JPH03176135A - Metal laminated plate - Google Patents
Metal laminated plateInfo
- Publication number
- JPH03176135A JPH03176135A JP31724989A JP31724989A JPH03176135A JP H03176135 A JPH03176135 A JP H03176135A JP 31724989 A JP31724989 A JP 31724989A JP 31724989 A JP31724989 A JP 31724989A JP H03176135 A JPH03176135 A JP H03176135A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- parts
- hydrocarbon group
- weight
- tables
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- -1 phosphite compound Chemical class 0.000 claims abstract description 33
- 229920001225 polyester resin Polymers 0.000 claims abstract description 18
- 239000004645 polyester resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000011342 resin composition Substances 0.000 claims abstract description 14
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 13
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 13
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 23
- 230000001070 adhesive effect Effects 0.000 abstract description 23
- 238000010422 painting Methods 0.000 abstract description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 30
- 239000002253 acid Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 4
- 230000000573 anti-seizure effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229920001634 Copolyester Polymers 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- ZEBMSMUPGIOANU-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl)methylphosphonic acid Chemical compound CC(C)(C)C1=CC(CP(O)(O)=O)=CC(C(C)(C)C)=C1O ZEBMSMUPGIOANU-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- PHQBTXISHUNQQN-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C(C(C(O)(C1=CC=CC=C1)CCCCCCCCC)(CO)CO)O Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C(C(C(O)(C1=CC=CC=C1)CCCCCCCCC)(CO)CO)O PHQBTXISHUNQQN-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical class O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 150000003752 zinc compounds Chemical class 0.000 description 2
- JKQOXZANUWHVLY-UHFFFAOYSA-N (3,5-ditert-butyl-2-hydroxyphenyl) propanoate Chemical compound CCC(=O)OC1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1O JKQOXZANUWHVLY-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- XZZWOTQMUOIIFX-UHFFFAOYSA-N 1-(2-diphenoxyphosphanyloxypropoxy)propan-2-yl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC(C)COCC(C)OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 XZZWOTQMUOIIFX-UHFFFAOYSA-N 0.000 description 1
- JRWPLQWFQKAMMF-UHFFFAOYSA-N 1-(3,5-ditert-butyl-4-hydroxyphenyl)pentan-3-one Chemical compound CCC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 JRWPLQWFQKAMMF-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- BGWNOSDEHSHFFI-UHFFFAOYSA-N 2-tert-butyl-4-[(3-tert-butyl-4-hydroxy-5-methylphenyl)methylsulfanylmethyl]-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CSCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 BGWNOSDEHSHFFI-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- YLUZWKKWWSCRSR-UHFFFAOYSA-N 3,9-bis(8-methylnonoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCC(C)C)OCC21COP(OCCCCCCCC(C)C)OC2 YLUZWKKWWSCRSR-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- RDIGYBZNNOGMHU-UHFFFAOYSA-N 3-amino-2,4,5-tris(oxiran-2-ylmethyl)phenol Chemical compound OC1=CC(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 RDIGYBZNNOGMHU-UHFFFAOYSA-N 0.000 description 1
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Chemical class 0.000 description 1
- SKRALMNYARGBGK-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCCCCC)C(O)(C(CO)(CO)CO)CCCCCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCCCCC)C(O)(C(CO)(CO)CO)CCCCCCCCCCCC SKRALMNYARGBGK-UHFFFAOYSA-N 0.000 description 1
- LZNWGSIDNAGRAJ-UHFFFAOYSA-N P(O)(O)OC(C(C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(CCCCCCCCCCCCC)C1=CC=CC=C1 Chemical compound P(O)(O)OC(C(C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)C(OP(O)O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(CCCCCCCCCCCCC)C1=CC=CC=C1 LZNWGSIDNAGRAJ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical class CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- GLOQRSIADGSLRX-UHFFFAOYSA-N decyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCC)OC1=CC=CC=C1 GLOQRSIADGSLRX-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- OGVJEUDMQQIAPV-UHFFFAOYSA-N diphenyl tridecyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCCCCC)OC1=CC=CC=C1 OGVJEUDMQQIAPV-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 1
- YOURXVGYNVXQKT-UHFFFAOYSA-N oxacycloundecane-2,11-dione Chemical compound O=C1CCCCCCCCC(=O)O1 YOURXVGYNVXQKT-UHFFFAOYSA-N 0.000 description 1
- UHHKSVZZTYJVEG-UHFFFAOYSA-N oxepane Chemical compound C1CCCOCC1 UHHKSVZZTYJVEG-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003503 terephthalic acid derivatives Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- DECPGQLXYYCNEZ-UHFFFAOYSA-N tris(6-methylheptyl) phosphite Chemical compound CC(C)CCCCCOP(OCCCCCC(C)C)OCCCCCC(C)C DECPGQLXYYCNEZ-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- PEXOFOFLXOCMDX-UHFFFAOYSA-N tritridecyl phosphite Chemical compound CCCCCCCCCCCCCOP(OCCCCCCCCCCCCC)OCCCCCCCCCCCCC PEXOFOFLXOCMDX-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は金属板間の接着力が高く、折り曲げや深絞りな
どの成形加工に耐え、焼付は塗装時の加熱による接着力
の低下がなく、高温で使用した際に長期間にわたって高
い接着力を保持し耐久性に優れた金i積層板に関するも
のである。[Detailed Description of the Invention] [Industrial Application Field] The present invention has high adhesive strength between metal plates, can withstand forming processes such as bending and deep drawing, and does not reduce adhesive strength due to baking due to heating during painting. This invention relates to a gold-i laminate that maintains high adhesive strength over a long period of time and has excellent durability when used at high temperatures.
[従来の技術]
2枚の金属板の間に樹脂層をはさんでなる金属積層板は
、制振鋼板や軽量鋼板として近年その利用が増えている
。特に最近は焼付は塗装が施されたり使用環境が多様化
するなるなどし、耐焼付は塗装性や、高温下で長期使用
に耐える耐久性に優れたものが要求されている。[Prior Art] Metal laminates, which are made by sandwiching a resin layer between two metal plates, have been increasingly used in recent years as vibration-damping steel plates and lightweight steel plates. Particularly recently, as anti-seizure products have become coated and the environments in which they are used have become more diverse, there is a demand for anti-seizure products that have excellent paintability and durability that can withstand long-term use at high temperatures.
