JPH03193873A - Continuous formation of thin film in vacuum and device - Google Patents

Abstract

PURPOSE:To carry in and take out a base plate through the same inlet of a vacuum treatment chamber by hanging up a base plate holder with the hanging members of the front and rear steps which are successively provided to the moving direction of the base plate holder and passing the other base plate holder through the lower part thereof to replace the front and rear positions. CONSTITUTION:A base plate holder 51 is positioned in a film formation zone 13 to form a film in a state wherein a holder 53 having a base plate is positioned in a replacement zone 17. After film formation is completed, the holder 51 is passed through the lower part 17a and sent to the position 17b of the zone 17 from the zone 11 in a state wherein the zone 17 is shut for the atmosphere and the holder 53 is hung by a hanging member 19 of a rear step in the zone 17. Then the holder 51 is hung by a hanging member 21 of a front step in the zone 17 and also the holder 55 is lowered and sept to the zone 13. The interval between the zones 13, 17 is vacuously shut. Thereafter the zone 17 is released to the atmosphere or the other vacuum chamber. A holder 55 having a fresh base plate is passed through the lower part of the holder 51 and introduced into the zone 17 from the inlet side of the vacuum treatment chamber and sent to the position 17a. The holder 51 is lowered and the fresh base plate is sent toward the inlet side of the vacuum treatment chamber and taken out to the outside of the chamber.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for continuously forming a thin film on a substrate in a vacuum atmosphere.

There are two methods for forming thin films, such as a vacuum deposition method: a batch method and a continuous method. In the batch method, after a substrate holder with a substrate set thereon is housed in a vacuum processing chamber, a thin film is formed on the substrate by performing the steps of evacuation, heating, vapor deposition, slow cooling, and leakage.

However, in the batch method, only one substrate holder can be handled in the vacuum processing chamber, and processes before and after vapor deposition such as evacuation, heating, and slow cooling take a lot of time, and the production capacity per device is low. There was a problem.

Therefore, many continuous vapor deposition apparatuses have been developed in order to increase production capacity. In a continuous type vapor deposition apparatus, a pre-evacuation chamber, a vapor deposition chamber, an extraction chamber (leak chamber), or a pre-heating chamber, etc. are installed in series as necessary, and each vacuum chamber is connected via a gate valve, and the substrate holder is are sequentially transported between the vacuum chambers, and pre-processing or post-processing of other substrate holders is performed during vapor deposition of the - substrate holder.

However, in conventional continuous vapor deposition equipment, each chamber was arranged in a line.

The input side of the new substrate holder and the outlet of the substrate holder after vapor deposition are located apart from each other at both ends of the line. As a result, they were sometimes constrained by the layout of the factory and found it difficult to adapt to automation. Additionally, in order to prevent pinholes from forming in the thin film due to dirt and dust, a clean room is installed, and in this case, a clean room is also installed around the input and output ports located at both ends of the line. This resulted in an increase in equipment costs.

The present invention, which is intended to be clearly understood, involves the loading and unloading of substrates from the same entrance of the vacuum processing chamber.
The present invention provides a method and apparatus for forming a continuous vacuum thin film that can be taken out.

The continuous vacuum thin film forming method of the present invention includes an exchange zone in which a front-stage and a rear-stage suspension member capable of suspending a substrate holder upward is connected from the entrance side of a vacuum processing chamber; A continuous vacuum thin film forming method in which a vacuum processing chamber is constructed by sequentially connecting a film forming zone equipped with a thin film forming means, and heat treatment is performed to perform each of the following steps.

Step A: A step in which a second substrate holder with a new substrate on which a thin film is to be formed is positioned in the exchange zone, and a first substrate holder is positioned in the deposition zone to form a film on this substrate.

Step B: After the film formation is completed, with the exchange zone shielded from the atmosphere, and with the second substrate holder suspended by the suspension member at the rear stage of the exchange zone, move the second substrate holder to the second substrate holder. A step of transferring the first substrate holder from the film forming zone to a position below the suspension member at the front stage of the exchange zone.

Step C: The first substrate holder is suspended by a suspension member in front of the exchange zone, and the second substrate holder is lowered and transferred to the deposition zone, and the gap between the deposition zone and the exchange zone is Vacuum shielding process.

Step D: With the first substrate holder suspended in the exchange zone, the exchange zone is opened to the atmosphere or another vacuum chamber, and the new substrate to be deposited is passed under the first substrate holder. A step of carrying the third substrate holder having the substrate into the exchange zone from the vacuum processing chamber entrance side and transferring it to a position below the suspension member in the latter stage.

Step E: Step of lowering the first substrate holder, moving it toward the entrance of the vacuum processing chamber, and transporting it out of the vacuum processing chamber.

Step F: A step in which the substrate holder located in the film formation zone is read as the first substrate holder, and the substrate holder located in the exchange zone is read as the second substrate holder, and the steps A to E are repeated.

Further, the continuous vacuum thin film forming apparatus of the present invention includes a shunting vacuum chamber in which front-stage and rear-stage suspension members capable of suspending the substrate holder so as to be able to ascend and descend freely are arranged in series in the transfer direction of the substrate holder; a film-forming vacuum chamber equipped with a film means; a first opening/closing member capable of vacuum-shielding and opening the shunting vacuum chamber and the film-forming vacuum chamber; shielding - a second opening/closing member that can be opened; and the outside of the shunting vacuum chamber - the lower position of the front suspension member of the shunting vacuum chamber;
By reciprocating between the lower positions of the rear suspension member of the shunting vacuum chamber,
The substrate holder is moved back and forth between the entrance-side transfer member that carries and transports the substrate holder, and the lower position of the rear-stage suspension member in the film-forming vacuum chamber, the shunting vacuum chamber, and the lower position of the front-stage suspension member in the shunting vacuum chamber. It is heat-treated to have a rear side transfer member for loading and conveying.

1A to IK are explanatory views (perspective views) showing an embodiment of the present invention, and FIG. 2 is a sectional view corresponding to FIG. 1A.

The continuous vacuum thin film forming apparatus includes a preliminary evacuation chamber 23, a shunting vacuum chamber 15, and a film forming vacuum chamber 11 arranged in a linear manner. Between the preliminary exhaust chamber 23 and the shunting vacuum chamber 15,
The shunting vacuum chamber 15 and the film-forming vacuum chamber 11 are connected to each other by gate valves 33 and 31 so as to be able to be vacuum-shielded. The preliminary exhaust chamber 23 has a gate valve 35
This gate valve 35 serves as an entrance for carrying the substrate holder into and out of the vacuum processing chamber.

As shown in FIG. 2, the interior of the film-forming vacuum chamber 11 forms a film-forming zone 13, and a heater 63 such as a halogen lamp and an evaporation source 65 for heating the substrate are provided below. The carrier 43 is driven and driven by the conveying member 41.
The carrier body 43a to be transferred and the carrier body 43a
A rotary pedestal 43b is rotatably mounted on the top via a bearing or the like. The substrate holder 51 is mounted on the rotating pedestal 43b of the carrier 43,
It is rotationally driven by gear engagement with the holder rotating member 61.

The interior of the shunting vacuum chamber 15 forms a shunting zone 17, and the shunting zone 17 is divided into two parts: the lower position 1 of the front suspension member;
7b and a rear suspension member lower position 17a.

A front suspension member 21 is provided at the lower position 17b of the front suspension member. The front suspension member 21 is connected to the drive cylinder 7
3 to move up and down, engage and lift the board holder,
Alternatively, it can be lowered to release the engagement.

On the other hand, a rear suspension member 19 is provided at a lower position 17a of the rear suspension member. The rear suspension member 19 can be moved up and down by a drive cylinder 71 to engage and lift the substrate holder, or can be lowered to release the engagement, and furthermore, in the engaged state, the substrate holder is rotated by a motor 75. can be done. Further, a heater 77 such as a halogen lamp is provided to heat the substrate set in the substrate holder.

The interior of the pre-vacuum chamber 23 forms a pre-evacuation zone 25 .

A transport member 41 is provided in each of the apparatus exterior 27, preliminary exhaust chamber 23, shunting vacuum chamber 15, and film forming vacuum chamber 11, and an inlet side carrier (transfer member) 45 and a back side carrier 43 are placed thereon. has been done. The carriers 43 and 45 are moved along the rails 41b by the drive rollers 41a of the conveying member.

