JPH03180710A - Flatness measuring instrument for plate - Google Patents

Flatness measuring instrument for plate

Info

Publication number
JPH03180710A
JPH03180710A JP31965789A JP31965789A JPH03180710A JP H03180710 A JPH03180710 A JP H03180710A JP 31965789 A JP31965789 A JP 31965789A JP 31965789 A JP31965789 A JP 31965789A JP H03180710 A JPH03180710 A JP H03180710A
Authority
JP
Japan
Prior art keywords
plate
laser beam
flatness
light receiving
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31965789A
Other languages
Japanese (ja)
Other versions
JPH07117400B2 (en
Inventor
Akinobu Ogasawara
小笠原 昭宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SERUTETSUKU SYST KK
Original Assignee
SERUTETSUKU SYST KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SERUTETSUKU SYST KK filed Critical SERUTETSUKU SYST KK
Priority to JP1319657A priority Critical patent/JPH07117400B2/en
Publication of JPH03180710A publication Critical patent/JPH03180710A/en
Publication of JPH07117400B2 publication Critical patent/JPH07117400B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To measure the flatness of the plate for measuring an object to be measured without contacting by providing a polygon mirror, a photodetection part which receives scanning laser light from a steel plate, and a control part which processes signals from them. CONSTITUTION:An equation PA=x=l2/tan(omegat1) holds and is determined by omegat1, where l1 and l2 are the horizontal distances from the reflection position 0 of the polygon mirror 14 to photodetection parts 15 and 16, (h) the height, A and B measurement points on the steel plate right below the photodetection parts 15 and 16, omega the angle of scanning, and P and Q the positions right below the photodetection parts 15 and 16 at the height of the mirror 14. Then when the steel plate is plane, t0=(l/omega)arctan(l1/x) holds and is determined by t1. When, however, the top of the steel plate projects upward, a photodetection part 16 detects the laser light at a position B'. When this time is denoted as t2, delay is larger than at t0 and this delay time corresponds primarily to the flatness of the plate. Therefore, QB'=l1/tan(omegat2) holds and BB' equivalent to the flatness of the plate can be measured when the times t1 - t3 are known.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、鋼板、木板等の仮の平坦度を電気光学的に測
定する装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for electro-optically measuring the temporary flatness of steel plates, wooden plates, etc.

(従来の技術及びその問題点) 従来、コンベア上を搬送される板の平坦度を測定する場
合には、基準台上を搬送される板上に当接するローラを
配置し、その上下変位を作動トランス等によって測定し
て、平坦度を測定する方法があった。
(Prior art and its problems) Conventionally, when measuring the flatness of a plate conveyed on a conveyor, a roller is placed in contact with the plate conveyed on a reference table, and the vertical displacement is actuated. There is a method of measuring flatness using a transformer or the like.

しかしながら、上記機械的測定方法においては、機械的
に測定するので、ローラが磨耗するなどして測定精度が
悪いという問題点があった。
However, in the above-mentioned mechanical measurement method, since the measurement is performed mechanically, there is a problem that the measurement accuracy is poor due to wear of the rollers and the like.

また、板の表面に測定器具を1接させなければ板厚ある
いは平坦度を測定できないので、測定対象物によっては
実施できない場合があるという問題点があった。
Furthermore, since the thickness or flatness of the plate cannot be measured unless the measuring instrument is brought into contact with the surface of the plate, there is a problem in that it may not be possible depending on the object to be measured.

本発明は、このような事情に鑑みてなされたもので、レ
ーザー光を利用し、測定対象物に非接触で測定を行う板
の平坦度を測定する装置を提供することを目的とする。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an apparatus for measuring the flatness of a plate using a laser beam without contacting the object to be measured.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的に沿う請求の範囲第1項記載の板の平坦度測定
装置は、レーザー光を発振するレーザー光発信部と、該
レーザー光発信部からのレーザー光を反射して測定対象
物である板表面にスキャンさせて照射するスキャニング
部と、上記板表面からの反射レーザー光を受け、スキャ
ン方向に所定間隔で並設された受光部と、該並設された
受光部の信号時間差から板の平坦度を演算する制御部と
を有して構成されている。
The flatness measuring device for a plate according to claim 1, which meets the above object, comprises a laser beam transmitter that oscillates a laser beam, and a plate that is an object to be measured by reflecting the laser beam from the laser beam transmitter. A scanning section that scans and irradiates the surface, a light receiving section that receives reflected laser light from the surface of the board and is arranged in parallel at a predetermined interval in the scanning direction, and the flatness of the board is determined from the signal time difference between the parallel light receiving sections. The control unit is configured to include a control unit that calculates the degree.