このような金属積層板に飽和共凰合ポリエステルと多価
インシアネート化合物からなる樹脂組成物を用いる技術
が特開昭84−48813号公報に、また熱可旦性飽和
ポリエステル樹脂にインシアネート化合物、エポキシ化
合物、酸無水物などの架橋剤を配合してなる組!lt物
を用いる技術が特開昭64−89f385号公報に開示
されている。JP-A-84-48813 discloses a technique for using a resin composition consisting of a saturated co-fermented polyester and a polyvalent incyanate compound for such a metal laminate, and a technique for using an incyanate compound and an incyanate compound for a thermoplastic saturated polyester resin. A combination of crosslinking agents such as epoxy compounds and acid anhydrides! A technique using lt products is disclosed in Japanese Patent Laid-Open No. 64-89F385.
〔発明が解決しようとする課M]
上記特開昭84−48813号公報あるいは特開昭84
−E19E385号公報に開示された樹脂組成物を樹脂
層として使用した金属積層板は、金属板間の接着力が高
く、折り曲げや深絞りなどの成形加工に耐えるものであ
るが、焼付は塗装時の接着力保持性や、高温下での長期
使用における耐久性において不十分であり、自動車部材
などを含む使用環境の厳しい用途に用いるには、その性
能が満足ではない。[Problem M to be solved by the invention] The above-mentioned JP-A-84-48813 or JP-A-84
- Metal laminates using the resin composition disclosed in Publication E19E385 as a resin layer have high adhesive strength between metal plates and can withstand forming processes such as bending and deep drawing, but baking occurs during painting. It is insufficient in adhesive strength retention and durability in long-term use at high temperatures, and its performance is not satisfactory for use in harsh environments including automobile parts.
[課題を解決するための手段]
本発明者らは上記課題を解決すべく、金属板間の接着力
が高く、焼付は塗装時の接着力低下がなく、高温下での
長期使用においても初期の高い接着力を有する金属積層
板について鋭意検討を重ねた結果、本発明に至った。[Means for Solving the Problems] In order to solve the above problems, the present inventors have found that the adhesive strength between metal plates is high, there is no decrease in adhesive strength during painting, and there is no decrease in adhesive strength during baking, and even after long-term use at high temperatures, the adhesive strength between metal plates is high. As a result of extensive research into metal laminates with high adhesive strength, the present invention was achieved.
すなわち本発明は、2枚の金a Viの間に樹脂層をは
さんでなる金属種1仮において、前記樹脂層が非晶性共
重合ポリエステル樹脂(A)100重量部と、ポリイソ
シアネート化合物、ポリエポキシ化合物および酸無水物
から選ばれる少なくとも1種の化合物(B)0.5〜2
0!を1部と、下記一般式(I)、 (II)あるいは
(iff)で示されるホスファイト系化合物(C)0.
05〜5重量部とを混合して得られる樹脂組成物から構
成されることを特徴とする金属積層板に関するものであ
る。That is, in the present invention, in a metal species 1 consisting of a resin layer sandwiched between two pieces of gold a Vi, the resin layer contains 100 parts by weight of an amorphous copolymerized polyester resin (A), a polyisocyanate compound, At least one compound (B) selected from polyepoxy compounds and acid anhydrides 0.5 to 2
0! and 0.0 parts of a phosphite compound (C) represented by the following general formula (I), (II) or (iff).
The present invention relates to a metal laminate comprising a resin composition obtained by mixing 0.05 to 5 parts by weight.
(ただしR1,RI′、R1″は炭素数1〜18の炭化
水素基、あるいは分子鎖中に−COO−1−C0NH−
結合を有する炭素数1〜23の炭化水素基を表わし、そ
れぞれ同一であっても異なっていてもよい、mは1〜4
の整数である。)前記樹脂組成物に、さらに下記一般式
1/)で示されるヒンダードフェノール系化合物(D)
を前記一般式(I)、 (+[)あるいは(lit)で
示されるホスファイト系化合物(C)と同様の割合をも
って添加した樹脂組成物を用いた金i積層板は、なお−
層卓抜した焼付は塗装時の接着力保持性と、高温下で使
用した場合の耐久性を有する。(However, R1, RI', and R1'' are hydrocarbon groups having 1 to 18 carbon atoms, or -COO-1-C0NH-
Represents a hydrocarbon group having a bond of 1 to 23 carbon atoms, each of which may be the same or different, m is 1 to 4
is an integer. ) A hindered phenol compound (D) represented by the following general formula 1/) is further added to the resin composition.
A gold i laminate using a resin composition to which is added in the same proportion as the phosphite compound (C) represented by the above general formula (I), (+[) or (lit), still has -
The outstanding baking properties provide excellent adhesion retention during painting and durability when used at high temperatures.
(ただしR2は炭素数1〜18のアルキル基であり、R
2’はR2と同様のアルキル基であってR2と同一であ
ってもよい、R3は単結合、炭素数1〜18の炭化水素
基あるいは分子鎖中に−COO−−CONH−1−〇−
μ−〇−結合のいずれかをRz
有する炭素数l〜1日の炭化水素基であり、XはC,S
、炭素数1〜1日の炭化水素基あるいはδ
本発明で使用される非晶性共重合ポリエステル)M脂(
A)とは、例えばDSCによるpへ分析において結晶部
による明確な融解吸熱ピークを有しないポリエステル樹
脂をさすものである。このようなポリエステルはグリコ
ール成分と二塩基酸成分から合成される。場合によって
は少量の三価以上のポリカルボン酸及び/あるいは三価
以上のポリオールを共重合することも可能である。(However, R2 is an alkyl group having 1 to 18 carbon atoms, and R
2' is an alkyl group similar to R2 and may be the same as R2, R3 is a single bond, a hydrocarbon group having 1 to 18 carbon atoms, or -COO--CONH-1-〇- in the molecular chain.
A hydrocarbon group having a carbon number of 1 to 1 and having any of the μ-〇-bonds, and X is C, S
, a hydrocarbon group having 1 to 1 carbon atoms or δ Amorphous copolymerized polyester used in the present invention) M resin (
A) refers to a polyester resin that does not have a clear melting endothermic peak due to crystalline parts in p analysis by DSC, for example. Such polyesters are synthesized from glycol components and dibasic acid components. In some cases, it is also possible to copolymerize a small amount of trivalent or higher polycarboxylic acid and/or trivalent or higher polyol.
