JPH0318852A - Method for sticking pellicle - Google Patents
Method for sticking pellicleInfo
- Publication number
- JPH0318852A JPH0318852A JP1154293A JP15429389A JPH0318852A JP H0318852 A JPH0318852 A JP H0318852A JP 1154293 A JP1154293 A JP 1154293A JP 15429389 A JP15429389 A JP 15429389A JP H0318852 A JPH0318852 A JP H0318852A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- mask
- chamber
- foreign matter
- inert gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000011261 inert gas Substances 0.000 claims abstract description 14
- 239000012528 membrane Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000007789 gas Substances 0.000 abstract description 11
- 230000008021 deposition Effects 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概 要〕
ペリクルをマスクに貼付けた後のマスクの使用中に、ペ
リクルとマスクの間の空間に異物が析出するのを防止す
る方法に関し、
ペリクルをマスクへ貼付けた後に、マスク、ペリクル膜
及びフレームにて包囲された空間に異物が析出するのを
防止することが可能となるペリクル貼付方法の提供を目
的とし、
ペリクル膜をフレームの一方の面に貼付け、前記フレー
ムの他方の面に接着剤を塗布したペリクルをマスクに貼
付する工程において、不活性ガスのガス導入口とガス排
気口とを具備し、内部の空気を前記不活性ガスと置換し
たチャンバー内において、前記ペリクルを前記マスクに
貼付けるよう構成する。[Detailed Description of the Invention] [Summary] This invention relates to a method for preventing foreign matter from being deposited in the space between the pellicle and the mask during use of the mask after the pellicle is attached to the mask. The purpose of the present invention is to provide a pellicle attachment method that can prevent foreign matter from depositing in a space surrounded by a mask, a pellicle membrane, and a frame. In the step of attaching a pellicle with an adhesive applied to the other surface of the mask to the mask, in a chamber equipped with an inert gas inlet and a gas exhaust outlet, and in which the air inside is replaced with the inert gas, The pellicle is configured to be attached to the mask.
本発明は、ペリクルをマスクに貼付けた後のマスクの使
用中に、ペリクルとマスクの間の空間に異物が析出する
のを防止する方法に関するものである。The present invention relates to a method for preventing foreign matter from being deposited in the space between the pellicle and the mask during use of the mask after the pellicle has been attached to the mask.
近年の半導体素子のパターンの微細化に伴い、マスクに
貼付したペリクル内に異物が存在する場合においては、
半導体ウェーハにパターンを転写した場合には半導体素
子のパターンに欠陥が生じて不良となる。With the miniaturization of semiconductor device patterns in recent years, if there is a foreign object inside the pellicle attached to the mask,
When a pattern is transferred to a semiconductor wafer, defects occur in the pattern of the semiconductor element, resulting in a defect.
このためペリクル内の異物の有無を検査する長焦点距離
の検査装置や、ペリクル上から検査する異物検査機が用
いられているが、検査時にはなかった異物がマスクの使
用中にペリクル内に析出して欠陥となる障害が発生して
いる。For this reason, long focal length inspection equipment that inspects the presence of foreign matter inside the pellicle and foreign matter inspection machines that inspect from above the pellicle are used, but foreign matter that was not present at the time of inspection is deposited inside the pellicle while the mask is in use. A fault has occurred that results in a defect.
以上のような状況から検査時には発見できないが、使用
中にペリクルとマスクの間の空間に析出する異物の発生
を防止することが可能なペリクル貼付方法が要望されて
いる。Under the above circumstances, there is a need for a pellicle attachment method that can prevent the occurrence of foreign matter that cannot be detected during inspection but is deposited in the space between the pellicle and the mask during use.
従来のペリクルのマスクへの貼付作業について第2図〜
第4図により詳細に説明する。Figure 2 shows the conventional process of attaching a pellicle to a mask.
This will be explained in detail with reference to FIG.
第2図はべりタルの構造を示す側断面図である。FIG. 2 is a side sectional view showing the structure of the belt.
ペリクルlは、アルミニウム等の金属からなるフレーム
1bの上面にニトロセルローズ等の光透過性のペリクル
膜1aを貼付け、下面にブチルゴム系の接着剤1cを塗
布したものであり、第3図に示すようにマスク2の両面
にペリクル1を接着剤1cによって貼付けて用いている
。The pellicle 1 has a light-transmissive pellicle film 1a made of nitrocellulose or the like applied to the upper surface of a frame 1b made of metal such as aluminum, and a butyl rubber adhesive 1c applied to the lower surface, as shown in FIG. A pellicle 1 is attached to both sides of a mask 2 using an adhesive 1c.
このようにペリクルlをマスク2に貼付けるのには第4
図に概略構造を示すペリクル貼付装置を用いている。In order to attach the pellicle l to the mask 2 in this way, the fourth
A pellicle pasting device, the schematic structure of which is shown in the figure, is used.
