JPH0319113A - Production of thin film magnetic head - Google Patents

Abstract

PURPOSE:To make the title head into high density multichannel and to highly efficiently obtain the thin film magnetic head at low cost by collectively working plural layered product consisting of a coil conductor layer and insulating layers in a coil form and flattening-working them and connecting exposed inter-layer conductor layer terminal. CONSTITUTION:The insulating layers 13a-13d and conductive thin films 14a-14d consisting of Cu, Al and the like are alternately laminated on a substrate insulat ing layer 11 so as to form the four layered product 15, and a coil formation working is collectively executed by a photolisography technique. Then, the flattening-working of an upper part is executed until the tip parts of respective conductive thin films 14a-14d of the layered product 15 are sufficiently exposed and the insulating layer 17 is formed. Then, connection terminal parts 18a-18d are formed by the photolisography technique and a fine working technique. Then, the conductive thin films 14a-14d of the layered product 15 are respective ly connected and a four turn herically coil if formed by forming the connection conductors 19a-19c of Cu, Al and the like. Thus, the need of photolisography and fine working for respective layers is eliminated and the yield of manufacture cost is reduced. Thus, yield is improved and density is made high.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a thin film magnetic head used in a magnetic recording/reproducing device, particularly a thin film magnetic head having a coil wound a plurality of times. Toru Information Industries With the improvement of recording density in the magnetic recording field, thin film magnetic heads that can shorten track widths and become multi-track are increasingly being used. The coil structure of a thin film magnetic head has a coil wound multiple times.
Spiral coil 5k shown in Fig. 3(a)
The zigzag coil 5''2 shown in b)...the helical coil 53 shown in FIG. 3(C) is also known.
0 is a lower magnetic core, 31 is a magnetic gap 32 is an upper magnetic core, 51, 52, 53 are each coil/t, 10 is a base plate 54 is a through hole.However, the third problem to be solved by the invention is as follows. The spiral coil 51 shown in Figure (a) (the coil expands in the upper track width direction and the track depth direction) makes it difficult to fabricate a high-density multi-channel head, and increases the magnetic path length of a thin-film magnetic head. There are disadvantages such as the loss in the magnetic core increases and the effect of winding the coil multiple times is small f, Fig. 3 (b)
The zigzag-shaped coil 52 (; However, a thin film magnetic head having a helical coil 53 as shown in FIG. 3(C) has been proposed as a method to solve the above disadvantage. The coil conductor layer and insulating layer are formed into one layer through hole 54.
Repeat row 1, X. Even though the process is complicated and the cost is high, the above-mentioned conventional method for manufacturing a thin film magnetic head having a coil with multiple turns can be used to form a coil with multiple turns.
Increasing the loss in the magnetic core There is a problem that high-density multi-channel formation is difficult and high cost1.In view of the above problems, the present invention enables high-density multi-channel formation, high efficiency, low cost, and high cost. To provide a manufacturing method for easily obtaining a thin film magnetic head having a wound coil, a method for manufacturing a thin film magnetic head according to the present invention is provided. a step of forming a slope-shaped base layer on a part of the formation surface, a step of forming a laminate in which a plurality of conductor layers and insulating layers are alternately formed, and a step of forming a laminated coil shape from the laminate at once. a step of flattening the upper part of the coil of the laminate; and a step of connecting each of the conductor terminal parts exposed in the flattening step with a connecting conductor to fabricate a laminate coil. Characteristics and Effects Coil j &
A multi-layer structure consisting of a coil conductor layer and an insulating layer is collectively processed into a coil shape using photolithography technology and fine etching processing technology, and is formed by connecting the exposed inter-layer conductor layer terminals after flattening. Also, therefore,
Photolithography and fine etching for each coil conductor layer are no longer required, simplifying the manufacturing process and reducing costs.
! In addition, since it is a laminated coil, high-density multi-channeling is also possible.Example An example of the present invention will be described below with reference to the drawings. FIG. 1 shows the external appearance of a titanium thin film magnetic head manufactured by a method for manufacturing a thin film magnetic head according to an embodiment of the present invention. Figure 2 shows the manufacturing method for the connection terminal part in particular, and even though the part corresponding to the X+-X2 cross section in Figure 1 is shown, 10 in Figures 1 and 2 is Base of glass etc.
11 is a slope-shaped base layer made of Sift; 12 is a photoresist for forming the slope-shaped base layer 1l;
3a, 13b. 13c. 13d is a carp made of Cu, AI, etc./l<14a, 14b. 14c, 1
4d is an interlayer insulation made of Si (h) [15 is a laminated E
16 is an insulator made of SiOa 7117 is an insulator made of Si(h) to prevent short circuits in the interlayer conductor layer.
a. 18h 18c, 18d are connecting terminals 19a, 1 for connecting the interlayer conductor layer and external terminals.
9b and 19c are connection guides 30, a lower magnetic layer 31 is a magnetic gap, and 32 is an upper magnetic layer.The method for manufacturing the thin film magnetic head in this embodiment will be described below with reference to FIGS. 2(a) to 2(g). The explanation will be explained in order while referring to them. First, a lower magnetic layer 30 is formed on a substrate 10 made of glass or the like (see FIG. 1). In Figure 2(a), (i
The lower magnetic layer 30 is formed by forming a photoresist with a predetermined thickness of the base insulating layer 11 such as Si (h) using photolithography.Next, in (b), a dry etching method such as ion beam milling is used. For base insulating layer 11
Even if it is formed into a slope shape with a predetermined angle θ, it satisfies the condition of θ≦45° above the angle θζ, and by making it 45° or less, an advantageous condition can be obtained in subsequent processes. Details of t. In (C), insulating layers 13a, 13b, 1 are formed on the base insulating layer ll.
3c. 13d and a conductor thin film 14 made of Cu, AI, etc.
a, 14b, 14c, and 14d are alternately laminated using vacuum evaporation or sputtering to form a 4-layer laminate l5
The laminated body 15 is processed to form a coil all at once using photolithography technology. (d) Insulating layer 1
6 is formed to have a thickness greater than that of the base insulating layer 11. Next, each conductor thin film 14a,
FIG. 2(e) shows a structure in which the upper portions of the electrodes 14b, 14c, and 14d are flattened until their ends are fully exposed.