グリコール成分としては、エチレングリコール、プロピ
レングリコール、 1,4−ブタンジオール、1、 5
−ベンタンジオール、 1.6−ヘキサンジオール、ジ
エチレングリコール、ネオペンチルグリコールのごとき
脂肪族グリコール、 1. 4−シクロヘキサンジメタ
ツールのごとき脂環族グリコール、ビスフェノールAの
エチレンオキサイドあるいはプロピレンオキサイド付加
物のごとき芳香族グリコール、ポリ(エチレンオキシド
)グリコール、ポリ(プロピレンオキシド)グリコール
、ポリ(テトラメチレンオキシド)グリコール、ポリ(
ヘキサメチレンオキシド)グリコール、エチレンオキシ
ドとプロピレンオキシドのブロックまたはランダム共重
合体、エチレンオキシドとテトラヒドロフランのブロッ
クまたtよランダム共重合体のごときポリ(アルキレン
オキシド)グリコール、ポリ−ε−カプロラクトン、ポ
リエチレンアジペート、ポリブチレンアジペートのごと
き脂肪族ポリエステルグリコールなどを挙げることがで
きる。これらの中から1種または2種以上を選んで使用
するが、これらの中でもエチレングリコール及び/また
はネオペンチルグリコールを必須成分として用いること
が好ましい。Glycol components include ethylene glycol, propylene glycol, 1,4-butanediol, 1,5
- aliphatic glycols such as bentanediol, 1,6-hexanediol, diethylene glycol, neopentyl glycol, 1. Alicyclic glycols such as 4-cyclohexane dimetatool, aromatic glycols such as ethylene oxide or propylene oxide adducts of bisphenol A, poly(ethylene oxide) glycol, poly(propylene oxide) glycol, poly(tetramethylene oxide) glycol, Poly (
Poly(alkylene oxide) glycols such as hexamethylene oxide) glycols, block or random copolymers of ethylene oxide and propylene oxide, block or random copolymers of ethylene oxide and tetrahydrofuran, poly-ε-caprolactone, polyethylene adipate, polybutylene Examples include aliphatic polyester glycols such as adipate. One or more of these may be selected and used, and among these, it is preferable to use ethylene glycol and/or neopentyl glycol as an essential component.
二塩基酸成分としては、テレフタル酸、イソフタル酸、
オルトフタル酸、2.e−ナフタレンジカルボン?iL
4. 4 −ジフェニルジカルボンのごとき芳香族
二塩基酸、水添テレフタル酸のごとき脂環族二塩基酸、
コハク酸、グルタル酸、アジピン酸、 ピメリン酸、
スペリン酸、 アゼライン酸、セバシン酸、 ドデカン
ジオン酸、ブラシリック酸、ダイマー酸のごとと脂肪族
二塩基酸などを挙げることガできる。低級アルキルエス
テルになっているものの使用も可能である。これらの中
から111または2種以上を選んで使用するが、これら
の中でもテレフタル酸及び/また【よイソフタル酸を必
須成分として用いることが好ましい。Dibasic acid components include terephthalic acid, isophthalic acid,
Orthophthalic acid, 2. e-naphthalenedicarbone? iL
4. Aromatic dibasic acids such as 4-diphenyl dicarboxylic acid, alicyclic dibasic acids such as hydrogenated terephthalic acid,
Succinic acid, glutaric acid, adipic acid, pimelic acid,
Speric acid, azelaic acid, sebacic acid, dodecanedioic acid, brassic acid, dimer acid, and aliphatic dibasic acids can be mentioned. It is also possible to use lower alkyl esters. One or more of these are selected and used, and among these, it is preferable to use terephthalic acid and/or isophthalic acid as an essential component.
本発明の非晶性共重合ポリエステル樹脂(A)は上記し
たようなグリコールと二塩基酸を組み合わせて3元ある
いは4元以上の共重合体としたもめで、グリコール成分
と二塩基III成分を溶融重合することによって得られ
る.好適な方法を示すと、二塩基酸と、それに対し1.
05〜2.0@モルのグリコールを、通常のエステル化
触媒の存在下において約150〜240℃の温度で常圧
下加熱反応させるか、あるいは触媒を使用しないで約2
40〜260℃の温度で加圧子加熱反応させる。The amorphous copolymerized polyester resin (A) of the present invention is produced by combining the above-mentioned glycol and dibasic acid to form a ternary or quaternary or more copolymer by melting the glycol component and the dibasic III component. Obtained by polymerization. A preferred method is to use a dibasic acid and 1.
05 to 2.0@mol of glycol is reacted under normal pressure at a temperature of about 150 to 240° C. in the presence of a conventional esterification catalyst, or about 2.0@mol is reacted without using a catalyst.
The reaction is carried out by heating the presser at a temperature of 40 to 260°C.
出発原料として二塩基酸の低級アルキルエステル化合物
を用いる場合は、通常のエステル交換触媒の存在下にお
いて約150〜240℃の温度で常圧下加熱反応させる
。次いで110mmft以下、好ましくはlmmHg以
下の減圧下に220〜290℃で加熱重縮合する。この
際、重合触媒を用いることが好ましい。When a lower alkyl ester compound of a dibasic acid is used as a starting material, the reaction is carried out under normal pressure at a temperature of about 150 to 240° C. in the presence of a conventional transesterification catalyst. Next, heating polycondensation is carried out at 220 to 290° C. under reduced pressure of 110 mmft or less, preferably 1 mmHg or less. At this time, it is preferable to use a polymerization catalyst.
エステル化触媒としてはチタン化合物、スズ化合物、鉛
化合物などを、エステル交換触媒としては亜鉛化合物、
マンガン化合物、コバルト化合物などを、重合触媒とし
てはアンチモン化合物、チタン化合物、亜鉛化合物、ス
ズ化合物などが挙げられる。Titanium compounds, tin compounds, lead compounds, etc. are used as esterification catalysts, and zinc compounds, etc. are used as transesterification catalysts.
Examples of polymerization catalysts include manganese compounds and cobalt compounds, and examples of polymerization catalysts include antimony compounds, titanium compounds, zinc compounds, and tin compounds.
本発明で使用される化合物(B)とは、ポリイソシアネ
ート化合物、ポリエポキシ化合物および酸無水物から選
ばれる少なくとも1種の化合物である。これらの化合物
は非晶性共這合ポリエステル樹脂の末端の官能基と反応
し、架橋を形成することによって金属積層板の性能を向
上させる。The compound (B) used in the present invention is at least one compound selected from polyisocyanate compounds, polyepoxy compounds, and acid anhydrides. These compounds improve the performance of the metal laminate by reacting with the terminal functional groups of the amorphous co-adherent polyester resin and forming crosslinks.