ペリクル貼付装置には中央部にマスク2を真空により吸
着して保持する保持部3が設けられており、左右にはガ
イド棒4によって左右に移動可能で、ペリクル1を真空
により吸着して搭載するペリクル搭載部5が設けられて
いる。The pellicle pasting device is provided with a holding part 3 in the center that holds the mask 2 by vacuum suction, and can be moved left and right by guide rods 4 on the left and right sides, and the pellicle 1 is vacuum suctioned and mounted. A pellicle mounting section 5 is provided.
マスク2にペリクル1を貼付ける場合にはまずマスク2
の包装を除去してマスク2を保持部3に装着する。つぎ
に一方のペリクル搭載部5に装着するペリクルlの包装
を除去して図示のようにペリクル1の接着剤1cをマス
ク2に向けてペリクル搭載部5に装着する。そして同様
に他方のペリクル搭載部5に装着するペリクル1の包装
を除去してペリクル1をペリクル搭載部5に装着する。When attaching pellicle 1 to mask 2, first attach mask 2.
The packaging is removed and the mask 2 is attached to the holding part 3. Next, the packaging of the pellicle l attached to one of the pellicle mounting portions 5 is removed, and the pellicle 1 is attached to the pellicle mounting portion 5 with the adhesive 1c of the pellicle 1 facing the mask 2 as shown in the figure. Similarly, the packaging of the pellicle 1 mounted on the other pellicle mounting section 5 is removed, and the pellicle 1 is mounted on the pellicle mounting section 5.
このようにして2個のペリクルlをそれぞれ装着したペ
リクル搭載部5をガイド棒4に沿って矢印の方向に中央
部に移動し、中央部の保持部3に装着したマスク2の両
面にそれぞれ接着剤1cによってペリクル1を貼付けて
ペリクル付マスクが完成する。In this way, the pellicle mounting part 5 with the two pellicles l attached thereto is moved to the center along the guide rod 4 in the direction of the arrow, and glued to both sides of the mask 2 attached to the holding part 3 in the center. A mask with a pellicle is completed by pasting the pellicle 1 with the agent 1c.
このように大気中においてペリクル1をマスク2に貼付
けた場合には、マスク2.ペリクル膜1a及びフレーム
1bにて包囲された空間に異物が析出することがあり、
この異物が半導体基板の表面に形成したレジスト膜に転
写されると、半導体基板に形成する半導体素子が不良と
なる障害が発生している。When the pellicle 1 is attached to the mask 2 in the atmosphere as described above, the mask 2. Foreign matter may be deposited in the space surrounded by the pellicle membrane 1a and the frame 1b,
When this foreign material is transferred to a resist film formed on the surface of a semiconductor substrate, a problem occurs in which a semiconductor element formed on the semiconductor substrate becomes defective.
以上説明した従来のペリクル貼付工程においては、その
貼付作業を大気中において行っている。In the conventional pellicle pasting process described above, the pasting work is performed in the atmosphere.
このために、ペリクルとマスクの間に酸素があるから、
マスクの使用中に露光装置の光源から出される紫外線を
、この酸素が吸収してオゾン(03)に変化し、ペリク
ル内の残留異物と化学反応を起こしてマスク、ペリクル
膜及びフレームにて包囲された空間に異物が析出し、こ
の異物が0.5μm以下であっても4メガ或いは16メ
ガのDRAMにおいては、この異物が転写されると半導
体素子が不良となる障害が発生するという問題点があっ
た。For this reason, there is oxygen between the pellicle and the mask,
During use of the mask, this oxygen absorbs ultraviolet rays emitted from the light source of the exposure equipment and changes into ozone (03), which causes a chemical reaction with residual foreign matter in the pellicle and is surrounded by the mask, pellicle membrane, and frame. Even if the foreign matter is 0.5 μm or less, in 4Mega or 16Mega DRAMs, there is a problem that if this foreign matter is transferred, it will cause a failure in the semiconductor device. there were.
本発明は以上のような状況から、ペリクルをマスクへ貼
付けた後に、マスク、ペリクル膜及びフレームにて包囲
された空間に異物が析出するのを防止することが可能と
なるペリクル貼付方法の提供を目的としたものである。In view of the above-mentioned circumstances, the present invention seeks to provide a pellicle attachment method that makes it possible to prevent foreign matter from depositing in the space surrounded by the mask, pellicle membrane, and frame after the pellicle is attached to the mask. This is the purpose.
