JPH03188617A - Method for electron beam writing - Google Patents
Method for electron beam writingInfo
- Publication number
- JPH03188617A JPH03188617A JP32793689A JP32793689A JPH03188617A JP H03188617 A JPH03188617 A JP H03188617A JP 32793689 A JP32793689 A JP 32793689A JP 32793689 A JP32793689 A JP 32793689A JP H03188617 A JPH03188617 A JP H03188617A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- electron beam
- drawn
- patterns
- movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 238000010894 electron beam technology Methods 0.000 title abstract description 8
- 238000000609 electron-beam lithography Methods 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Landscapes
- Electron Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子ビーム描画方法に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to an electron beam writing method.
従来の技術
電子ビーム描画方法には、試料台の移動の仕方から、ス
テップ・アンド・リピート方法と、連続移動方法の2種
類がある。There are two types of conventional electron beam lithography methods, a step-and-repeat method and a continuous movement method, depending on how the sample stage is moved.
ステップ・アンド・リピート方式は、例えばX方向にス
テップ移動を繰り返しながら描画領域をつないでゆき、
試料端部でY方向に1回ステップ移動し、続いて−X方
向にステップ移動を繰り返してゆく。そして試料端部に
達するとY方向に1回ステップ移動を行なう。以上の動
作を繰り返して、試料全面を描画する。The step-and-repeat method, for example, connects drawing areas while repeating step movements in the X direction,
One step movement is made in the Y direction at the end of the sample, and then the step movement is repeated in the -X direction. When the end of the sample is reached, one step movement is performed in the Y direction. Repeat the above operations to draw the entire surface of the sample.
連続移動方式は、例えばX方向に試料台を連続移動しな
がら一定幅のストライプ状の領域を描画し、試料端部ま
で来ると、Y方向にステップ移動を行なう。続いて、−
X方向に連続移動してゆく。以上の動作を繰り返して試
料全面を描画する。In the continuous movement method, for example, a stripe-shaped area of a constant width is drawn while continuously moving the sample stage in the X direction, and when it reaches the end of the sample, step movement is performed in the Y direction. Then -
Continuously moves in the X direction. Repeat the above operations to draw the entire surface of the sample.
いずれの方式においても、全体的な描画の動作は、試料
をX方向に長いストライプ状の領域に分割し、この領域
をつないで全描画を行なう。In either method, the overall drawing operation involves dividing the sample into long stripe-like regions in the X direction, and connecting these regions to perform the entire drawing.
描画精度を高める上で、両描画方式ともに、試料台のス
テップ移動に伴う精度劣化を防ぐことが重要になる。こ
の観点から、ステップ移動量をストライブ幅より小さく
することによりストライプを重畳させ、多重描画させる
ことで高精度化を図った試みが提案されている。In order to improve drawing accuracy, it is important for both drawing methods to prevent accuracy deterioration due to step movement of the sample stage. From this point of view, an attempt has been proposed in which stripes are overlapped by making the step movement amount smaller than the stripe width, thereby achieving higher precision by performing multiple drawing.
発明が解決しようとする課題
このような従来の電子ビーム描画方法では、X方向の描
画が時間的に連続しているのに対し、Y方向の描画は必
ずしも連続しておらず、試料と試料台との位置ずれの発
生や、描画中の試料温度変化による膨張など種々な誤差
要因がY方向の繋ぎ部に発生するため、ストライプ状描
画領域の重畳回数を増さなければ精度向上は難しく、こ
のため描画時間が著しく長くなり、スループットが低下
するという問題があった。Problems to be Solved by the Invention In such conventional electron beam lithography methods, lithography in the X direction is temporally continuous, but lithography in the Y direction is not necessarily continuous, and Various error factors occur at the joints in the Y direction, such as misalignment with the sample and expansion due to changes in sample temperature during drawing, so it is difficult to improve accuracy without increasing the number of times the striped drawing areas are overlapped. Therefore, there was a problem that the drawing time became significantly longer and the throughput decreased.