ポリイソシアネート化合物とは、分子内に少なくとも2
個以上のイソシアネート基を有する化合物で、具体的に
は2.4−1リレンジイソシアネート+ 2. 6−
1リレンカシイソシアネート(通称TDI)、ジフェニ
ルメタンジイソシアネート(通称MDI)、 ポリメ
チレンポリフェニレンポリイソシアネート、ポリオール
変性イソシアネート、カルポジイシド変性イソシアネー
ト、ヘキサメチレンジイソシアネート(通称HMDI)
、イソホロンジイソシアネート(通称IPDI)、TD
Iをトリメチロールプロパンなどに付加したTDI系ア
ダクトポリイソシアネート、予め反応せしめた重合ポリ
イソシアネート、イソシアネートをカプロラクタム等で
マスキングしたブロックトイソシアネート等を挙げるこ
とができる。これらの中でもアダクトポリイソシアネー
ト及び重合ポリイソシアネートが好ましい。A polyisocyanate compound is defined as having at least 2 molecules in the molecule.
A compound having at least 2.4-1 lylene diisocyanate groups, specifically 2.4-1 lylene diisocyanate+2. 6-
1-lylene cassiocyanate (commonly known as TDI), diphenylmethane diisocyanate (commonly known as MDI), polymethylene polyphenylene polyisocyanate, polyol-modified isocyanate, carposiside-modified isocyanate, hexamethylene diisocyanate (commonly known as HMDI)
, isophorone diisocyanate (commonly known as IPDI), TD
Examples include TDI adduct polyisocyanate in which I is added to trimethylolpropane or the like, polymerized polyisocyanate reacted in advance, and blocked isocyanate in which isocyanate is masked with caprolactam or the like. Among these, adduct polyisocyanates and polymerized polyisocyanates are preferred.
ポリエポキシ化合物とは、分子内に少なくと62個以上
のエポキシ基を有する化合物で、具体的にはビスフェノ
ールA系のエポキシ樹脂、テトラブロモビスフェノール
A系のエポキシ樹脂、ビスフェノールF系のエポキシ樹
脂、フェノールノボラックエポキシ樹脂、テトラグリシ
ジルメタキシレンジアくン、テトラグリシジル−L 3
−ビスアミンメチルシクロヘキサン、テトラグリシジル
ジアミノジフェニルメタン、 トリグリシジル−mアミ
ノフェノール、 トリグリシジル−p−7ミノフエノー
ル、ジグリシジルアニリン、ジグリイジルオルソトルイ
ジン等の多官能性グリシジルアミン化合物、l、4−ブ
タンジオールジグリシジルエーテル、 l、6−ヘキサ
ンシオールジグリシジルエーテル、エチレングリコール
ジグリシジルエーテル、グリセロールポリグリシジルエ
ーテル、ソルビトールポリグリシジルエーテル等の多官
能グリシジルエーテル化合物、フタル酸ジグリシジルエ
ステル、ヘキサヒドロフタル酸ジグリシジルエステル、
トリメリット酸ポリグリシジルエステル等のグリシジ
ルエステル化合物等が挙げられる。A polyepoxy compound is a compound having at least 62 or more epoxy groups in the molecule, and specifically includes bisphenol A-based epoxy resin, tetrabromobisphenol A-based epoxy resin, bisphenol F-based epoxy resin, and phenol. Novolac epoxy resin, tetraglycidyl metaxylene diane, tetraglycidyl-L 3
- Polyfunctional glycidyl amine compounds such as bisamine methylcyclohexane, tetraglycidyldiaminodiphenylmethane, triglycidyl-m-aminophenol, triglycidyl-p-7 minophenol, diglycidylaniline, diglyidyl orthotoluidine, l,4-butanediol Polyfunctional glycidyl ether compounds such as diglycidyl ether, l,6-hexanesiol diglycidyl ether, ethylene glycol diglycidyl ether, glycerol polyglycidyl ether, sorbitol polyglycidyl ether, phthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester ,
Examples include glycidyl ester compounds such as trimellitic acid polyglycidyl ester.
これらの中でもビスフェノールA系のエポキシ樹脂、ジ
グリンジルエーテル化合物、ジグリシジルエステル化合
物の使用が好ましい。Among these, bisphenol A-based epoxy resins, diglycidyl ether compounds, and diglycidyl ester compounds are preferably used.
酸無水物としては、無水マレイン酸、無水ドデセネルコ
ハク酸、無水クロレンデツク酸、無水セバシン酸重合物
、無水フタル酸、無水ピロメリット酸、シクロペンクン
テトラカルボン酸三水物、ヘキサヒドロ無水フタル酸、
メチルへキサヒドロ無水フタル酸、テトラヒドロ無水フ
タル酸、ベンゾフェノンテトラカルボン酸無水物等を挙
げることができる。 これらの中でも無水ピロメリット
酸、ベンゾフェノンテトラカルボン酸無水物の使用が好
ましい。Examples of acid anhydrides include maleic anhydride, dodecenersuccinic anhydride, chlorendecic anhydride, sebacic anhydride polymer, phthalic anhydride, pyromellitic anhydride, cyclopenkune tetracarboxylic acid trihydrate, hexahydrophthalic anhydride,
Examples include methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, benzophenone tetracarboxylic anhydride, and the like. Among these, it is preferable to use pyromellitic anhydride and benzophenonetetracarboxylic anhydride.
これらの中から選ばれる化合物を少なくとも1種を用い
るが、 2種以上を組み合わせてもよい。At least one type of compound selected from these is used, but two or more types may be used in combination.
化合物(B)は非晶性共重合ポリエステル樹脂(A)1
00重量部に対し、0. 5〜20重量部を用いる。0
. 5重量部より少ない場合、あるいは20重量部より
多い場合は初期接着力が低くなる。Compound (B) is amorphous copolymerized polyester resin (A) 1
0.00 parts by weight. 5 to 20 parts by weight is used. 0
.. If the amount is less than 5 parts by weight or more than 20 parts by weight, the initial adhesive strength will be low.
また、これらの化合物とポリエステル樹脂の末端官能基
との反応を促進するための触媒を添加することもできる
。触媒としては、ポリイソシアネート化合物に対しては
3級アミン、錫化合物等を、ポリエポキシ化合物に対し
てはZn(BF+)z、5nCl+、KOI(,3mア
ミン、 4級アンモニウム塩、 イミダゾール化合物等
を、酸無水物に対してはイミダシル化合物、アセチルア
セトン第2鉄塩等を用いる。Further, a catalyst may be added to promote the reaction between these compounds and the terminal functional groups of the polyester resin. As catalysts, tertiary amines, tin compounds, etc. are used for polyisocyanate compounds, and Zn(BF+)z, 5nCl+, KOI(,3m amine, quaternary ammonium salts, imidazole compounds, etc.) are used for polyepoxy compounds. For acid anhydrides, imidacil compounds, ferric acetylacetone salts, etc. are used.