本発明のペリクル貼付方法は、ペリクル膜をフレームの
一方の面に貼付け、このフレームの他方の面に接着剤を
塗布したペリクルをマスクに貼付する工程において、不
活性ガスのガス導入口とガス排気口とを具備し、内部の
空気をこの不活性ガスと置換したチャンバー内において
、このペリクルをマスクに貼付けるよう構成する。The pellicle attachment method of the present invention involves attaching a pellicle membrane to one side of a frame, applying an adhesive to the other side of the frame, and attaching the pellicle to a mask. The pellicle is attached to a mask in a chamber having a mouth and in which the air inside is replaced with this inert gas.
即ち本発明においては、内部の空気を不活性ガスと置換
したチャンバー内において、ペリクルをマスクに貼付け
るから、マスク、ペリクル膜及びフレームにて包囲され
る空間の空気も不活性ガスと置換されるので、ペリクル
をマスクに貼付けた後のマスクの使用中に上記の空間内
に異物が析出するのを防止することが可能となる。That is, in the present invention, since the pellicle is attached to the mask in a chamber in which the internal air has been replaced with inert gas, the air in the space surrounded by the mask, pellicle membrane, and frame is also replaced with inert gas. Therefore, it is possible to prevent foreign matter from being deposited in the above-mentioned space during use of the mask after the pellicle has been attached to the mask.
以下第1図、第4図により本発明の一実施例について詳
細に説明する。An embodiment of the present invention will be described in detail below with reference to FIGS. 1 and 4.
第1図は本発明による一実施例に用いるチャンバーの構
造を示す図である。FIG. 1 is a diagram showing the structure of a chamber used in an embodiment according to the present invention.
図に示すように、このチャンバーはメインチャンバー6
及びこのメインチャンバー6とゲートバルブ7を介して
接続されている4個の予備室とからなり、それぞれの予
備室にはべりタル貼付装置が設けられており、それぞれ
のペリクル貼付装置は交互にメインチャンバー6に出し
入れすることが可能となっている。As shown in the figure, this chamber is the main chamber 6.
The main chamber 6 is connected to four preliminary chambers via gate valves 7, and each preliminary chamber is provided with a pellicle pasting device, and each pellicle pasting device alternately connects to the main chamber. It is possible to put in and take out 6.
メインチャンバー6及び予備室にはそれぞれガス導入口
6a、ガス排気口6b及びガス導入口、ガス排気口が設
けられており、各室内の空気を不活性ガスと置換するこ
とが可能となっている。The main chamber 6 and the preliminary chamber are each provided with a gas inlet 6a, a gas exhaust port 6b, a gas inlet, and a gas exhaust port, making it possible to replace the air in each chamber with inert gas. .
作業手順としては、まず一つの予備室8のペリクル貼付
装置にマスク2及び2個のペリクルlを搭載して予備室
8の扉8cを閉じ、室内の空気を不活性ガスと置換し、
ゲートバルブ7を開いてペリクル貼付治具をメインチャ
ンバー6内に入れてマスク2に2個のペリクル1を貼付
ける。As for the work procedure, first, the mask 2 and two pellicles L are loaded on the pellicle pasting device in one preliminary room 8, the door 8c of the preliminary chamber 8 is closed, and the air in the room is replaced with inert gas.
The gate valve 7 is opened, the pellicle attachment jig is put into the main chamber 6, and the two pellicles 1 are attached to the mask 2.
本実施例においては、第4図に示すペリクル貼付装置の
ペリクル搭載部5のガイド棒4に沿った移動を行わせる
ために、ペリクル搭載部5の移動を遠隔操作する機構を
設けている。In this embodiment, a mechanism for remotely controlling the movement of the pellicle mounting section 5 is provided in order to move the pellicle mounting section 5 of the pellicle sticking device shown in FIG. 4 along the guide rod 4.
この間に別の予備室18のペリクル貼付治具にマスク2
及び2個のペリクル1を搭載して予備室18の扉18c
を閉じ、室内の空気を不活性ガスと置換しておく。During this time, the mask 2 was placed on the pellicle attachment jig in another preliminary room 18.
and the door 18c of the spare room 18 with two pellicles 1 installed.
Close the room and replace the air in the room with inert gas.
つぎに、先にメインチャンバー6に入れてマスク2にペ
リクルlの貼付けを完了したペリクル貼付装置を予備室
8に戻し、かわりに予備室18のペリクル貼付装置をメ
インチャンバー6に入れて、マスク2に2個のペリクル
lを貼付ける。Next, the pellicle applicator that was previously placed in the main chamber 6 and completed attaching the pellicle L to the mask 2 is returned to the preliminary chamber 8, and the pellicle attacher in the preliminary chamber 18 is placed in the main chamber 6 instead, and the mask 2 Attach two pellicles to.