また、請求の範囲第2項記載の板の平坦度測定装置は、
請求の範囲第1項記載の板の平坦度測定装置において、
レーザー光は高周波変調され、受光部は、受光レンズ、
スリット及びAPD等の受光素子を有して構成されてい
る。
Further, the plate flatness measuring device according to claim 2 includes:
In the plate flatness measuring device according to claim 1,
The laser beam is high-frequency modulated, and the light receiving section includes a light receiving lens,
It is configured with a light receiving element such as a slit and an APD.

〔作用及び実施例〕[Function and Examples]

続いて、添付した図面を参照しながら、本発明を具体化
した実施例につき説明し、本発明の作用を合わせて説明
する。
Next, embodiments embodying the present invention will be described with reference to the attached drawings, and the effects of the present invention will also be explained.

ここに、第1図は本発明の一実施例に係る板の平坦度測
定装置の概略構成を示す側面図、第2図は同正面図、第
3図は信号状態を示すグラフ、第4図は咳板の平坦度測
定装置の作用を説明するための線図である。
Here, FIG. 1 is a side view showing a schematic configuration of a plate flatness measuring device according to an embodiment of the present invention, FIG. 2 is a front view of the same, FIG. 3 is a graph showing signal status, and FIG. FIG. 2 is a diagram for explaining the operation of the cough plate flatness measuring device.

第1図、第2図に示すように、本発明の一実施例に係る
板の平坦度測定装置10は、変調されたレーザー光を発
振するレーザー光発振部11と、該レーザー光発振部1
1からのレーザー光を反射するミラー12と、スキャニ
ング部の一例であって上記レーザー光を測定対象物であ
る鋼板13の進行方向にスキャンさせるポリゴン逅う−
14と、調板13からのスキャンされたレーザー光を受
ける受光部15.16と、該受光部15.16からの信
号を処理する制御部17とを有して構成されている。
As shown in FIGS. 1 and 2, a plate flatness measuring device 10 according to an embodiment of the present invention includes a laser beam oscillation section 11 that oscillates a modulated laser beam, and a laser beam oscillation section 11 that oscillates a modulated laser beam.
A mirror 12 that reflects the laser beam from 1 and a polygon that is an example of a scanning section and that scans the laser beam in the traveling direction of the steel plate 13 that is the object to be measured.
14, a light receiving section 15.16 that receives the scanned laser beam from the control plate 13, and a control section 17 that processes the signal from the light receiving section 15.16.

上記レーザー光発振部11は半導体レーザーが使用され
、発振されるレーザー光を駆動電流によって高周波変調
している。なお、別に変調器を設けることも可能である
The laser beam oscillation section 11 uses a semiconductor laser, and high-frequency modulates the oscillated laser beam using a drive current. Note that it is also possible to provide a separate modulator.

そして、上記レーザー光発振部11の前方には通常のミ
ラー12が配置されてポリゴンミラー14に照射されて
いる。このポリゴンミラー14は多面体の鏡からなって
、モーターによって一定速度で回転駆動され、レーザー
光を鋼板13の進行方向(長さ方向)にスキャンさせる
ようになっている。
A normal mirror 12 is placed in front of the laser beam oscillation unit 11, and the polygon mirror 14 is irradiated with the laser beam. This polygon mirror 14 is made of a polyhedral mirror, and is driven to rotate at a constant speed by a motor, so as to scan the laser beam in the traveling direction (lengthwise direction) of the steel plate 13.

上記受光部15.16;よ夫々干◆フィルター18.1
9、集光レンズ20.21、ス”) y + 22.2
3及びAPD(アバランシェフォトダイオード)24.
25からなって、その光軸は平行かつ、鋼板13に対し
て垂直に配置されている。
The above light receiving section 15.16; dry ◆ filter 18.1
9. Condensing lens 20.21, S'') y + 22.2
3 and APD (avalanche photodiode) 24.
25, whose optical axes are parallel and perpendicular to the steel plate 13.

そして、これらの板の平坦度測定装置10が第2図に示
すように、鋼板13の板幅方向に5個並設されて測定部
26を構成し、その信号が制御部17に伝達されて、内
部に配置されるコンピュタ−によって処理されている。
As shown in FIG. 2, five of these plate flatness measuring devices 10 are arranged in parallel in the width direction of the steel plate 13 to form a measuring section 26, and the signal is transmitted to the control section 17. , is processed by a computer located inside.

なお、上記測定部26内に配置されている板の平坦度測
定装置10はその板幅に合わせて横方向にその取付は場
所を移動させるようにして置くことも可能である。
Note that the plate flatness measuring device 10 disposed in the measuring section 26 can be moved in a horizontal direction according to the width of the plate.