課題を解決するための手段
このような課題を解決するために、本発明の電子ビーム
描画方法は、X方向のストライプ状描画と、Y方向のス
トライプ状描画とを互いに重畳させる。Means for Solving the Problems In order to solve these problems, the electron beam drawing method of the present invention overlaps stripe drawing in the X direction and stripe drawing in the Y direction.
作用
この方法によって、Y方向の描画にも時間的連続性を持
たせることができ、少ない重畳回数で高精度な描画を実
現できる。Effect: With this method, it is possible to provide temporal continuity to drawing in the Y direction, and highly accurate drawing can be achieved with a small number of superimpositions.
実施例
第1図(al、 (blは本発明の電子ビーム描画方法
の一実施例を説明するための描画パターン図である。Embodiment FIGS. 1A and 1B are drawing pattern diagrams for explaining an embodiment of the electron beam drawing method of the present invention.
この実施例では、試料移動方式は連続移動方式、重畳回
数はX方向、Y方向各1回ずつで合計2回としている。In this embodiment, the sample movement method is a continuous movement method, and the number of times of superimposition is two in total, once in each of the X and Y directions.
第1図fat、 (blの各図において、1は試料、2
.3は描画パターン、4〜9はストライプ状の描画領域
である。Figure 1 fat, (In each figure of bl, 1 is the sample, 2
.. 3 is a drawing pattern, and 4 to 9 are striped drawing areas.
第1描画は、第1図(alのように、Y方向のストライ
プ状の描画領域をつなぎ合わせて行なう。すなわち、ス
トライプ4を−Y力方向矢印B+)に試料を移動しなが
らパターン2などを描画する。The first drawing is performed by connecting the striped drawing areas in the Y direction as shown in FIG. draw.
試料端まで達するとX方向(矢印AI )にステップ移
動を行ない、続いてY方向(矢印B2)に試料を連続移
動を行ないながらストライプ5の描画を行なう。以下同
様の動作を繰り返して試料全面を描画する。When the end of the sample is reached, a step movement is performed in the X direction (arrow AI), and then the stripe 5 is drawn while continuously moving the sample in the Y direction (arrow B2). Thereafter, the same operation is repeated to draw the entire surface of the sample.
第2描画は、第1図(blのように、X方向のストライ
プ状の描画領域をつなぎ合わせて行なう。すなわち、試
料の移動は、矢印D+、cl、D2.C2゜D3のよう
に、第1描画とX、Yを入れ替えた動きをする。そうし
て試料全面を描画する。The second drawing is performed by connecting the striped drawing areas in the X direction as shown in FIG. Make a movement by swapping X and Y with 1 drawing.In this way, draw the entire surface of the sample.
各描画は、使用する電子ビームレジストの最適露光量の
1/2の露光量で行なわれる。従って解像するパターン
は各描画の重なった部分となり、位置精度の高いものと
なる。その様子を第2図を用いて説明する。Each drawing is performed with an exposure amount that is 1/2 of the optimum exposure amount for the electron beam resist used. Therefore, the pattern to be resolved will be a portion where each drawing overlaps, and the positional accuracy will be high. The situation will be explained using FIG. 2.
第2図において、113〜14aは第1描画により描画
されたパターン、11b〜14bは第2描画により描画
されたパターン、110〜14cは解像するパターンを
表わす。In FIG. 2, 113 to 14a represent patterns drawn in the first drawing, 11b to 14b represent patterns drawn in the second drawing, and 110 to 14c represent patterns to be resolved.
第1描画により描画されたパターン11a〜14aは、
Y方向には時間的に連続して描画されるために、Y方向
の位置精度は極めて高いが、X方向の位置精度はやや劣
る。一方、第2描画により描画されたパターンllb〜
14bはX方向に位置精度が高く、Y方向にやや劣るも
のとなる。The patterns 11a to 14a drawn by the first drawing are
Since the drawing is performed temporally continuously in the Y direction, the positional accuracy in the Y direction is extremely high, but the positional accuracy in the X direction is slightly inferior. On the other hand, the pattern llb~ drawn by the second drawing
14b has high positional accuracy in the X direction, but is slightly inferior in the Y direction.