The carrier 43.45 has an opening in the center (see opening 45a in FIG. 1G), and the substrate holders 51, 53.55 are mounted so that the substrate on which a thin film is to be formed is positioned in this opening. Both carriers 43 and 45 have exactly the same shape, except for their moving positions. Incidentally, since the opening in the carrier and the above-mentioned rotating frame are mainly necessary when forming a thin film, they can be omitted from the inlet side carrier 45.

In FIG. 1A, gate valves 31, 33.35 are both closed. Film forming vacuum chamber 11 evacuated to high vacuum
In the inner film forming zone 13, the first substrate holder 5I is mounted on the rear carrier 43, and the first substrate holder 51 is placed in the holder under predetermined vacuum atmosphere and heating conditions by the heater 63. Vapor deposition is performed by the vapor deposition source 65 while being rotated by the rotating member 61 .

In addition, at this time, the lower position 1 of the rear suspension member of the shunting zone 17 is
7a, the second substrate holder 53 on which a new substrate is set is suspended and rotated by the rear suspension member 19, and preheated by the heater 77.

Furthermore, at this time, the pre-evacuation chamber 23 houses a third substrate holder 55 in which a new substrate is set, and during the vapor deposition operation in the film-forming zone 13, the pre-evacuation chamber 23 is evacuated or the substrate is removed. Preheating is being performed.

When the formation of the thin film on the substrate set in the first substrate holder 51 is completed, as shown in FIG. 1B, the gate valve 3
1, and the rear carrier 43 carrying the first substrate holder 51 is transferred to the lower position 17b of the front suspension member of the exchange zone 17 by the transport member 41 (operation arrow ■ in the figure).
. At this time, the first substrate holder 51 is attached to the second substrate holder 5 which is suspended at the lower position 17a of the rear suspension member.
It will move under 3.

Next, as shown in FIG. 1C, the transferred first substrate holder 51 is moved to the rear carrier 43 by the front suspension member 21.
Lift it up from above (arrow ■) and move the rear carrier 43 to the lower position 17a of the rear suspension member using the conveyance member 41 (
(arrow ■), the rear suspension member 19 is lowered to mount the second substrate holder 53 on the rear carrier 43 (arrow ■).

Next, as shown in FIG. 1D, the back carrier 43 is transferred to the film forming zone 13, and the gate valve 31 is closed (arrow
).

Next, as shown in FIG. 1E, open the gate valve 33,
The inlet side carrier 45 carrying the third substrate holder 55 with a new substrate set thereon is moved from the preliminary exhaust chamber 23 to the lower position 17a of the rear suspension member of the shunting vacuum chamber 15 (arrow ■). At this time, the third substrate holder 55 passes under the first substrate holder 51 suspended by the front suspension member 21.

Next, as shown in FIG. 1F, the third substrate holder 55 is lifted from above the entrance side carrier 45 by the rear suspension member 19 (arrow ■), and the entrance side carrier 45 is moved to the lower position 17b of the front suspension member. (arrow ■), the first substrate holder 51 that had been lifted above this is lowered and mounted on the entrance side carrier 45 (Fig. 1G, arrow ■).

Next, as shown in FIG. 1H, the inlet side carrier 45 carrying the first substrate holder 51 is moved to the preliminary exhaust chamber 23, and the gate valve 33 is closed (arrow [phase]).

Next, as shown in the first construction drawing, after opening the preliminary exhaust chamber 23 to the atmosphere, the gate valve 35 on the inlet side is opened, and the inlet side carrier 45 is moved to the outside of the device 27 (arrow 0).
The first substrate holder 51 is taken out to the outside of the apparatus 27. The outside of the apparatus 27 is a clean room, and the first substrate holder 51 is sent to the next process (Fig. 1J, arrow ■).

Next, the fourth substrate holder 57 with a new substrate whose surface has been cleaned is placed on the inlet side carrier, and the preliminary exhaust chamber 2 is placed.
1K, arrow 0), the gate valve 35 of the preliminary evacuation chamber 23 is closed to evacuate the first evacuation chamber 23.
Return to the state shown in Figure A. Thereafter, by repeating this operation, the substrate holder can be taken in and out continuously through one device entrance/exit.

3A to drawings and FIG. 4 are explanatory views showing other embodiments of the present invention, in which the preliminary exhaust chamber 23 is not used, that is,
A switching vacuum chamber 15 is used when carrying substrates into and out of the apparatus.
The structure is similar to that shown in Figs. 1 and 2, except that it is directly exposed to the atmosphere.

