JPH03177054A - Semiconductor device and its manufacture - Google Patents

Abstract

PURPOSE:To reduce product cost and retain reliability of the product by constituting a package case in one piece only by flux molded body of a powder glass and by enabling a lead to support it. CONSTITUTION:A package case 13 with a recessed area 13a which houses a semiconductor element C and a ridge part 13b which surrounds this recessed area 13a is constituted by a flux molded body made of powder glass. Then, a conductive ridge 12 is extended inside and outside the case 13 through the ridge part 13b of this package case 13 and the inner lead 12a at one edge side of this lead i2 is connected to the semiconductor C by exposing the upper surface from the surface of the recessed area 13a f the package case 13. Also, the outer lead 12b of the other edge side is extended toward the outside of the package case 13. Thus reducing adhesion of dust drastically and improving quality of the semiconductor device.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a semiconductor device equipped with an IC, an LSI, a photoelectric element, a crystal resonator, etc., and particularly relates to an improvement in the package structure of a semiconductor device and its manufacturing method. It is.

(Prior Art) As a conventional semiconductor device, one shown in FIG. 4, for example, is known. This involves placing an island 2 on which a semiconductor element C is mounted and an inner lead 3 on a ceramic substrate 1, placing a ceramic ring 4 on top of the island, and bonding these together with a low-melting glass 5. It has been integrated by

(Problems to be Solved by the Invention) In the conventional semiconductor device as described above, the ceramic substrate 1 and ring 4 are relatively expensive and account for a relatively large portion of the product price. Further, since these ceramic parts have undergone processing such as cutting and polishing, dust may adhere thereto, which poses a problem in that this may adversely affect the electrical characteristics of the semiconductor.

Therefore, it is an object of the present invention to provide a highly reliable, low-cost semiconductor device that does not use ceramic parts, and a method for manufacturing the same.

(! [Means for solving Wi) In the present invention, the recess 13a for accommodating the semiconductor element C
A package case 13 having a ridge 1'3b surrounding this recess 13a is made of a molten molded powder glass, and conductive material penetrates through the ridge 13b of the package case 13 to the inside and outside of the case 13. The inner lead 12a at one end of the lead 12 has its upper surface exposed from the surface of the recess 13a of the package case 13 so that it can be connected to the semiconductor element C, and the outer lead 12b at the other end is extended. A semiconductor device was constructed by extending to the outside of the package case 13.

(Function) In the present invention, the package case 1 is manufactured using only a melt-molded powder glass body, without using ceramic parts that are relatively expensive and highly likely to attract dust.
3 is integrally configured to support the lead 12, the product cost is reduced, and the reliability of the product is improved.
It is equivalent to or better than those using ceramic parts.

(Example) Examples of the present invention are shown in FIGS. 1 to 3. Figure 1 is a perspective view of the semiconductor device, Figure 2 is a sectional view of the semiconductor device, and Figure 3 is a cross-sectional view of the semiconductor device.
The figure is a cross-sectional view of a semiconductor device showing the manufacturing process.

1 to 3, 11 is a conductive island, 12 is a conductive lead, and 13 is an island 11.
and a package case for sealing the leads 12.

The package case 13 is made of a molten molded product of powdered glass, has a recess 13a in the center for accommodating a semiconductor element C such as an IC chip, a photoelectric element, a crystal resonator, etc., and surrounds the recess 13a. It includes a ridge portion 13b.

The lead 12 penetrates the ridge 13b of the package case 13 and extends in and out of the case 13.

The inner lead 12a located in the recess 13a of the package case 13 is connected to the semiconductor element C.
The upper surface is exposed from the surface of the recess 13a. Further, the outer lead 12b on the other end side of the lead 12 extends to the outside of the package case 13.

As shown in FIG. 2, the recess 13 of the package case 13
In a, a semiconductor element C is mounted on the upper surface of the island 11 and connected to the inner lead 12a by a wire 14.

The manufacturing process of this semiconductor device is shown in FIG. 3. In this process, the leads 12 are not bent but extend straight. In FIG. 3, the package case 13 is
and a molding space C1 formed by four molds: the second frames 21 and 22, and the first and second plungers 23 and 24;
Within C2.

Molded and molded as one piece of glass.

That is, the first frame 21 is ring-shaped and has a space for defining the side surface of the package case 13 below the inner lead 12a.

The second frame 22 is also ring-shaped and is joined to the first frame 21 with the outer lead 12b sandwiched between them. The frame body 22 has a space for defining a side surface above the inner leads 12a of the package case 13.

The first plunger 23 is slidably inserted into the space of the first frame 21, and within the space of the first frame 21,
A first molding space C1 is formed in cooperation with the first frame 21 to form a portion of the package case 13 below the inner leads 12a.

The second plunger 24 is inserted into the space of the second frame 22 and works in cooperation with the second frame 22 to move above the lead 12 of the package case 13. , that is, a second molding space C2 for molding the ridge portion 13b.

As shown in FIG. 3A, the outer lead 12b is sandwiched between the first frame 21 and the second frame 22, and the island 11 and the inner lead are placed above the second plunger 24. 12a, the temporarily sintered powder glass body 13' is inserted into the first molding space C1 and heated in a furnace. Then, as shown in FIG. 3B, the temporarily sintered body 13' of powdered glass is melted, and the plunger 23 in the first molding space C1 is lowered to a predetermined position. Then.

The molten glass is pushed out into the second molding space through the mutual gap between the inner leads 12a, and the first and second molding spaces C1 and C2 are filled with the molten glass 13'. Then, the molten glass 1 is placed in the first and second molding spaces C1 and C2.
3' is cooled and solidified to form a package case 13.

In this way, by the package case 13.

The island 11 and the leads 12 are integrally supported, and the upper surface of the island 11 and the inner leads 12a are exposed within the recess 13a of the package case 13.

Note that, if necessary, a metal ring 15 made of iron, Kovar, or the like can be placed on the second plunger 24 and heat-treated at the same time, and this can be integrally attached to the upper surface of the ridge 13b of the package case 13.

In this case, as shown in FIG.
A metal cover 16 can be welded to the top surface of 5.

Furthermore, the cover 16 can be bonded with low melting point glass without using the metal ring 15. In this case, the cover 16 is not limited to metal.

In the illustrated embodiment, the temporarily sintered body 13' of powder glass is inserted into the first molding space C1 and the first plunger 23 is moved, but the powder glass is inserted into the second molding space C2. The second plunger 24 may be moved by inserting the temporary sintered body 13'.

(Effects of the Invention) As described above, in the present invention, the package case 13 having the recess 13a for accommodating the semiconductor element C and the ridge 13b surrounding the recess 13a is made of a powder glass molded body, The conductive lead 12 extends inside and outside the case 13 by penetrating the ridge 13b of the package case 13, and the inner lead 12a at one end of the lead 12 has its upper surface exposed from the surface of the recess 13a of the package case 13. Since the semiconductor device is constructed by extending the outer lead 12b at the other end to the outside of the package case 13, no ceramic parts are used, and powdered glass is not used in the manufacturing process. Since it is melted and then solidified, the adhesion of dust is greatly reduced.
This has the effect that the quality of the semiconductor device can be improved and, moreover, the semiconductor device can be provided at a low price.

[Brief explanation of drawings]

1 to 3 show embodiments of the present invention.
FIG. 2 is a perspective view of the semiconductor device, FIG. 2 is a cross-sectional view of the semiconductor device, and FIG. 3 is a cross-sectional view showing the manufacturing process of the semiconductor device.
FIG. 4 is a sectional view of a conventional semiconductor device. 11...Island, 12...Lead, 12a...
・Inner lead, 12b...Outer lead, 13
...Package case, 13'...Powder glass pre-sintered body, 13a...Recess, 13b...Ridge, 14...
Wire, 15... Metal ring, 16... Cover,
21... first frame body, 22... second frame body, 23.
...first plunger, 24...second plunger,
C1...first molding space, C2...second molding space, C...semiconductor element. Figure 4 C... Semiconductor element Figure 1 Figure 2 15. 13)- 2- +2b-

Claims (2)

[Claims] (1) A package case made of a molten molded powdered glass having a recess for accommodating a semiconductor element and a ridge surrounding the recess, and a conductor that penetrates the ridge of the package case and extends into and out of the case. 1. A semiconductor device, characterized in that the lead has one end located within a recess of the package case, and the upper surface of the lead is exposed from the surface of the recess for connection to a semiconductor element. (2) a first frame provided with a space for defining a side surface below the leads of the package case; and the first frame are joined to each other with the outer leads sandwiched therebetween; a second frame provided with a space for defining a side surface above the leads of the package case; and a second frame that is slidably inserted into the space of the first frame, and that is slidably inserted into the space of the first frame. a first plunger that cooperates with a first frame to form a first molding space for molding a portion of the package case below the leads; a second molding space that is inserted into the second frame and cooperates with the second frame to form a second molding space for forming a portion of the package case above the leads; Using a plunger, with the outer lead sandwiched between the first frame and the second frame, a temporary powder glass is placed in either the first or second molding space. A sintered body is inserted, the temporary sintered body of powdered glass is melted in a heating furnace, and the plunger in the one molding space is moved to a predetermined position, thereby causing the molten glass to pass through the mutual gap between the leads. A method of manufacturing a semiconductor device, comprising extruding the molten glass into the other molding space and cooling and solidifying the molten glass in the first and second molding spaces to form a package case.