従って、両者の重なった部分11c〜14cが解像する
が、両者の位置誤差が平均化され1/2となる。同一方
向のストライプのみを重畳した場合に比べて、本発明で
はX方向に高精度な描画パターンとY方向に高精度なパ
ターンとを重ねるため、位置誤差の改善の度合は極めて
大きい。Therefore, the overlapping portions 11c to 14c of both are resolved, but the positional error of both is averaged and becomes 1/2. Compared to the case where only stripes in the same direction are superimposed, in the present invention, since a highly accurate drawing pattern in the X direction and a highly accurate pattern in the Y direction are superimposed, the degree of improvement in positional errors is extremely large.
なお、ステップ・アンド・リピート方式においても、全
く同様にして大きな精度向上が得られる。It should be noted that even in the step-and-repeat method, a large accuracy improvement can be obtained in exactly the same way.
なお、各描画において、ストライプ状描画領域をつなぐ
ステップ移動量をストライプ幅よりも小さくシ、同一方
向のストライプを重畳するという従来法を合わせて実施
するとさらに大きな精度向上が得られる。In addition, in each drawing, if the step movement amount connecting the striped drawing areas is made smaller than the stripe width and the conventional method of overlapping stripes in the same direction is also carried out, an even greater improvement in precision can be obtained.
発明の効果
本発明の電子ビーム描画方法によれば、試料移動に伴う
誤差を平均化することにより、パターン位置精度の高い
描画が可能となる。Effects of the Invention According to the electron beam writing method of the present invention, by averaging errors caused by sample movement, writing with high pattern position accuracy is possible.
第1図は本発明の一実施例における電子ビーム描画方法
を示す描画パターン図、第2図は一実施例における描画
パターンを示す平面図である。
1・・・・・・試料、1la−14a・・・・・・第1
描画パターン、11b〜14b・・・・・・第2描画パ
ターン、11c〜14c・・・・・・解像パターン。FIG. 1 is a drawing pattern diagram showing an electron beam drawing method in one embodiment of the present invention, and FIG. 2 is a plan view showing a drawing pattern in one embodiment. 1...Sample, 1la-14a...1st
Drawing patterns, 11b to 14b... second drawing patterns, 11c to 14c... resolution patterns.
Claims (1)
した複数の描画を重ねることを特徴とする電子ビーム描
画方法。An electron beam lithography method characterized by stacking a plurality of lithography images rotated at an arbitrary angle in relation to sample movement accompanying electron beam lithography.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1327936A JP2523910B2 (en) | 1989-12-18 | 1989-12-18 | Electronic beam drawing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1327936A JP2523910B2 (en) | 1989-12-18 | 1989-12-18 | Electronic beam drawing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03188617A true JPH03188617A (en) | 1991-08-16 |
JP2523910B2 JP2523910B2 (en) | 1996-08-14 |
Family
ID=18204665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1327936A Expired - Fee Related JP2523910B2 (en) | 1989-12-18 | 1989-12-18 | Electronic beam drawing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2523910B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001063325A1 (en) * | 2000-02-28 | 2001-08-30 | Dai Nippon Printing Co., Ltd. | Method of making phase mask for machining optical fiber and optical fiber having bragg diffraction grating produced using the phase mask for machining optical fiber |
-
1989
- 1989-12-18 JP JP1327936A patent/JP2523910B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001063325A1 (en) * | 2000-02-28 | 2001-08-30 | Dai Nippon Printing Co., Ltd. | Method of making phase mask for machining optical fiber and optical fiber having bragg diffraction grating produced using the phase mask for machining optical fiber |
US6795614B2 (en) | 2000-02-28 | 2004-09-21 | Dai Nippon Printing Co., Ltd. | Method of making phase mask for machining optical fiber and optical fiber having bragg diffraction grating produced using the phase mask for machining optical fiber |
Also Published As
Publication number | Publication date |
---|---|
JP2523910B2 (en) | 1996-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |