JPH03194995A - Method and apparatus for reflowing on both side surfaces - Google Patents
Method and apparatus for reflowing on both side surfacesInfo
- Publication number
- JPH03194995A JPH03194995A JP33395789A JP33395789A JPH03194995A JP H03194995 A JPH03194995 A JP H03194995A JP 33395789 A JP33395789 A JP 33395789A JP 33395789 A JP33395789 A JP 33395789A JP H03194995 A JPH03194995 A JP H03194995A
- Authority
- JP
- Japan
- Prior art keywords
- reflow
- circuit board
- primary
- board
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 230000002411 adverse Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
[a業上の利用分野]
本発明は、電子回路基板の実装において、その基板の両
面にリフロー半田付けをする方法と装置に関するもので
、とりわけ、該基板の保持方式に関するものである。Detailed Description of the Invention [Field of Application in Industry A] The present invention relates to a method and apparatus for reflow soldering on both sides of an electronic circuit board in mounting the board, and particularly relates to a method and apparatus for holding the board. It is related to.
[従来の技術]
従来、両面リフローは、たとえば、第5図に示すように
、搬送部1により、電気部品3を実装した回路基板2の
端部を保持し、リフローしていた。そして、1次リフロ
ーおよび2次リフローとも、同じ方法によって行なわれ
るのが通常であった。それは、2次リフロー時に、すで
に実装されている電気部品3を有する1次面に悪影響を
与えるのを避けるためであった。[Prior Art] Conventionally, in double-sided reflow, for example, as shown in FIG. 5, an end portion of a circuit board 2 on which electrical components 3 are mounted is held by a transport section 1, and reflow is performed. Both the primary reflow and the secondary reflow were normally performed by the same method. This was to avoid adversely affecting the primary surface having the electrical components 3 already mounted thereon during the secondary reflow.
[発明が解決しようとする課題]
通常リフローは、その温度を200〜260t、10〜
30秒の保持によって行なわれる。このような温度下で
は、電子回路の回路基板2は軟化し、搭載された電気部
品3の重量と相まつて、第6図に示すように凹状に変形
することが知られている。いま、 120mmx 12
0mm x 0.4mmtのガラエボ基板のりフローを
例にとると、この基板は第5図のように、1次リフロー
することにより、2.5mm 〜3.Omm下に凹状に
変形することが観測されている。また第7図に示すよう
に、電子回路基板部4の中央および基板端部5の付近に
設けられた基板分割用の溝のミシン目6は、さらに、第
6図の凹状を大きなものにしている。すなわち、従来の
技術においては、2次面の半田ペーストの印刷が困難に
なり、マウンターによるマウントが困難になり、さらに
は、印刷及びマウント時に回路基板2が変形し、1次面
に半田付けされた電気部品3などが破損する等の問題点
があった。[Problem to be solved by the invention] Normally, reflow is performed at a temperature of 200 to 260 t, 10 to
This is done by holding for 30 seconds. It is known that under such temperatures, the circuit board 2 of the electronic circuit softens and, together with the weight of the mounted electrical components 3, deforms into a concave shape as shown in FIG. Now, 120mm x 12
Taking the glue flow of a 0mm x 0.4mmt Gala Evo board as an example, this board is 2.5mm to 3mm thick by primary reflow as shown in Figure 5. It has been observed that it deforms into a concave shape below 0 mm. Further, as shown in FIG. 7, the perforations 6 of the board dividing grooves provided at the center of the electronic circuit board section 4 and near the board ends 5 are made larger than the concave shape shown in FIG. There is. That is, in the conventional technology, it becomes difficult to print solder paste on the secondary surface, making it difficult to mount with a mounter, and furthermore, the circuit board 2 is deformed during printing and mounting, and the circuit board 2 is not soldered to the primary surface. There were problems such as damage to electrical parts 3 and the like.
本発明は、上記のような問題点を解決しようとするもの
である。すなわち、本発明は、回路基板が凹状に変形す
ることを防止でき、これにより、2次面の部品実装も、
1次面と同様に、円滑に行なうことができる両面リフロ
ー方法とその装置を提供することを目的とするものであ
る。The present invention aims to solve the above problems. In other words, the present invention can prevent the circuit board from deforming into a concave shape, and as a result, component mounting on the secondary surface can be prevented.
It is an object of the present invention to provide a double-sided reflow method and an apparatus therefor that can be smoothly performed in the same way as for the primary surface.
[課題を解決するための手段]
上記目的を達成するために、本発明の両面リフロー方法
は、両面リフローにて半田付けされる回路基板において
、1次リフローでは、該回路基板を裏面から平面状にな
るように保持して行ない、2次リフローでは、該回路基
板を端部で保持して行なうようにした。また本発明の両
面リフロー装置は、両面リフローにて半田付けされる回
路基板を搬送する1次面用搬送部と2次面用搬送部とを
備え、かつ、前記1次面用搬送部には、該回路基板を裏
面から平面状に保持する手段を有し、前記2次面用搬送
部には、該回路基板を端部で保持する手段を有するもの
とした。[Means for Solving the Problems] In order to achieve the above object, the double-sided reflow method of the present invention provides a circuit board that is soldered by double-sided reflow, and in the first reflow, the circuit board is soldered from the back side into a planar shape. The second reflow was carried out by holding the circuit board at its edges. Further, the double-sided reflow apparatus of the present invention includes a primary surface transport section and a secondary surface transport section that transport circuit boards to be soldered by double-sided reflow, and the primary surface transport section includes , a means for holding the circuit board in a planar shape from the back side, and a means for holding the circuit board at an end in the secondary surface transfer section.
[作 用]
本発明によれば、1次面のりフロー時に、回路基板を裏
面から平面状に保持することにより、回路基板が凹状に
変形することを防止できるようになる。このため、2次
面の部品実装も、1次面と同様に、円滑に行なうことが
できるようになる。2次面のりフローにおいては、1次
面に搭載された部品にふれないように、従来のとおり、
回路基板端部の保持によりリフローがなされる。[Function] According to the present invention, by holding the circuit board flat from the back side during the primary surface adhesive flow, it is possible to prevent the circuit board from deforming into a concave shape. Therefore, components can be mounted on the secondary surface as smoothly as on the primary surface. In the secondary surface gluing flow, as usual, be careful not to touch the parts mounted on the primary surface.
Reflow is performed by holding the edge of the circuit board.
[実 施 例]
第1図は本発明の第1実施例を示しており、つまり、両
面リフロー装置の搬送部を示している。[Embodiment] FIG. 1 shows a first embodiment of the present invention, that is, it shows a conveying section of a double-sided reflow apparatus.
第1図において、9は1次面用搬送部で、平面部11か
らなっている。10は2次面用搬送部で、両端部にのみ
突起12を有している。In FIG. 1, numeral 9 denotes a primary surface conveying section, which is composed of a flat surface section 11. As shown in FIG. Reference numeral 10 denotes a secondary surface conveying section, which has protrusions 12 only at both ends.
したがって、1次リフローでは、図示されていない回路
基板が、平面部11を有する1次面用搬送部9により、
裏面から平板状になるように保持されるので、該回路基
板が凹状に変形されることが防止される。また2次リフ
ローでは、該回路基板の両端部のみが、2次面用搬送部
IOの両端部の突起12により保持されるので、1次面
に悪影響を与えることがなく、2次リフローが円滑に行
なわれる。Therefore, in the primary reflow, the circuit board (not shown) is transported by the primary surface transport section 9 having the flat surface section 11.
Since the circuit board is held flat from the back side, the circuit board is prevented from being deformed into a concave shape. In addition, in the secondary reflow, only both ends of the circuit board are held by the protrusions 12 at both ends of the secondary surface transfer unit IO, so the secondary reflow is smooth without adversely affecting the primary surface. It will be held in
第2図は第1図に示した装置の運転シーケンスを示して
いる。FIG. 2 shows the operating sequence of the apparatus shown in FIG.
通常、リフロー装置は、第8図に示すように、回路基板
搬送部7と空送部8(間隔)を有し、リフローされる回
路基板の間隔は、その回路基板のサイズより充分に大き
い。しかるに、第1図に示すように、1次面用搬送部9
と2次面用搬送部10を合せもつことは、実施上に何の
問題もない。Usually, a reflow apparatus has a circuit board transport section 7 and an air transport section 8 (interval), as shown in FIG. 8, and the interval between the circuit boards to be reflowed is sufficiently larger than the size of the circuit boards. However, as shown in FIG.
There is no problem in implementing the combination of the secondary surface transport section 10 and the transport section 10 for the secondary surface.
第3図は本発明の第2実施例の両面リフロー装置の搬送
部を示している。FIG. 3 shows a transport section of a double-sided reflow apparatus according to a second embodiment of the present invention.
この第2実施例では、1次面用搬送部9には多数の横棒
13を有し、2次面用搬送部10は、第1図の場合と同
様である。In this second embodiment, the primary surface conveying section 9 has a large number of horizontal bars 13, and the secondary surface conveying section 10 is the same as that shown in FIG.
第4図は本発明の第3実施例の両面リフロー装置の搬送
部を示している。FIG. 4 shows a conveying section of a double-sided reflow apparatus according to a third embodiment of the present invention.
この第3実施例では、1次面用搬送部9には多数のワイ
ヤー14を有し、2次面用搬送部10は、第1図の場合
と同様である。In this third embodiment, the primary surface conveying section 9 has a large number of wires 14, and the secondary surface conveying section 10 is the same as that shown in FIG.