本発明で使用されるホスファイト化合物(C)は、前記
−数式(I)、 (l[)あるいは(III)で示され
る。The phosphite compound (C) used in the present invention is represented by the above formula (I), (l[) or (III).
一般式(I)で示される化合物の例としてはトリラウリ
ルホスファイト、 トリイソオクチルホスファイト、
トリオレイルホスファイト、 トリフェニルホスファイ
ト、 トリオクタデシルホスファイト、トリイソデシル
ホスファイト、 トリノルマルブチルホスファイト、
トリス−2−エチルヘキシル−ホスファイト、 トリス
テアリルホスファイト、トリス−2,4−ジ第3ブチル
フェニル−ホスファイト、 トリストリデシルホスファ
イト、 トリス−4フェニルフェノール−ホスファイト
、 トリスノニルフェニルホスファイト、 フエニルジ
イソデシルホスファイト、フエニルジオクチルホスファ
イト、ジフェニルイソデシルホスファイト、ジフェニル
デシルホスファイト、ジフェニルトリデシルホ各ファイ
ト等が挙げられるが、中でも特にトリス−2,4−ジ第
3ブチルフェニル−ホスファイトの使用が好適である。Examples of compounds represented by formula (I) include trilauryl phosphite, triisooctyl phosphite,
Trioleyl phosphite, triphenyl phosphite, triotadecyl phosphite, triisodecyl phosphite, trin-butyl phosphite,
Tris-2-ethylhexyl-phosphite, tristearyl phosphite, tris-2,4-di-tert-butylphenyl-phosphite, tris-tridecyl phosphite, tris-4-phenylphenol-phosphite, trisnonylphenyl phosphite, Examples include phenyl diisodecyl phosphite, phenyldioctyl phosphite, diphenyl isodecyl phosphite, diphenyldecyl phosphite, diphenyl tridecyl phosphite, among others, tris-2,4-di-tert-butylphenyl phosphite. The use of phyto is preferred.
一般式(I+)で示される化合物の例としては、テトラ
フエニルジプロピレングリコールジホスファイト、テト
ララウリルビスフェノールAジホスファイト、テトラト
リデシルビスフェノールAジホスファイト、テトラフェ
ニルテトラトリデシルペンタエリスリトールテトラホス
ファイト等が挙げられる。中でもテトララウリルビスフ
ェノールAジホスファイトが好ましい。Examples of the compound represented by the general formula (I+) include tetraphenyl dipropylene glycol diphosphite, tetralauryl bisphenol A diphosphite, tetratridecyl bisphenol A diphosphite, tetraphenyltetratridecyl pentaerythritol tetraphosphite, etc. It will be done. Among them, tetralauryl bisphenol A diphosphite is preferred.
一般式(III)で示される化合物の例としては、ジイ
ソデシルペンタエリスリトールジホスファイト、ジラウ
リルペンタエリスリトールジホスファイト、ジステアリ
ルペンタエリスリトールジホスファイト、ジノニルフェ
ニルペンタエリスリトールジホスファイト等が挙げられ
る。中でもジノニルフェニルペンタエリスリトールジホ
スファイトが好ましい。Examples of the compound represented by the general formula (III) include diisodecyl pentaerythritol diphosphite, dilauryl pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, dinonylphenyl pentaerythritol diphosphite, and the like. Among them, dinonylphenylpentaerythritol diphosphite is preferred.
これらのホスファイト系化合物(C)は、非晶性共重合
ポリエステル樹脂(A)100重量部に対して0.05
〜5重量部、好ましくは0.1〜2ffi量部の割合で
使用される。0.05重量部より少ない場合には焼付は
塗装時の接着力保持性や、高温下で使用した場合の耐久
性が十分でなく、5重量部より多い場合には初期接着力
が低くなる。These phosphite compounds (C) are added in an amount of 0.05 parts by weight per 100 parts by weight of the amorphous copolyester resin (A).
It is used in a proportion of ~5 parts by weight, preferably 0.1 to 2 ffi parts. If the amount is less than 0.05 parts by weight, the adhesion retention during painting and durability when used at high temperatures will be insufficient, and if the amount is more than 5 parts by weight, the initial adhesive strength will be low.
前記樹脂組成物に、さらに前記−数式(IV)で示され
るヒンダードフェノール系化合物CD)を、前記−数式
(I)、 (II)あるいは(III)で示されるホス
ファイト系化合物(C)と同様の割合をちって添加した
樹脂組成物を用いた金属積層板は、なお−層卓抜した焼
付は塗装時の接着力保持性と、高温下で使用した場合の
耐久性を有する。The resin composition is further combined with the hindered phenol compound CD) represented by the formula (IV) and the phosphite compound (C) represented by the formula (I), (II) or (III). Metal laminates using resin compositions added in similar proportions also have outstanding baking properties, adhesive strength retention during painting, and durability when used at high temperatures.
−数式(IV)で示される化合物の例としては2゜6−
ジ第3ブチル−p−クレゾール、 2.5−ジ第3ブチ
ル−4−エチルフェノール、 2.27−メチレン−ビ
ス−4−メチル−6−第3ブチルフェノール、4,4′
−メチレン−ビス(2,6−ジ第3ブチルフェノール)
、4,4−ブチリデン−ビス(3−メチル−6−第3ブ
チルフエノール)、4.4′−チオビス(6−第3ブチ
ル−3−メチルフェノール)、ビス(3−メチル−4−
ヒドロキシ−5−第3ブチルベンジル)スルフィド、4
4′−チオビス(6−第3ブチル−0−クレゾール)2
.2′−チオビス(4−メチル−6−第3ブチルフエノ
ール)、3.5−ジー第3ブチル−4−ヒドロキシベジ
ルホスホン酸のジエチルエステル、n−オクタデシル−
3(3′、5′−ジ第3ブチル−ヒドロキシフェニル)
プロピオネート、ヘキサメチレングリコール−ビス[β
−(3,5−ジ第3ブチル−4−ヒドロキシフェノール
)プロピオネート]、N、 N’−へキサメチレン−
ビス(3,5−ジ第3ブチル−4−ヒト□キシヒドロ桂
皮酸アくド)、2,2′−チオ−[ジエチル−ビス−3
(3、5−ジ第3ブチル−4−ヒドロキシフェニル)プ
ロピオネ−トコ、 3,5−ジ第3ブチル−4−ヒドロ
キシベンジルホスホン酸のジオクタデシルエステル、テ
トラキス[メチレン−a+:3’、5′−ジ第3ブチル
−4′−ヒドロキシフェニル)プロピオネー トコ メ
タ ン、 1. 3. 3−1 リ メチル−2
゜4.6−トリス(3′、5′−ジ第3ブチル−4′−
ヒドロキシベンジル)ベンゼン、 トリス(3,5−ジ
第3ブチル−4−ヒドロキシフェニル)イソシアヌレー
ト、 トリス[β−(3,5−ジ第3ブチル−4−ヒド
ロキシフェニル)プロピオニル−オキシエチル]イソシ
アヌレート等が挙げられるが、これらの中でもテトラキ
ス[メチレン−3(3;5′−ジ第3ブチル−4′−ヒ
ドロキシフェニル)プロピオネートコメタン、 1.