このように順次予備室28及び38内にてペリクル貼付
装置にマスク2及びペリクルlを搭載し、予備室内の空
気を不活性ガスと置換し、順次ペリクル貼付装置をメイ
ンチャンバー6に入れてマスク2にペリクルlを貼付け
ると、メインチャンバー6の室内には空気が持ち込まれ
ないので、マスク。In this way, the mask 2 and the pellicle I are sequentially loaded onto the pellicle applicator in the preliminary chambers 28 and 38, the air in the preliminary chamber is replaced with inert gas, and the pellicle applicator is sequentially placed into the main chamber 6, and the mask 2 is loaded onto the pellicle applicator in the preliminary chambers 28 and 38. If you attach a pellicle L to the main chamber 6, air will not be brought into the main chamber 6, so use a mask.
ペリクル膜及びフレームにて包囲された空間には空気が
なく不活性ガスが充満した状態にすることが可能となる
ので、この空間に異物が析出するのを防止することが可
能となる。Since the space surrounded by the pellicle membrane and the frame is free of air and can be filled with inert gas, it is possible to prevent foreign matter from depositing in this space.
以上の説明から明らかなように本発明によれば、極めて
簡単な構造のメインチャンバー及び予備室を設けること
により、マスク、ペリクル膜及びフレームにて包囲され
た空間に異物が析出するのを防止することが可能となる
利点があり、著しい信頼性向上の効果が期待できるペリ
クル貼付方法の提供が可能である。As is clear from the above description, according to the present invention, by providing a main chamber and an auxiliary chamber with extremely simple structures, it is possible to prevent foreign matter from depositing in the space surrounded by the mask, pellicle membrane, and frame. It is possible to provide a pellicle attachment method that can be expected to significantly improve reliability.
第1図は本発明による一実施例を示す図、第2図はべり
タルの構造を示す側断面図、第3図はマスクに二個のペ
リクルを貼付けた状態を示す側面図、
第4図はペリクル貼付装置の概略構造を示す図、である
。
図において、
1はペリクル、
1aはペリクル膜、
■bはフレーム、
1cは接着剤、
2はマスク、
3は保持部、
4はガイド棒、
5はペリクル搭載部、
6はメインチャンバー
6aはガス導入口、
6bはガス排気口、
7はゲートバルブ、
8は予備室、
8aはガス導入口、
8bはガス排気口、
を示ず。
理
人Fig. 1 is a diagram showing one embodiment of the present invention, Fig. 2 is a side sectional view showing the structure of the beritar, Fig. 3 is a side view showing the state in which two pellicles are attached to the mask, and Fig. 4 is 1 is a diagram showing a schematic structure of a pellicle sticking device. In the figure, 1 is the pellicle, 1a is the pellicle membrane, b is the frame, 1c is the adhesive, 2 is the mask, 3 is the holding part, 4 is the guide rod, 5 is the pellicle mounting part, 6 is the main chamber 6a is the gas introduction part 6b is a gas exhaust port, 7 is a gate valve, 8 is a preliminary chamber, 8a is a gas inlet port, and 8b is a gas exhaust port. Rito
Claims (1)
付け、前記フレーム(1b)の他方の面に接着剤(1c
)を塗布したペリクル(1)をマスク(2)に貼付する
工程において、 不活性ガスのガス導入口(6a)とガス排気口(6b)
とを具備し、内部の空気を前記不活性ガスと置換したチ
ャンバー(6)内において、前記ペリクル(1)を前記
マスク(2)に貼付けることを特徴とするペリクル貼付
方法。[Claims] A pellicle membrane (1a) is attached to one side of a frame (1b), and an adhesive (1c) is attached to the other side of the frame (1b).
) In the process of attaching the pellicle (1) coated with
A pellicle attaching method comprising: attaching the pellicle (1) to the mask (2) in a chamber (6) in which the air inside is replaced with the inert gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1154293A JPH0318852A (en) | 1989-06-15 | 1989-06-15 | Method for sticking pellicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1154293A JPH0318852A (en) | 1989-06-15 | 1989-06-15 | Method for sticking pellicle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0318852A true JPH0318852A (en) | 1991-01-28 |
Family
ID=15580973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1154293A Pending JPH0318852A (en) | 1989-06-15 | 1989-06-15 | Method for sticking pellicle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0318852A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006030947A (en) * | 2004-07-16 | 2006-02-02 | Toppan Chunghwa Electronics Co Ltd | Method for cleaning semiconductor component and apparatus therefor |
KR100742176B1 (en) * | 2006-01-27 | 2007-07-24 | 주식회사 피케이엘 | Apparatus for adhering pellicle |
-
1989
- 1989-06-15 JP JP1154293A patent/JPH0318852A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006030947A (en) * | 2004-07-16 | 2006-02-02 | Toppan Chunghwa Electronics Co Ltd | Method for cleaning semiconductor component and apparatus therefor |
KR100742176B1 (en) * | 2006-01-27 | 2007-07-24 | 주식회사 피케이엘 | Apparatus for adhering pellicle |
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