JPH0262735U - - Google Patents
Info
- Publication number
- JPH0262735U JPH0262735U JP14127088U JP14127088U JPH0262735U JP H0262735 U JPH0262735 U JP H0262735U JP 14127088 U JP14127088 U JP 14127088U JP 14127088 U JP14127088 U JP 14127088U JP H0262735 U JPH0262735 U JP H0262735U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- groove
- hole
- round bar
- bar lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体装置の第１の実施例の
正面図と側面図、第２図は本考案の半導体装置の
第２の実施例の正面図と側面図、第３図は従来例
の正面図と側面図である。
１……丸棒リード、２……電極部、３……半導
体装置ケース、４……ロー材、５……角型穴、６
……半円型溝。
1 is a front view and a side view of a first embodiment of a semiconductor device of the present invention, FIG. 2 is a front view and a side view of a second embodiment of a semiconductor device of the present invention, and FIG. 3 is a conventional example. FIG. 2 is a front view and a side view. 1... Round bar lead, 2... Electrode part, 3... Semiconductor device case, 4... Brazing material, 5... Square hole, 6
...Semicircular groove.
Claims (1)
体装置ケースに丸棒リードが入る穴または溝が形
成され、該穴または該溝の上に半導体装置ケース
電極部が形成され、該電極部が形成された該穴ま
たは該溝の中に丸棒リードが挿入され、ロー材に
より接着されていることを特徴とする半導体装置
。 In a semiconductor device having a round bar lead, a hole or a groove into which the round bar lead is inserted is formed in the semiconductor device case, an electrode part of the semiconductor device case is formed on the hole or the groove, and the semiconductor device case has a hole or a groove in which the round bar lead is inserted. A semiconductor device characterized in that a round bar lead is inserted into the hole or the groove and is bonded with brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127088U JPH0262735U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127088U JPH0262735U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262735U true JPH0262735U (en) | 1990-05-10 |
Family
ID=31406198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14127088U Pending JPH0262735U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262735U (en) |
-
1988
- 1988-10-28 JP JP14127088U patent/JPH0262735U/ja active Pending