3. 5−トリメチル2、 4. 6−トリス(3′、
51−ジ第3ブチル−4′−ヒドロキシベンジル)ベン
ゼンが好ましい。- Examples of compounds represented by formula (IV) include 2゜6-
Di-tert-butyl-p-cresol, 2.5-di-tert-butyl-4-ethylphenol, 2.27-methylene-bis-4-methyl-6-tert-butylphenol, 4,4'
-methylene-bis(2,6-di-tert-butylphenol)
, 4,4-butylidene-bis(3-methyl-6-tert-butylphenol), 4,4'-thiobis(6-tert-butyl-3-methylphenol), bis(3-methyl-4-
Hydroxy-5-tert-butylbenzyl) sulfide, 4
4'-thiobis(6-tert-butyl-0-cresol)2
.. 2'-thiobis(4-methyl-6-tert-butylphenol), diethyl ester of 3,5-di-tert-butyl-4-hydroxybenzylphosphonic acid, n-octadecyl-
3 (3',5'-di-tert-butyl-hydroxyphenyl)
Propionate, hexamethylene glycol-bis[β
-(3,5-ditert-butyl-4-hydroxyphenol)propionate], N, N'-hexamethylene-
Bis(3,5-di-tert-butyl-4-human oxyhydrocinnamic acid ado), 2,2'-thio-[diethyl-bis-3
(3,5-di-tert-butyl-4-hydroxyphenyl)propione, dioctadecyl ester of 3,5-di-tert-butyl-4-hydroxybenzylphosphonic acid, tetrakis[methylene-a+: 3', 5'-ditert-butyl-4'-hydroxyphenyl)propionate tocomethane, 1. 3. 3-1 Li-methyl-2
゜4.6-Tris(3',5'-di-tert-butyl-4'-
hydroxybenzyl)benzene, tris(3,5-di-tert-butyl-4-hydroxyphenyl)isocyanurate, tris[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl-oxyethyl]isocyanurate, etc. Among these, tetrakis[methylene-3(3;5'-di-tert-butyl-4'-hydroxyphenyl)propionate comethane, 1.
3. 5-trimethyl 2, 4. 6-tris (3',
51-Ditert-butyl-4'-hydroxybenzyl)benzene is preferred.
これらのヒンダードフェノール系化合物(D)は、非晶
性共重合ポリエステル樹脂(A)100重量部に対して
0.05〜5f[置部、好ましく【よ0、 1〜2重量
部の割合で使用される。0.05重量部より少ない場合
には焼付は塗装時の接着力保持性や高温下で使用した場
合の耐久性が十分でなく、5重量部より多い場合には初
期接着力が低く な る。These hindered phenol compounds (D) are used in a proportion of 0.05 to 5 parts by weight, preferably 0.1 to 2 parts by weight, per 100 parts by weight of the amorphous copolyester resin (A). used. If the amount is less than 0.05 parts by weight, the adhesive strength during painting and durability when used at high temperatures will not be sufficient, and if the amount is more than 5 parts by weight, the initial adhesive strength will be low.
本発明の金属積層板に用いる樹脂組成物は本来の目的を
損なわない範囲で、炭酸カルシウム、硫酸バリウム、ク
レー、酸化チタン、酸化珪素、マイカ粉末、ガラスピー
ズのような充填剤、炭素繊維、ガラス繊維、セラミック
繊維、アラミド繊維、チタン酸カリ繊維のような補強剤
、ステンレス粉、アルミニウム粉などの各種金属粉、各
種カップリング剤、その他の熱可塑性樹脂などを含有せ
しめることができる。The resin composition used in the metal laminate of the present invention may include calcium carbonate, barium sulfate, clay, titanium oxide, silicon oxide, mica powder, fillers such as glass peas, carbon fiber, glass, etc., within a range that does not impair the original purpose. It can contain reinforcing agents such as fibers, ceramic fibers, aramid fibers, and potassium titanate fibers, various metal powders such as stainless steel powder and aluminum powder, various coupling agents, and other thermoplastic resins.
本発明の金属積層板の製造方法は特に限定されるもので
はないが、例えば非晶性共重合ポリエステル樹脂溶液に
、化合物(B)及びホスファイト系化合物(C)、場合
によってはヒンダードフェノール系化合物(D)を添加
して十分混合したのち、金属板の少なくとも一方好まし
くは両者の墳層面に塗布し、室温好ましくは100〜2
20℃の温度て加熱して溶剤を留去したのち、加熱ロー
ルや熱プレスを用いて接着される。玄た非晶性共重合ポ
リエステル樹脂と、化合物(B)及びホスファイト化合
物(C)、場合によってはヒンダードフェノール系化合
物CD)とをトライブレンドした後、加熱溶融混合する
ことによって得られる組成物を、押出機から直接金属板
表面に溶融押出しによりラシネートし、さらに他の金属
板と熱接着する方法などが挙げられる0本発明の樹脂組
成物層の厚みは5〜800μm1 好ましくは30〜
300μmである。The method for producing the metal laminate of the present invention is not particularly limited, but for example, a compound (B) and a phosphite compound (C), and in some cases a hindered phenol compound, are added to an amorphous copolymerized polyester resin solution. After adding the compound (D) and mixing thoroughly, apply it to the mound layer surface of at least one, preferably both, of the metal plate, and apply at room temperature, preferably 100 to 2
After heating at a temperature of 20°C to distill off the solvent, they are bonded using a heated roll or hot press. A composition obtained by tri-blending a dark amorphous copolymerized polyester resin with a compound (B) and a phosphite compound (C) (in some cases a hindered phenol compound CD), and then heating and melt-mixing the mixture. The thickness of the resin composition layer of the present invention is 5 to 800 μm1, preferably 30 to 800 μm1.
It is 300 μm.
