JPH03177092A - Method of manufacturing printed wiring board and manufacturing device - Google Patents

Abstract

PURPOSE:To facilitate the handling of a printed wiring board and prevent the generation of scratch on the surface by providing a slit on both sides of a discrete board, cutting the upper and lower parts of the discrete board, punching through the board, pushing back the discrete board back to the initial position, and cleaning the pushed back strip. CONSTITUTION:A pair of slits 2 are installed to both sides of a discrete board in terms of a strip 1 provided with a number of discrete board 3, 31, 32.... Then, the upper and lower parts of the discrete boards 3 are cut along a cut line 25 and the discrete boards are once punched through. Both punching work and slit 2 installation work are carried out, using a press machine. Then, the punched discrete boards 3 are returned to the original position again and pushed back from below as shown by arrow F. Similar processing is carried out for the adjacent board 31 and the adjoining board 32 as well. The strip 1 with each discrete board 3 thus pushed back is picked up from the press machine and packed in an arrayed state within a cleaning tray and cleaned therein.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed wiring board in which a printed wiring board is manufactured by punching out individual substrates from a strip having a large number of individual substrates such as a chip-on-board. The present invention relates to a manufacturing method and a manufacturing device.

[Prior art]

Conventionally, printed wiring boards are produced by cutting out strips 91 from a sheet-like substrate 9, as shown in FIG.

Furthermore, a large number of substrates 93 are manufactured by punching out individual substrates 93 from the strips 91. That is, the individual board 93 obtained in this manner is a printed wiring board.

The printed wiring board 93 includes conductor circuits 931. It has a through hole 932.

The strips 91 are conventionally separated into individual substrates 93 using a single manual press.

After that, the individual substrates 93 are processed.

They are piled up in transport containers such as trays and subjected to washing, drying, and other processing.

[Problem to be solved]

However, the above-mentioned prior art has the ninth problem.

That is, the nine pieces of substrates 93 are handled in a transport container such as a tray in a separate state. Therefore.

The individual substrates 93 come into contact with each other and are likely to have friction scratches or stains on their surfaces. Further, the work of taking out the individual substrates 93 one by one from the container is extremely complicated.

The present invention has been made in view of these conventional problems, and aims to provide a method and apparatus for manufacturing a printed wiring board, in which the printed wiring board is easy to handle and does not cause friction scratches on its surface. be.

[Means for Solving the Problems] The present application consists of a first invention relating to a method for manufacturing a printed wiring board, and a second invention relating to an apparatus for manufacturing a printed wiring board.

In the first invention, in a strip provided with a large number of individual substrates, one
A process of providing slits on both sides of each individual board, a process of cutting the top and bottom of each board and punching out the individual board, a process of pushing the punched individual board back to its original position, and then A method for manufacturing a printed wiring board, comprising the steps of cleaning a strip.

The most noteworthy thing about the first invention is:

Providing slits on both sides of the individual substrates in the strip, then cutting the upper and lower sides of the individual substrates and punching out the individual substrates,
Then, the individual substrate pieces are pushed back to their original positions, and the strips are cleaned in this state.

The above-mentioned individual boards include, for example, a rectangular glass epoxy substrate with a large number of individual printed wiring boards such as chimp-on-boards arranged side by side.

Further, the pushback refers to a process in which the individual substrates are cut and once punched out, and then returned to their original positions.

In addition, there is a method in which the above-mentioned slit forming process and punching push pack process are performed sequentially for each individual substrate as shown in the example, but slits are formed on a plurality or all of the individual substrates in a strip at once, and then - Punching pushback can also be performed at the same time.

The second invention is a slit punching machine for punching slits on both sides of individual substrates in a strip provided with a large number of individual substrates;
It is a cutting machine that cuts the top and bottom of each individual board and also pushes the cut individual board back to its original position.
The cutting machine includes an upper mold and a lower mold, and the lower mold has a cutting shedder that can move up and down, and an elastic support that supports the cutting shedder so that it can move up and down. It is in the board manufacturing equipment.

What is most noteworthy about the second invention is that the manufacturing device includes a slit puncher and a cutter.

The lower mold of the cutting machine is provided with a cutting shedder and an elastic support that can move up and down. Note that the above-mentioned lower mold does not mean only the lower mold, nor does the upper mold mean only the upper mold. Therefore, the positions of the upper mold and the lower mold can be reversed.

The above-mentioned slit punching machine is a device for punching slits on both sides of individual substrates in a strip having a large number of individual substrates.

Further, the cutting machine is a device that cuts the upper and lower parts of three pieces of the substrate, and also pushes the cut pieces of substrate back to their original positions.

And what are the above-mentioned slit punching machine and cutting machine?

It is preferable to install two devices 9, for example, a press machine, so that the slit drilling and cutting can be performed sequentially by one device (see Examples).

