JPH0381290U - - Google Patents
Info
- Publication number
- JPH0381290U JPH0381290U JP14295189U JP14295189U JPH0381290U JP H0381290 U JPH0381290 U JP H0381290U JP 14295189 U JP14295189 U JP 14295189U JP 14295189 U JP14295189 U JP 14295189U JP H0381290 U JPH0381290 U JP H0381290U
- Authority
- JP
- Japan
- Prior art keywords
- flux
- holes
- solder wire
- filled
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図Ａは本考案の一実施例を示す説明図、第
１図Ｂは第１図Ａにおけるｂ−ｂ断面図、第２図
Ａは本考案の別実施例を示す説明図、第２図Ｂは
第２図Ａにおけるｂ−ｂ断面図、第３図Ａは本考
案の他の別実施例を示す説明図、第３図Ｂは第３
図Ａにおけるｂ−ｂ断面図、第４図並びに第５図
はそれぞれ従来例を示す説明図である。
１……半田線、２……貫通横穴、３……フラツ
クス。
FIG. 1A is an explanatory diagram showing one embodiment of the present invention, FIG. 1B is a sectional view taken along line bb in FIG. 1A, and FIG. Figure B is a sectional view taken along line bb in Figure 2A, Figure 3A is an explanatory diagram showing another embodiment of the present invention, and Figure 3B is a cross-sectional view taken along line bb in Figure 2A.
The bb sectional view in FIG. A, FIGS. 4 and 5 are explanatory diagrams showing conventional examples, respectively. 1...Solder wire, 2...Through horizontal hole, 3...Flux.
Claims (1)
の間隔ごとに貫通横穴を設け、該横穴にフラツク
スを充填したことを特徴とするフラツクス付半田
細線。 A thin solder wire with flux, characterized in that a solder wire having a diameter or thickness of 0.5 mm or less is provided with through holes at predetermined intervals, and the holes are filled with flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14295189U JPH0381290U (en) | 1989-12-11 | 1989-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14295189U JPH0381290U (en) | 1989-12-11 | 1989-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381290U true JPH0381290U (en) | 1991-08-20 |
Family
ID=31689755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14295189U Pending JPH0381290U (en) | 1989-12-11 | 1989-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381290U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522855A (en) * | 1975-06-24 | 1977-01-10 | Nippon Intaanashiyonaru Seiriy | Solder plate using solidified flux |
-
1989
- 1989-12-11 JP JP14295189U patent/JPH0381290U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522855A (en) * | 1975-06-24 | 1977-01-10 | Nippon Intaanashiyonaru Seiriy | Solder plate using solidified flux |