また、2枚の金属板の種類は特に限定されるものではな
く、同一あるいは異なっていてもよい。Further, the types of the two metal plates are not particularly limited, and may be the same or different.
金属板の具体例としては鋼板、アルミニウム板、銅板な
どが挙げられ、特に鋼板が好ましく使用され る。Specific examples of metal plates include steel plates, aluminum plates, copper plates, etc., with steel plates being particularly preferably used.
以下実施例を挙げて説明するが、本発明は、これらに限
定されるものではない。The present invention will be described below with reference to Examples, but the present invention is not limited thereto.
[実施例]
以下実施例によって本発明を説明する。なお、実施例中
の部はすべて重量基準である。[Example] The present invention will be explained below with reference to Examples. Note that all parts in the examples are based on weight.
また、実施例及び比較例中に示される各測定項目は以下
の方法に従った。Furthermore, each measurement item shown in the Examples and Comparative Examples was conducted according to the following method.
・ガラス転移温度: DSCで測定した。-Glass transition temperature: Measured by DSC.
・相対粘度: 樹脂0.125gを0−クロロフェノー
ル25m1に溶解し、 25℃で測定した。- Relative viscosity: 0.125 g of resin was dissolved in 25 ml of 0-chlorophenol and measured at 25°C.
・接着強度: 25mX15鴫の重ね合わせ部の6張
せん断強度をテンシロン引張試験機により引張速度20
u / sinで測定した。・Adhesive strength: The shear strength at 6 tensions of the overlapping part of 25 m x 15 sheets was measured using a Tensilon tensile tester at a tensile speed of 20
Measured in u/sin.
・耐焼付は塗装性: 接着試験片を220℃あるいは2
30℃の熱風オーブン中で1時間熱処理した後の接着強
度を測定した。・Painting resistance: Adhesive test piece heated to 220℃ or 2
The adhesive strength was measured after heat treatment for 1 hour in a hot air oven at 30°C.
・耐久性: 接着試験片を200℃の熱風オーブン中で
1000時間、2000時間あるいは3000時間熱処
理した後の接着強度を測定した。- Durability: The adhesive strength was measured after heat treating the adhesive test piece in a hot air oven at 200°C for 1000 hours, 2000 hours, or 3000 hours.
実施例において使用した化合物の内容または化学構造と
略号は次の通りである
参考例
ジメチルテレフタレート404部、ジメチルイソフタレ
ート373部、エチレングリコール2G8部、ネオペン
チルグリコール300部を酢酸亜鉛0.34部とともに
攪拌機と精留管を備えた反応容器に仕込み、 100℃
から240℃まで3時間かけてエステル交換反応を行っ
た6次にヘリカルリボン攪拌翼を備えた反応容器に移し
、三酸化アンチモン0.16部を添加した後、昇温およ
び減圧プログラムに従って約1時間かけて275℃、l
uHg以下の反応条件にもたらし、その状態で2時間1
0分重縮合反応を行った。得られた共重合ポリエステル
樹脂(A−1)は淡黄色透明で、NMRによる組成分析
の結果、U成分がテレフタル酸/イソフタル酸=52/
48 (モル比)、グリコール成分がエチレングリコー
ル/ネオペンチルグリコール=55/45 (モル比)
であり、DSCによる熱分析の結果、ガラス転移温度が
69℃の非晶性ポリマで、相対粘度が1.31であった
。The contents or chemical structures and abbreviations of the compounds used in the examples are as follows.Reference Example 404 parts of dimethyl terephthalate, 373 parts of dimethyl isophthalate, 8 parts of ethylene glycol 2G, and 300 parts of neopentyl glycol were combined with 0.34 parts of zinc acetate. Pour into a reaction vessel equipped with a stirrer and a rectification tube, and heat to 100°C.
The transesterification reaction was carried out for 3 hours from 6 to 240°C. Next, the transesterification reaction was carried out in a reaction vessel equipped with a helical ribbon stirring blade, and after adding 0.16 parts of antimony trioxide, the temperature was raised and the pressure reduced for about 1 hour according to the program. 275℃, l
The reaction conditions were brought to below uHg and kept in that state for 2 hours.
Polycondensation reaction was carried out for 0 minutes. The obtained copolymerized polyester resin (A-1) was pale yellow and transparent, and as a result of compositional analysis by NMR, the U component was terephthalic acid/isophthalic acid = 52/
48 (molar ratio), glycol component is ethylene glycol/neopentyl glycol = 55/45 (molar ratio)
As a result of thermal analysis by DSC, it was found to be an amorphous polymer with a glass transition temperature of 69° C. and a relative viscosity of 1.31.
以下同様にして組成が表1に示される共重合ポリエステ
ル樹脂(A−2)〜(A−4)を製造した。Copolymerized polyester resins (A-2) to (A-4) whose compositions are shown in Table 1 were produced in the same manner.
(以下余白)
実施例1〜12
参考例で得た共重合ポリエステル樹脂(A−1)〜(A
−4)のメチルエチルケトン/トルエン(20/80)
溶液(固形分濃度30%)に、表2に示す各化合物を共
重合ポリエステル樹脂100部に対して表2に示す添加
量となるように配合した。この溶液を厚さ0.4mmの
クロメート処理鋼板に乾燥後の厚みで25μmになるよ
うに塗布し、200℃で2分間熱風乾燥した後、塗布面
同士を重ね合わせ190℃で2分間、20 kg /c
m” で圧着した。5日経過後、初期接着力の測定を
行うとともに耐焼付は塗装性および耐久性試験を行った
。(Left below) Examples 1 to 12 Copolymerized polyester resins (A-1) to (A
-4) Methyl ethyl ketone/toluene (20/80)
Each compound shown in Table 2 was added to the solution (solid content concentration 30%) in an amount shown in Table 2 based on 100 parts of the copolyester resin. This solution was applied to a chromate-treated steel plate with a thickness of 0.4 mm to a dry thickness of 25 μm, and after drying with hot air at 200°C for 2 minutes, the coated surfaces were overlapped and heated at 190°C for 2 minutes, and a 20 kg /c
After 5 days, the initial adhesion strength was measured and the anti-seizure paintability and durability tests were conducted.
評価結果を表2に示す。The evaluation results are shown in Table 2.
C以下余白)
比較例1〜12
実施例で使用した共重合ポリエステル樹脂溶液を用いて
、表3に示すような比較樹脂組成物を製造し、実施例と
同様の方法で接着し、実施例と同様の方法で初期接着力
の測定および耐焼付は塗装性と耐久性の評価を行った。Comparative Examples 1 to 12 Comparative resin compositions as shown in Table 3 were produced using the copolymerized polyester resin solutions used in the examples, and adhered in the same manner as in the examples. Initial adhesive strength was measured and anti-seizure paintability and durability were evaluated using the same method.