In addition, the meanings of the above-mentioned individual board and pushback are as follows.
This is similar to the invention of

[For production]

In the manufacturing method according to the first invention, slits are first provided on both sides of the individual substrates, and then the upper and lower sides of the individual substrates are cut to once punch out the individual substrates.

Next, the punched individual substrate pieces are pushed back to their original positions, and then the strips with the individual substrate pieces pushed back are subjected to cleaning.

On the other hand, a manufacturing apparatus according to a second invention is used for manufacturing the printed wiring board according to the first invention.

It is used as follows.

That is, when forming slits on both sides of the individual substrate, a slit forming machine is used to form the slits.

Further, a cutting machine is used to cut the upper and lower parts of the individual substrates and push them back to their original positions.

Thereafter, the strips obtained by pushing back the three pieces of the substrate are taken out from the cutting machine and cleaned. Therefore, a large number of individual substrates can be cleaned, dried, etc., and handled as one unit without making them come into contact with each other. Therefore, no friction scratches or the like occur on the surface of the individual substrate.

[Effects] As described above, according to the two aspects of the present invention, it is possible to provide a method and an apparatus for manufacturing a printed wiring board in which the printed wiring board is easy to handle and does not suffer from friction scratches or the like on its surface.

〔Example〕

First example Regarding the method for manufacturing a printed wiring board according to this example.

This will be explained using FIGS. 1A to 2.

That is, the manufacturing method of this example consists of the first step.

In the first step, as shown in FIG. 1A.

In a strip 1 provided with a large number of individual substrates 3, 31, 32..., slits 2, 2 are formed on both sides of the first individual substrate 3.
Provide a pair of

The individual substrate 3 is comprised of a substantially rectangular chip-on-board with a conductor circuit formed on one surface.

Further, the strip 1 is made of a glass epoxy substrate and has a large number of one-piece substrates (denoted by 9 in FIG. 10).
1.93).

In addition, the width of the slit 2 is approximately 0.0 mm of the substrate thickness. The length is 8 times or more and the length is the width of the cylinder piece substrate.

Next, in the second step, as shown in FIG. 1B,
The upper and lower sides of the individual substrates 3 are cut along the cutting line 25 and the individual substrates are once punched, whereby the individual substrates 3
A punched-out cavity 30 is formed in the area where is provided.

At the same time, slits 2.
2 will be provided.

The above-mentioned punching process and the process of providing the slit 2 are as follows: 1
This is done using a stand press machine (see Figures 3B to 5B).

Next, in the third step, as shown in FIG. 1C, the punched individual substrate 3 is pushed back to its original position from below F direction.

Next, using the first step and the third step, the adjacent individual substrates 31. Further, the next adjacent individual substrates 32 are also processed in the same manner.

Thereafter, as shown in FIG. 2, the strips 1 with each individual substrate 3 pushed back are taken out from the press processing machine, and packed in a box in a cleaning tray 5 in an aligned state.

Next, in the fourth step, the strip 1 is removed.

Cleaning is performed while the tray remains in the cleaning tray 5.

Next, the effects will be explained.

That is, in this example, the single piece substrate 3 is handled in a state where it is pushed back onto the strip 1. Moreover, such individual board 3
is in the cleaning tray 5.

A large number of individual substrates 3 are cleaned and dried in a state where they are lined up in a strip l, so that a large number of individual substrates 3 can be handled as one unit without contacting each other.

Therefore, according to the present example, it is possible to manufacture a printed wiring board that is easy to handle and that does not cause any friction scratches or the like on its surface.

Second example Regarding the printed wiring board manufacturing apparatus according to this example.

This will be explained using FIGS. 3A to 9.

That is, one example of the manufacturing apparatus is shown in FIGS. 3B and 4B.

As shown in FIG. 5B, slits 2 are formed on both sides of the nine-piece board 3.
The press processing machine 4 is made up of a slit punching machine 46 for punching a slit and a cutting 8I144 for cutting the top and bottom of a single piece of substrate 3 and pushing back the cut piece of substrate 3 to its original position.

The slit punch 46 includes two slit punches 461 and two punched holes 462. The slit punch 461 has a rectangular shape and is attached to the upper die 451. Further, the upper die 451 is connected to the punch plate 4
It is attached to the upper guide set 41 via 53.

Further, the punched hole 462 is provided so as to open in the lower mold 452 and the back plate 454 that supports the die 452. Further, the punched hole 462 has a hole in the upper part that is similar in shape to the slit punch 461, and has an even larger hole 463 in the lower part. The die 452 is attached to the guiscent 42 via the guiback plate 454.

Also, around the punched hole 461, a hanging bolt 4 is provided.
A stripper 455 supported by the upper mold 451 via 56 is disposed.