Next, in (f), an insulating layer 17 is formed, and a connecting terminal portion 18 is formed using photolithography fine processing technology.
a. 18tx 18c, 18d are shown. As mentioned above, the angle θ of the slope-shaped base layer 11 was set to 45° or less. Each conductor thin film 14a, 14b
, 14c, 14d can be obtained, and can also be explained from the formula shown below. In other words, each conductor thin film 14a, 14b, 14c,
If the film thickness of 14d is a, then the ratio is 1:1 when θ is -45°.From the above, it is possible to facilitate the process by making θ≦45°.Also, ( g
), connecting conductors 19a, 19b made of Cu, Al, etc.
, 19c, the conductor thin Im! in the laminate 15 is formed. 14a, 14b, 14c, and 14d are each connected to form a 4-turn helical coil.Next, a magnetic gap 3l made of SiOt is formed, and then an upper magnetic layer 32 is formed to complete the thin film magnetic head. With the above thin-film magnetic head manufacturing method, there is no need to perform photolithography and microfabrication for each layer in the conventional laminated coil manufacturing method, which simplifies the process, reduces manufacturing costs, and improves yield. In addition, it is possible to achieve high density and to realize a highly efficient thin film magnetic head.Effects of the Invention According to the manufacturing method of the thin film magnetic head of the present invention, photolithography and microfabrication of each layer are performed in the conventional laminated coil manufacturing method. There is no need to perform this process, and the process can be simplified to reduce manufacturing costs, improve yields, and make it possible to manufacture highly efficient thin-film magnetic heads that can increase density.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a method for manufacturing a thin film magnetic head according to an embodiment of the present invention, and FIG. 2 shows each step of the manufacturing method (
The cross sections shown in a) to (g) are the same as those shown in FIG.

Claims (2)

[Claims] (1) The lower magnetic layer and the upper magnetic layer correspond to each other via a magnetic gap at one end, and are laminated facing each other at the other end to form a magnetic circuit, and between the upper magnetic layer and the lower magnetic layer. , a method for manufacturing a thin film magnetic head having a thin film coil wound a plurality of times interlinking with the magnetic circuit, including a step of forming a slope-shaped base layer on a part of the forming surface of the thin film coil, and forming a conductive layer and an insulating layer. A step of forming a laminate in which a plurality of layers are alternately formed, a step of forming a laminated coil shape from the laminate at once, a step of flattening the upper part of the coil of the laminate, and a step of the flattening. 1. A method for manufacturing a thin-film magnetic head, comprising the step of manufacturing a laminated coil by connecting each of the exposed conductor terminal portions with a connecting conductor. (2) The method of manufacturing a thin-film magnetic head according to claim 1, wherein the slope-shaped underlayer formed on a part of the surface on which the thin-film coil is formed is formed to have an inclined surface of 45 degrees or less.