続いて、第3図及び第4図を参照しながら、本発明を具
体化した実施例の作用について説明するポリゴンミラー
14の反射位置Oから2個の受光部15.16の水平距
離を夫々Q+、lxとし、その高さをhとし、受光部1
5.16の直下の!′l板上0謂定点をA、Bとしスキ
ャンの角速度ωとすると、第4園5こ示すようにぶりボ
ンミラ−14−)高さにあって、上記受光部15.16
の直下の位置をPSQとすると、 ヱΔ−x=j!1/1an(ω1+)となって、(ω1
+)によって決定される。そして、鋼板が平面状であれ
ば、受光部16がレーザー光を検出する時間t0は t
++= (1/ ω) arctan(I I/x)と
なり、上記1+によって決定される。
Next, with reference to FIGS. 3 and 4, the horizontal distances of the two light receiving sections 15 and 16 from the reflection position O of the polygon mirror 14 will be described as Q+ , lx, its height is h, and the light receiving part 1
Directly below 5.16! If the so-called fixed points on the board are A and B, and the angular velocity of scanning is ω, then the light receiving section 15.
If the position immediately below is PSQ, ヱΔ−x=j! It becomes 1/1an(ω1+), and (ω1
+). If the steel plate is planar, the time t0 for the light receiving section 16 to detect the laser beam is t
++=(1/ω) arctan(I I/x), which is determined by the above 1+.

しかしながら、第4図に示すように鋼板の上が上部に突
出している場合、B′の位置にて受光部16をレーザー
光を検出することになり、この時間をt2とすると、t
oより遅れか進むことになり、この遅れ時間(場合によ
っては進み時間)が板の平坦度に一次的に対応すること
になる。
However, if the top of the steel plate protrudes upward as shown in FIG.
This delay time (advance time in some cases) corresponds primarily to the flatness of the plate.

従って、結果的には、 且に−ffi、/1an(ωtz) となり、ffi、
 、p2、ωは既知であるので、第3図に示すように原
点信号からの時間t、及びt2が判れば、以上の式の差
をとって、板の平坦度に相当する旦旦′が測定できる。
Therefore, the result is -ffi, /1an(ωtz), and ffi,
, p2, and ω are known, so if the time t and t2 from the origin signal are known as shown in Fig. 3, then by taking the difference between the above equations, dandan', which corresponds to the flatness of the plate, can be calculated. Can be measured.

ここで、ωが一定速度でない場合には補正する必要があ
る。
Here, if ω is not a constant speed, it is necessary to correct it.

なお、この実施例においては、第1図に示すように原点
信号を検出する受光素子27をポリゴンミラー14の直
下に設けたが、原点信号は基準となるものであるから、
その取付は位置は任意であり、更には、該ポリゴン旦う
−14を回転駆動するモーターにロークリエンコーダー
等を取付けて、その信号を原点とすることも可能である
In this embodiment, the light receiving element 27 for detecting the origin signal is provided directly below the polygon mirror 14 as shown in FIG. 1, but since the origin signal serves as a reference,
It can be attached at any position, and furthermore, it is also possible to attach a rotary encoder or the like to the motor that rotationally drives the polygon 14, and use the signal as the origin.

従って、上記の信号処理即ち演算処理を内部にマイクロ
コンピュータを備える制御部17で演算し、記録計28
に表示することになる。
Therefore, the above-mentioned signal processing, that is, arithmetic processing, is carried out by the control section 17 having an internal microcomputer, and the recorder 28
will be displayed on.

また、この実施例においては、レーザー光を高周波変調
しているので、この変調信号のみを検出することによっ
て、外乱光と信号光とを弁別することが容易となり、更
には、特定波長のみを通過させる干渉フィルター18.
19を使用しているので、鋼板から放射される光を遮断
することができる。
In addition, in this embodiment, since the laser light is high-frequency modulated, by detecting only this modulated signal, it is easy to distinguish between disturbance light and signal light, and furthermore, only a specific wavelength can be passed. Interference filter 18.
19, it is possible to block the light emitted from the steel plate.

更には、この実施例においては、受光部15.16がレ
ーザー光の正反射位置でない場所に配置されているので
、鋼板の表面状況及び傾きによる反射率の変化が小さく
、安定に板の平坦度を測定できる。
Furthermore, in this embodiment, since the light receiving parts 15 and 16 are arranged at a location other than the position where the laser beam is regularly reflected, changes in reflectance due to the surface condition and inclination of the steel plate are small, and the flatness of the plate can be stably maintained. can be measured.