なお第3図では、1次面用搬送部9に横棒13を設け、
第4図では、1次面用搬送部9にワイヤー14を設けて
おり、これらは、いずれも、平面の板ではないが、回路
基板を裏面から平面状に保持する役目をする。In addition, in FIG. 3, a horizontal bar 13 is provided in the primary surface conveying section 9,
In FIG. 4, wires 14 are provided in the primary surface transfer section 9, and although these are not flat plates, they serve to hold the circuit board in a flat shape from the back side.
[発明の効果コ
以上説明したように、本発明によれば、1次面のりフロ
ー時に、回路基板を裏面から平面状に保持することによ
り、回路基板が凹状に変形することを防止できるように
なる。このため、2次面の、さらなる高密度化および高
歩留まりを期待できることはもちろん、1次面の実装品
質の向上も図れる。また2次面の半田付はランドの半田
ずれや劣化もなくなる。[Effects of the Invention] As explained above, according to the present invention, by holding the circuit board flat from the back side during the primary surface adhesive flow, it is possible to prevent the circuit board from deforming into a concave shape. Become. Therefore, not only can higher density and higher yield be expected on the secondary surface, but also the mounting quality on the primary surface can be improved. Furthermore, soldering on the secondary surface eliminates solder displacement and deterioration of the land.
第1図は本発明の装置の第1実施例を示した斜視図、第
2図は第1図の装置の運転シーケンスの説明図、第3図
は本発明の装置の第2実施例を示した斜視図、第4図は
同じく第3実施例を示した斜視図、第5図は従来の技術
の一例を示した斜視図、第6図は第5図の方法による回
路基板の変形状態を示した斜視図、第7図は従来の回路
基板の一例を示した平面図、第8図はりリフロー装置の
全体図である。
1・・・搬送部 2・・・回路基板3・・・
電気部品 4・・・電子回路用基板部5・・・
基板端部 6・・・ミシン目7・・・基板搬送
部 8・・・空送部9・・・1次面用搬送部
10・・・2次面用搬送部11・・・平面部
12・・・突起13・・・横棒 14・・・
ワイヤー第1図
第2図
第5図
第6図
第7図
第3図Fig. 1 is a perspective view showing a first embodiment of the device of the present invention, Fig. 2 is an explanatory diagram of the operating sequence of the device of Fig. 1, and Fig. 3 shows a second embodiment of the device of the present invention. FIG. 4 is a perspective view showing the third embodiment, FIG. 5 is a perspective view showing an example of the conventional technique, and FIG. 6 shows the state of deformation of the circuit board by the method shown in FIG. 7 is a plan view showing an example of a conventional circuit board, and FIG. 8 is an overall view of the reflow apparatus. 1...Transportation section 2...Circuit board 3...
Electrical parts 4...Electronic circuit board part 5...
Board end 6... Perforation 7... Board transfer section 8... Air transfer section 9... Primary surface transfer section
10...Conveyance part for secondary surface 11...Plane part
12...Protrusion 13...Horizontal bar 14...
Wire Figure 1 Figure 2 Figure 5 Figure 6 Figure 7 Figure 3
Claims (1)
、1次リフローでは、該回路基板を裏面から平面状にな
るように保持して行ない、2次リフローでは、該回路基
板を端部で保持して行なうことを特徴とする両面リフロ
ー方法。 2 両面リフローにて半田付けされる回路基板を搬送す
る1次面用搬送部と2次面用搬送部とを備え、かつ、前
記1次面用搬送部には、該回路基板を裏面から平面状に
保持する手段を有し、前記2次面用搬送部には、該回路
基板を端部で保持する手段を有することを特徴とする両
面リフロー装置。[Claims] 1. In a circuit board to be soldered by double-sided reflow, the circuit board is held flat from the back side in the first reflow, and the circuit board is held flat in the second reflow. A double-sided reflow method characterized by holding at the edges. 2. A primary surface transporting section and a secondary surface transporting section are provided for transporting a circuit board to be soldered by double-sided reflow, and the primary surface transporting section is provided with a circuit board that is soldered from the back surface to a flat surface. A double-sided reflow apparatus, characterized in that the secondary surface transfer section has means for holding the circuit board at an end thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33395789A JPH03194995A (en) | 1989-12-22 | 1989-12-22 | Method and apparatus for reflowing on both side surfaces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33395789A JPH03194995A (en) | 1989-12-22 | 1989-12-22 | Method and apparatus for reflowing on both side surfaces |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03194995A true JPH03194995A (en) | 1991-08-26 |
Family
ID=18271878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33395789A Pending JPH03194995A (en) | 1989-12-22 | 1989-12-22 | Method and apparatus for reflowing on both side surfaces |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03194995A (en) |
-
1989
- 1989-12-22 JP JP33395789A patent/JPH03194995A/en active Pending
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