JPH0317644U - - Google Patents
Info
- Publication number
- JPH0317644U JPH0317644U JP7806389U JP7806389U JPH0317644U JP H0317644 U JPH0317644 U JP H0317644U JP 7806389 U JP7806389 U JP 7806389U JP 7806389 U JP7806389 U JP 7806389U JP H0317644 U JPH0317644 U JP H0317644U
- Authority
- JP
- Japan
- Prior art keywords
- area
- integrated circuit
- planar
- resin
- stepped portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078063U JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078063U JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0317644U true JPH0317644U (sl) | 1991-02-21 |
| JP2503360Y2 JP2503360Y2 (ja) | 1996-06-26 |
Family
ID=31621009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989078063U Expired - Lifetime JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503360Y2 (sl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294132A (ja) * | 2007-05-23 | 2008-12-04 | Denso Corp | モールドパッケージおよびその製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04140717A (ja) * | 1990-10-01 | 1992-05-14 | Semiconductor Energy Lab Co Ltd | 液晶装置 |
| US7202497B2 (en) | 1997-11-27 | 2007-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189659A (ja) * | 1983-04-13 | 1984-10-27 | Matsushita Electronics Corp | 半導体装置 |
| JPS6045447U (ja) * | 1983-09-07 | 1985-03-30 | 日本電気株式会社 | 半導体装置 |
-
1989
- 1989-06-30 JP JP1989078063U patent/JP2503360Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189659A (ja) * | 1983-04-13 | 1984-10-27 | Matsushita Electronics Corp | 半導体装置 |
| JPS6045447U (ja) * | 1983-09-07 | 1985-03-30 | 日本電気株式会社 | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294132A (ja) * | 2007-05-23 | 2008-12-04 | Denso Corp | モールドパッケージおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2503360Y2 (ja) | 1996-06-26 |