Since the operating procedures are almost the same, a brief explanation will be given according to the drawings.

■ Figure 3A Gate valves 31, 33: Closed. First substrate holder 51
: Mounted on the rear carrier 43 and subjected to vapor deposition processing in the film forming zone 13. Second substrate holder 53: Lifted and rotated by the rear suspension member 19, and being preheated at the lower position 17a of the rear suspension member in the exchange zone 17. Third substrate holder 55: A new cleaned substrate is set, mounted on the inlet side carrier 45, and placed outside the apparatus 27.

■ Figure 3B Gate valve 31: Open. First substrate holder 51: After the film formation of the substrate is completed, it is mounted on the back side carrier 43, passes under the second substrate holder 53, and moves to the lower position 1 of the front suspension member.
Move to 7b (■).

■ FIG. 3C First substrate holder 51: Lifted up by the front suspension member 21 (■). Back side carrier 43: rear suspension member lower position 1
Move to 7a (■). Second board holder 53: lowered and mounted on the rear carrier 43 (■).

■ Fig. 3D Second substrate holder 53: mounted on the back carrier 43 and moved to the film forming zone 13 (■), gate valve 31: closed.

■ Figure 3E Gate valve 33: Shunting zone 17 (17a + 17b
) opens after leaking into the atmosphere. Third substrate holder 55: mounted on the inlet side carrier 45 and connected to the first substrate holder 51
, and moves to the lower position 17b of the rear suspension member (
■).

■ FIG. 3F Third board holder 55: Lifted up by rear suspension member 19 (■). Entrance side carrier 45: Moved to the lower position 17b of the front suspension member (■).

■ Fig. 3G First substrate holder 51: lowered onto the entrance side carrier 45,
Equipped (■).

(Fig. 3H) First substrate holder 51: Mounted on the inlet side carrier 45 and transported to the outside of the apparatus 27 ([phase]).

■ Third construction gate valve 33: Closed, shunting zone 17 (17a and 17b
) exhaust. First substrate holder 51: Send to next process (@)
.

Thereafter, the state shown in FIG. 3A is returned by mounting the substrate holder (55 in FIG. 3A) in which a new substrate is set onto the entrance side carrier shown in FIG. 31.

According to the continuous vacuum thin film forming method of the present invention, an exchange zone and a film forming zone are provided in succession from the loading/unloading entrance side of the substrate holder, and a front stage and a rear stage are provided in the exchange zone in the direction of movement of the substrate holder. By installing hanging members in series, lifting the substrate holder upward by these hanging members, and passing another substrate holder underneath it to switch the front and rear positions, it is possible to transfer the substrate from one equipment entrance into the equipment. You can take things in and out. Therefore, it is easy to automate the preparation of new substrates and the transportation of substrates after film formation to the next process, and since there is no dust in one clean room, it is possible to reduce equipment costs. The degree of freedom in factory layout will also increase.

Further, according to the apparatus of the present invention, by using two transfer members on the entrance side and the back side, the above method can be efficiently carried out with a simple WB configuration.

Furthermore, by providing a preliminary evacuation zone (preliminary vacuum chamber) before the shunting zone (shunting vacuum chamber), it is possible to efficiently preheat the substrate in the shunting zone and shorten the evacuation time.

[Brief explanation of drawings]

Figure 1A- is an explanatory diagram (perspective view) showing an embodiment of the present invention, and Figure 2 is an explanatory diagram seen from a cross section corresponding to Figure 1A. 3A to 3D are explanatory views (perspective views) showing other embodiments of the present invention, and FIG. 4 is an explanatory view seen from a cross section corresponding to FIG. 3A. 11... Film-forming vacuum chamber 13... Film-forming zone 15.
...Shunting vacuum chamber 17...Shunting zone 17a...
Lower stage suspension member position 17b... Lower stage suspension member position 19... Rear stage suspension member 21... Front stage suspension member 2
3...Preliminary exhaust chamber 25...Preliminary exhaust zone 27
... Outside the device: H, 33, 35 ... Gate valve 41 ... Conveyance member 41a ... Drive roller 4
1b...Rail 43...Back carrier 43
a, 45a...Carrier body 45...Entrance side carrier 43b, 45b...Rotating stand 51...First substrate holder 53...Second substrate holder 55...Third substrate holder 61... Holder rotating member 63... Heater 65...
・Evaporation source 71.73... Drive cylinder 75
...Motor 77...Heater Fig. 1D Fig. 1G [Oq+

Claims (5)

[Claims] 1. From the entrance side of the vacuum processing chamber, an exchange zone in which front and rear suspension members capable of suspending the substrate holder are connected in sequence, and a film forming zone equipped with means for forming a thin film on the substrate are connected in sequence. 1. A continuous vacuum thin film forming method, characterized in that the following steps are performed in a vacuum processing chamber. Step A: Step B of positioning the first substrate holder in the deposition zone and depositing a film on this substrate while the second substrate holder holding the new substrate on which the thin film is to be formed is positioned in the exchange zone. Process: After the film formation is completed, with the exchange zone shielded from the atmosphere and with the second substrate holder suspended by the suspension member at the rear of the exchange zone, the second substrate holder is placed under the second substrate holder. C process of transferring the first substrate holder from the film forming zone to a position below the suspension member in the front stage of the exchange zone: The first substrate holder is suspended by the suspension member in the front stage of the exchange zone. At the same time, the second substrate holder is lowered and transferred to the film formation zone, and the space between the film formation zone and the exchange zone is vacuum-shielded.Step D: The first substrate holder is suspended in the exchange zone. The exchange zone is opened to the atmosphere or another vacuum chamber while holding the substrate, and the third substrate holder containing the new substrate to be deposited is placed on the entrance side of the vacuum processing chamber by passing it under the first substrate holder. Step E, in which the first substrate holder is carried into the shunting zone and transferred to a position below the subsequent suspension member; Step F, in which the first substrate holder is lowered and transferred toward the vacuum processing chamber entrance side, and carried out to the outside of the vacuum processing chamber. Process: A step in which the substrate holder located in the film formation zone is read as the first substrate holder, and the substrate holder located in the exchange zone is read as the second substrate holder, and the steps A to E above are repeated. 2. A preliminary evacuation zone is provided on the inlet side of the exchange zone of the vacuum processing chamber, and when the substrate holder is brought into the exchange zone, the substrate holder is pre-exhausted with the preliminary exhaust zone and the exchange zone shielded by vacuum. After the pre-evacuation zone is evacuated, the pre-evacuation zone is opened to the shunting zone, and the substrate holder is carried into the shunting zone. The continuous vacuum system according to claim 1, wherein after the substrate holder is transferred to the preliminary evacuation zone, the preliminary evacuation zone and the exchange zone are vacuum-shielded, the preliminary evacuation zone is opened to the atmosphere, and the substrate holder is transported outside. Thin film formation method. 3. 3. The continuous vacuum thin film forming method according to claim 1, wherein the substrate of the substrate holder in the exchange zone is heat-treated prior to transferring the substrate holder to the film forming zone. 4. A shunting vacuum chamber in which front and rear suspension members capable of lifting and lowering the substrate holder are arranged in series in the transfer direction of the substrate holder; a film forming vacuum chamber equipped with a film forming means; a first opening/closing member capable of vacuum-shielding and opening the exchange vacuum chamber and the film-forming vacuum chamber; and a second opening-closing member capable of shielding and opening the exchange vacuum chamber from the atmosphere or other vacuum chambers. , an inlet-side transfer member that loads and transports the substrate holder by reciprocating between the outside of the shunting vacuum chamber, the lower position of the front-stage suspension member of the shunting vacuum chamber, and the lower position of the rear-stage suspension member of the shunt vacuum chamber; It is characterized by having a back-side transfer member that reciprocates between the membrane vacuum chamber, the lower position of the rear-stage suspension member of the shunting vacuum chamber, and the lower position of the front-stage suspension member of the shunting vacuum chamber to mount and transport the substrate holder. Continuous vacuum thin film forming equipment. 5. Furthermore, in the front stage of the shunting vacuum chamber, there is a preliminary vacuum chamber that can be vacuum-shielded and opened at will with respect to the shunting vacuum chamber, and the inlet side transfer member is
5. The series according to claim 4, wherein the substrate holder is mounted and transported by reciprocating between the outside of the preliminary vacuum chamber, the preliminary vacuum chamber, the lower position of the front suspension member of the shunting vacuum chamber, and the lower position of the rear suspension member of the shunting vacuum chamber. Vacuum thin film forming equipment.