On the other hand, the cutting machine 44 includes an upper die 451 and a lower die 452. The lower die 452 is provided with a cutting shedder 442 and an elastic support 443 that are movable up and down. The cutting shedder 442 is disposed above the elastic support 443. Further, the elastic support body 443 is made of a polyurethane foam elastic body.

Further, a punch 441 for punching is disposed on the upper die 451.

Next, each effect will be explained.

That is, the manufacturing apparatus according to this example is used in the following five steps to manufacture printed wiring boards.

First, as shown in Figures 3A and 3B, the strip 1 is
It is transported to the slit punching machine 46 from this direction. Then, a pair of slits 2.2 are formed in the strip 1 on both sides of the first individual substrate 3 using the slit punch 461 of the slit forming machine. That is, the slit punch 461 descends to both sides of the single piece substrate 31 as shown in FIG. 3B. As a result, slits 2.2 are formed on both sides of one individual board 31. Then, the slit piece 21 falls below the punched hole 462.

Next, as shown in FIGS. 4A and 4B, the strip 1 is
It is moved from the direction to the position of the above-mentioned cutting @44 by one zero-piece substrate. Then, the punch 441 of the cutting 1144 that has descended is used to make slits 2 and 2 on both sides.
The upper and lower sides of the individual substrate 3 provided with are cut along cutting vA25 and the single substrate 3 is once punched out. At this time, the cutting shedder 442 and the elastic support 443 are lowered. Due to this.

The individual substrate 3 is once moved onto the cutting shedder 442.

At this time, in the individual substrate 31 adjacent to the individual substrate 3, a pair of slits 2.2 are simultaneously formed on both sides by the slit punch 461, as in the case of the individual substrate 3. Incidentally, the slit piece 21 falls below the punched hole 462, as shown in FIG. 4B.

Next, as shown in FIGS. 5A and 5B, the slit punch 461 of the cutting machine 44 is raised while the position of the strip 1 remains unchanged. As a result, the elastic support body 443 rises due to the elastic return operation upward H, and the cutting shedder 442 rises. As a result, the individual substrates 3 that have been punched out as described above are bushbanked to their original positions within the punched voids 30.

As described above, all the individual substrates 3.31 on the strip l
... is punched out - times and pushed back. Then, the strips 1 with all the individual substrates pushed back are arranged in a cleaning tray (see FIG. 2) and subjected to ultrasonic cleaning. As a result, a large number of individual substrates 3 are cleaned and dried as one body.

Further, after the strips 1 have been washed and dried, the individual substrates 3 are individually separated from the strips 1 one by one by a suction plate 6I and a pusher plate 62, as shown in FIGS. 6 to 8. and,
As shown in FIG. 9, the individual substrates 3 are moved onto the conveyor 7 by the suction plate 61 and then boxed into the tray.

Therefore, according to this example, it is possible to have the same effects as the first rear example and to improve work efficiency.

[Brief Description of the Drawings] Figures 1A to 2 show the strip according to the first embodiment, Figures 1A and 1B are its plan views, Figure 1C is its sectional view, and Figure 2 is a cleaning FIG. 3A is a perspective view showing a state in which a pushed-back strip is placed in a tray, and FIGS. 3A to 9 show a second embodiment; FIG. Figures 4 and 5A are plan views of the strips, Figures 3B, 4B, and 5B are cross-sectional views of the manufacturing equipment, and Figures 6 to 8 are states of individual separation of individual substrates by a suction machine. 9th side view showing
The figure is a side view showing the conveyance state of individual substrates, and FIG. 10 is a conventional manufacturing process diagram showing the procedure for manufacturing a printed wiring board by separating individual substrates from strips. l...Short side. 2...Slit. 3, 31. 32. 33 ・ ・ ・ Individual piece basic mutan. 30... Punching cavity 4... Pressing machine 44... Cutting machine. 441...Punch. 442... Cutting shedder 443... Elastic support. 451...upper mold. 452...lower mold. 46 ・・Slit drilling speculation. 461,. punch. Applicant Ivian Stock Figure 3B Figure 10

Claims (2)

[Claims] (1) In a strip with a large number of individual substrates, a process of providing slits on both sides of the individual substrates, a process of cutting the upper and lower sides of the individual substrates and punching out the individual substrates, and a process of punching out the individual substrates. A method for manufacturing a printed wiring board, comprising the steps of pushing the strip back to its original position, and then cleaning the strip. (2) A slit punching machine that punches slits on both sides of the individual substrates in a strip with a large number of individual substrates, and a slit punching machine that cuts the top and bottom of the individual substrates and returns the cut individual substrates to their original positions. It consists of a push-back cutting machine, and the cutting machine consists of an upper mold and a lower mold, and the lower mold has a cutting shedder that can move up and down, and an elastic support that supports the cutting shedder so that it can move up and down. A printed wiring board manufacturing device comprising: