JPH0317667U - - Google Patents
Info
- Publication number
- JPH0317667U JPH0317667U JP7895389U JP7895389U JPH0317667U JP H0317667 U JPH0317667 U JP H0317667U JP 7895389 U JP7895389 U JP 7895389U JP 7895389 U JP7895389 U JP 7895389U JP H0317667 U JPH0317667 U JP H0317667U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- land
- pits
- shrink
- whole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す構成図、第２
図は従来のシユリンクピツチ用ランドの構成図で
ある。
図中、２０は基板、３０は半田、４０はリード
、５０はランド、５１はリード穴である。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is a configuration diagram of a conventional shrink pitch land. In the figure, 20 is a substrate, 30 is solder, 40 is a lead, 50 is a land, and 51 is a lead hole.
Claims (1)
全体を菱型に形成してなることを特徴とするシユ
リンクピツチ用ランド。 It has a lead hole 51 for lead penetration in the center,
A land for shrink pits that is characterized by being formed into a diamond shape as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7895389U JPH0317667U (en) | 1989-07-04 | 1989-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7895389U JPH0317667U (en) | 1989-07-04 | 1989-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317667U true JPH0317667U (en) | 1991-02-21 |
Family
ID=31622683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7895389U Pending JPH0317667U (en) | 1989-07-04 | 1989-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317667U (en) |
-
1989
- 1989-07-04 JP JP7895389U patent/JPH0317667U/ja active Pending
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