JPH0319032B2 - - Google Patents

Info

Publication number
JPH0319032B2
JPH0319032B2 JP58190334A JP19033483A JPH0319032B2 JP H0319032 B2 JPH0319032 B2 JP H0319032B2 JP 58190334 A JP58190334 A JP 58190334A JP 19033483 A JP19033483 A JP 19033483A JP H0319032 B2 JPH0319032 B2 JP H0319032B2
Authority
JP
Japan
Prior art keywords
surface plate
plate
polishing
semiconductor wafer
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58190334A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6080559A (ja
Inventor
Haruo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP58190334A priority Critical patent/JPS6080559A/ja
Publication of JPS6080559A publication Critical patent/JPS6080559A/ja
Publication of JPH0319032B2 publication Critical patent/JPH0319032B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP58190334A 1983-10-12 1983-10-12 研磨装置 Granted JPS6080559A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58190334A JPS6080559A (ja) 1983-10-12 1983-10-12 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58190334A JPS6080559A (ja) 1983-10-12 1983-10-12 研磨装置

Publications (2)

Publication Number Publication Date
JPS6080559A JPS6080559A (ja) 1985-05-08
JPH0319032B2 true JPH0319032B2 (enExample) 1991-03-14

Family

ID=16256458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58190334A Granted JPS6080559A (ja) 1983-10-12 1983-10-12 研磨装置

Country Status (1)

Country Link
JP (1) JPS6080559A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60197365A (ja) * 1984-03-16 1985-10-05 Mitsubishi Metal Corp 研磨装置
WO2005095053A1 (ja) * 2004-03-31 2005-10-13 Japan Science And Technology Agency 直進型研磨方法及び装置
CN112809498A (zh) * 2020-12-31 2021-05-18 浙江酷趣网络科技有限公司 一种基于网络农业科技的农业工具自动化打磨调节装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5077994A (enExample) * 1973-11-14 1975-06-25
JPS5748061U (enExample) * 1980-09-04 1982-03-17

Also Published As

Publication number Publication date
JPS6080559A (ja) 1985-05-08

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