共重合ポリエステル樹脂溶液そのものを用いた際の結果
も併せて表3に示す。Table 3 also shows the results when the copolymerized polyester resin solution itself was used.
実施例と比較例を比べることにより、本発明の金属積層
板は初期接着力が高く、耐焼付は塗装性及び耐久性にも
優れていることが明らかである。By comparing Examples and Comparative Examples, it is clear that the metal laminates of the present invention have high initial adhesion strength, and are also excellent in seizure resistance, paintability, and durability.
(以下余白)
[発明の効果]
本発明の金属積層板は、初期接着力が高く、耐焼付は塗
装性及び耐久性にも優れ、厳しい環境における使用に耐
えるものである。(The following is a blank space) [Effects of the Invention] The metal laminate of the present invention has high initial adhesive strength, excellent anti-seizing properties, excellent paintability, and durability, and can withstand use in harsh environments.
Claims (2)
層板において、前記樹脂層が非晶性共重合ポリエステル
樹脂(A)100重量部と、ポリイソシアネート化合物
、ポリエポキシ化合物および酸無水物から選ばれる少な
くとも1種の化合物(B)0.5〜20重量部と、下記
一般式( I )、(II)あるいは(III)で示されるホス
ファイト系化合物(C)0.05〜5重量部とを混合し
て得られる樹脂組成物から構成されることを特徴とする
金属積層板。 ▲数式、化学式、表等があります▼( I ) ▲数式、化学式、表等があります▼(II) ▲数式、化学式、表等があります▼(III) (ただしR_1、R_1′、R_1″は炭素数1〜18
の炭化水素基、あるいは分子鎖中に−COO−、−CO
NH−結合を有する炭素数1〜23の炭化水素基を表わ
し、それぞれ同一であっても異なっていてもよい。mは
1〜4の整数である。)(1) A metal laminate comprising a resin layer sandwiched between two metal plates, in which the resin layer contains 100 parts by weight of an amorphous copolymerized polyester resin (A), a polyisocyanate compound, a polyepoxy compound, and an acid anhydride. 0.5 to 20 parts by weight of at least one compound (B) selected from the following, and 0.05 to 5 parts of a phosphite compound (C) represented by the following general formula (I), (II) or (III). A metal laminate comprising a resin composition obtained by mixing parts by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(III) (However, R_1, R_1′, R_1″ are carbon Numbers 1-18
-COO-, -CO in the hydrocarbon group or molecular chain
Represents a hydrocarbon group having 1 to 23 carbon atoms and having an NH-bond, and may be the same or different. m is an integer from 1 to 4. )
層板において、前記樹脂層が非晶性共重合ポリエステル
樹脂(A)100重量部と、ポリイソシアネート化合物
、ポリエポキシ化合物および酸無水物から選ばれる少な
くとも1種の化合物(B)0.5〜20重量部と、下記
一般式( I )、(II)あるいは(III)で示されるホス
ファイト系化合物(C)0.05〜5重量部と、下記一
般式(IV)で示されるヒンダードフェノール系化合物(
D)0.05〜5重量部とを混合して得られる樹脂組成
物から構成されることを特徴とする金属積層板。 ▲数式、化学式、表等があります▼( I ) ▲数式、化学式、表等があります▼(II) ▲数式、化学式、表等があります▼(III) (ただしR_1、R_1′、R_1”は炭素数1〜18
の炭化水素基、あるいは分子鎖中に−COO−、−CO
NH−結合を有する炭素数1〜23の炭化水素基を表わ
し、それぞれ同一であっても異なっていてもよい。mは
1〜4の整数である。) ▲数式、化学式、表等があります▼(IV) (ただしR_2は炭素数1〜18のアルキル基であり、
R_2′はR_2と同様のアルキル基であってR_2と
同一であってもよい。R_3は単結合、炭素数1〜18
の炭化水素基あるいは分子鎖中に−COO−、−CON
H−、▲数式、化学式、表等があります▼結合のいずれ
かを 有する炭素数1〜18の炭化水素基であり、XはC、S
、炭素数1〜18の炭化水素基あるいは▲数式、化学式
、表等があります▼を表わす。nは1〜4の整数である
。)(2) A metal laminate comprising a resin layer sandwiched between two metal plates, in which the resin layer contains 100 parts by weight of an amorphous copolymerized polyester resin (A), a polyisocyanate compound, a polyepoxy compound, and an acid anhydride. 0.5 to 20 parts by weight of at least one compound (B) selected from the following, and 0.05 to 5 parts of a phosphite compound (C) represented by the following general formula (I), (II) or (III). parts by weight and a hindered phenol compound represented by the following general formula (IV) (
D) A metal laminate comprising a resin composition obtained by mixing 0.05 to 5 parts by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(III) (However, R_1, R_1', R_1" are carbon Numbers 1-18
-COO-, -CO in the hydrocarbon group or molecular chain
Represents a hydrocarbon group having 1 to 23 carbon atoms and having an NH-bond, and may be the same or different. m is an integer from 1 to 4. ) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(IV) (However, R_2 is an alkyl group with 1 to 18 carbon atoms,
R_2' is the same alkyl group as R_2, and may be the same as R_2. R_3 is a single bond, carbon number 1-18
-COO-, -CON in the hydrocarbon group or molecular chain of
H-, ▲ Numerical formulas, chemical formulas, tables, etc. ▼ A hydrocarbon group with 1 to 18 carbon atoms that has any of the bonds, and X is C, S
, represents a hydrocarbon group having 1 to 18 carbon atoms, or ▲a numerical formula, chemical formula, table, etc.▼. n is an integer from 1 to 4. )
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31724989A JPH03176135A (en) | 1989-12-06 | 1989-12-06 | Metal laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31724989A JPH03176135A (en) | 1989-12-06 | 1989-12-06 | Metal laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03176135A true JPH03176135A (en) | 1991-07-31 |
Family
ID=18086145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31724989A Pending JPH03176135A (en) | 1989-12-06 | 1989-12-06 | Metal laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03176135A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0472185A2 (en) * | 1990-08-22 | 1992-02-26 | Toyo Boseki Kabushiki Kaisha | Viscoelastic resin composition for vibration damping material |
-
1989
- 1989-12-06 JP JP31724989A patent/JPH03176135A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0472185A2 (en) * | 1990-08-22 | 1992-02-26 | Toyo Boseki Kabushiki Kaisha | Viscoelastic resin composition for vibration damping material |
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