なお、この実施例においては平坦度の割合をBB′にお
いて示しているが、他の方式による平坦度の定義であっ
ても本発明を適用することができる。また、上記ポリゴ
ンミラーの代わりに一定角度を回動する振動ミラーを使
用し、レーザー光をスキャンさせることも可能である。
In this embodiment, the flatness ratio is indicated by BB', but the present invention can be applied to other methods of defining flatness. Furthermore, it is also possible to use a vibrating mirror that rotates at a certain angle instead of the polygon mirror, and scan the laser beam.

〔発明の効果〕〔Effect of the invention〕

請求の範囲第1項または第2項記載の板の平坦度測定装
置によって、非接触にて板の平坦度を測定できることと
なった。
By using the plate flatness measuring device according to claim 1 or 2, the flatness of a plate can be measured in a non-contact manner.

特許請求の範囲第2項記載の板の平坦度測定装置におい
ては、レーザー光に高周波変調をかけているので、外乱
光によって誤動作を生しることなく安定に動作させるこ
とができる。
In the plate flatness measuring device according to claim 2, since the laser beam is subjected to high frequency modulation, it can operate stably without causing malfunctions due to disturbance light.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例に係る板の平坦度測定装置の
概略構成を示す側面図、第2図は同正面図、第3図は信
号状態を示すグラフ、第4図は該板の平坦度測定装置の
作用を説明するための線図である。 [符号の説明〕
FIG. 1 is a side view showing a schematic configuration of a flatness measuring device for a plate according to an embodiment of the present invention, FIG. 2 is a front view of the same, FIG. 3 is a graph showing signal status, and FIG. FIG. 3 is a diagram for explaining the operation of the flatness measuring device of FIG. [Explanation of symbols]

Claims (2)

【特許請求の範囲】[Claims] (1)レーザー光を発振するレーザー光発信部と、該レ
ーザー光発信部からのレーザー光を反射して測定対象物
である板表面にスキャンさせて照射するスキャニング部
と、上記板表面からの反射レーザー光を受け、スキャン
方向に所定間隔で並設された受光部と、該並設された受
光部の信号時間差から板の平坦度を演算する制御部とを
有してなることを特徴とする板の平坦度測定装置。
(1) A laser beam transmitting section that oscillates a laser beam, a scanning section that reflects the laser beam from the laser beam transmitting section and scans and irradiates it onto the plate surface that is the object to be measured, and a scanning section that reflects the laser beam from the laser beam transmitting section and scans and irradiates the plate surface that is the object to be measured. It is characterized by comprising light receiving sections that receive laser light and are arranged in parallel at predetermined intervals in the scanning direction, and a control section that calculates the flatness of the plate from the signal time difference of the parallel arranged light receiving sections. Board flatness measuring device.
(2)レーザー光は高周波変調され、受光部は、受光レ
ンズ、スリット及びAPD等の受光素子を有している請
求の範囲第1項記載の板の平坦度測定装置。
(2) The plate flatness measuring device according to claim 1, wherein the laser beam is high-frequency modulated, and the light receiving section has a light receiving element such as a light receiving lens, a slit, and an APD.
JP1319657A 1989-12-08 1989-12-08 Plate flatness measuring device Expired - Lifetime JPH07117400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1319657A JPH07117400B2 (en) 1989-12-08 1989-12-08 Plate flatness measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1319657A JPH07117400B2 (en) 1989-12-08 1989-12-08 Plate flatness measuring device

Publications (2)

Publication Number Publication Date
JPH03180710A true JPH03180710A (en) 1991-08-06
JPH07117400B2 JPH07117400B2 (en) 1995-12-18

Family

ID=18112746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1319657A Expired - Lifetime JPH07117400B2 (en) 1989-12-08 1989-12-08 Plate flatness measuring device

Country Status (1)

Country Link
JP (1) JPH07117400B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078248A (en) * 2010-10-04 2012-04-19 Renesas Electronics Corp Method for inspecting semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135906U (en) * 1986-02-19 1987-08-27
JPS62228106A (en) * 1985-12-03 1987-10-07 Yukio Sato Method and apparatus for measuring shape of three-dimensional object
JPH01282408A (en) * 1988-05-09 1989-11-14 Mitsubishi Electric Corp Film thickness measuring apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62228106A (en) * 1985-12-03 1987-10-07 Yukio Sato Method and apparatus for measuring shape of three-dimensional object
JPS62135906U (en) * 1986-02-19 1987-08-27
JPH01282408A (en) * 1988-05-09 1989-11-14 Mitsubishi Electric Corp Film thickness measuring apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078248A (en) * 2010-10-04 2012-04-19 Renesas Electronics Corp Method for inspecting semiconductor device
TWI464815B (en) * 2010-10-04 2014-12-11 Renesas Electronics Corp Inspection method of semiconductor device

Also Published As

Publication number Publication date
JPH07117400B2 (en) 1995-12-18

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