 is the IC holder, 2a to 2d are positioning claws that move on the pedestal 1, and the IC holder is located outside the part of the pedestal 1 where the QFPIC 3 is placed in the X direction or in correspondence with each side of the QFPIC 3. It is provided movably in the Y direction. The positioning claws 2b and 2d are provided movably in the X direction, and the positioning claws 2a and 2C are provided movably in the Y direction.

The positioning pawl 2b and the positioning pawl 2d are connected to each other by a link (not shown) at the bottom, so that they move relative to each other. This interlocking is possible when the positioning claw 2b is
When the C receiver approaches the center C of the stand 1, the positioning claw 2d also approaches the center C, and when the positioning claw 2b moves away from the center C of the IC receiver, the positioning claw 2d also moves away.

Further, the positioning pawl 2a and the positioning pawl 2C are similarly connected by a link so that they interlock with each other.

This interlocking is also such that when one IC receiver approaches the center C of the stand 1, the other approaches, and when one moves away from the center, the other moves away from the center C.

4a is a spring that biases the positioning claw 2a toward the center C of the IC holder 1, and 4b is a spring that biases the positioning claw 2b toward the center C of the IC holder 1.

The principle of the mechanism for driving the positioning claw of the positioning device is the same as that of the handling chuck disclosed in Japanese Patent Application No. 63-270522.

When positioning the QFPIC 3 using this positioning device, the positioning claws 4a to 4b resist the force of the springs 4a and 4b.
4d, the IC receiver is placed in an open state by applying a force in a direction to move them away from the center of the stand 1, and the IC receiver in that state is placed on the stand 1, and then the positioning claws 4a to 4
Remove the force applied to d. Then, the positioning claw 4a
~4d, the IC holder is moved in the direction toward the center C of the base 1 by the force of the springs 4a~4b, and the end surfaces of the hinges 5.5, . . . protruding from the four sides of the QFPIC 3 are moved. By pushing in the centripetal direction, the QFPIC 3 is centered.

This centering is done so that the center of the rectangle drawn by four straight lines passing through the end surfaces of the leads 5, 5, etc. is located at the center C of the IC holder 1, and the center of the package. However, the IC receiver is not positioned at the center C of the stand 1. Therefore, even if there is a misalignment between the QFP IC3 package and the leads 5.5,..., the QFPIC3 is
can be positioned. Therefore, if this positioning device is used to position the IC for lead bending inspection, it will be possible to position the QFPIC 3 so that the leads 5, 5, etc. are at a suitable location for inspection, making it impossible to inspect. There is no risk that the test accuracy will deteriorate significantly.

In addition, according to the inspection method using a displacement sensor, the positioning claw 2
When inspecting while positioning by 8-2d,
The inspection light emitted from the light source built into the displacement sensor is irradiated not only to the leads (but also to the positioning claws 28 to 2d, so the light reflected by the positioning claws 2a to 2d is also reflected by the optical position detection element in the displacement sensor ( PSD), and as a result, there is a risk of interfering with the inspection or reducing the inspection accuracy.Therefore, in such a case, after positioning, the positioning claws 2a to 2d are moved by the springs 4a, It is necessary to resist the force of 4b and separate it from the QFPIC 3 to open it, and to perform the inspection in this state.

By the way, if this is done, there is a possibility that the QFPIC 3 may be displaced due to vibration of the device when it is in the open state. Therefore, in order to prevent such positional deviation,
A vacuum suction hole 6 may be provided as shown by the two-dot chain line in FIGS. 1 and 2 so that the QFPIC 3 can be vacuum suctioned.

According to the present positioning device, the QFP is positioned by pushing and centering the end surfaces of the leads 5.5, . . . from all sides by the positioning claws 2a to 2d.
Positioning can be performed without any problem even if the size of IC3 changes slightly. However, this is not necessarily possible when the size of the QFP I C3 changes significantly.Therefore, in order to widen the range of sizes that can be accommodated, even if the positioning claw 2 is made replaceable as shown in Figure 3. good. In the figure, 7 is a member driven by a link, and the member 7
A replaceable positioning pawl 2 is fixed with a screw or the like. In addition, four positioning claws 2.2.2.
Only one item 2 out of 2 is shown.

As described above, according to the positioning method of positioning QFPIC using the positioning device as described above, Q
I at the tip of the lead, not at the FPIC package.
C can be positioned. By positioning the QFPIC at the tip of the lead, it is possible to eliminate the risk of not being able to inspect the lead bending or the risk of deteriorating the inspection accuracy. The positioning performed in advance for connection to the wiring film can also be performed appropriately.This is because the QF
What is important when connecting a PIC to a wiring film is not the positioning of the package, but the positioning of the leads.Therefore, the positioning method of positioning at the tip of the lead is also suitable for positioning for connecting to the wiring film of a QFPIC. It can be said that it is effective.

1 and 2 are for explaining one embodiment of the positioning device of the present invention, FIG. 1 is a plan view, and FIG.
FIG. 3 is a sectional view taken along line 2-2 in the figure, and a plan view showing a main part of a modified example of the positioning device of the present invention.

Explanation of symbols 2a to 2d...positioning claws, 3...IC.

5...IC lead.

(H. Effect of the invention) As described above, according to the present invention, since the IC is positioned at the tip of the lead, the lead is placed in a position that does not interfere with inspection or connection to the wiring film. The IC can be positioned as follows.

[Brief explanation of drawings]

;　ε ゛　(su ’%l”M ℃ C4. CJro　Ll”1

Claims (2)

[Claims] (1) A positioning method characterized by positioning the IC based on the position of the tip of the lead protruding from the IC flat package. (2) A positioning device comprising a plurality of positioning claws and positioning the IC by moving the plurality of positioning claws and pushing the tip end surface of the lead.