JPH0317574A - Burn-in board tester - Google Patents

Abstract

PURPOSE:To judge the quality of a burn-in board by successively mounting a test IC to the IC socket mounted to the burn-in board. CONSTITUTION:A connector 11 is set to a burn-in board 1 and an order is emitted to a controller 55 from a CPU 54 to move X-axis constitution 41, Y-axis constitution 42 and Z-axis constitution 43. A test IC setting mechanism 44 is moved downwardly along a Z-axis to mount a test IC to an objective IC socket 2 and a measuring mechanism 45 is moved downwardly along the Z-axis to bring the test IC into contact with the measuring pin of the mechanism 45. As mentioned above, a closed circuit is constituted between the objective IC socket 2, the burn-in board 1 and the electric constitution part through the mechanism 45 and an LCR measuring part 53 measures the electrical operation value between the burn-in board 1 and the objecting IC socket 2 through respective contact parts 51, 52 and said operation value is compared with the tolerance range value stored in the memory within the CPU 54 to judge whether the burn-in board is normal. By performing the same measurement with respect to the IC socket 2 successively, the quality of the burn-in board can be judged.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a burn-in board tester for determining the quality of a burn-in board for testing ICs.

[Conventional technology]

As a device for testing ICs, a burn-in board with a large number of ICs to be tested is used, and this burn-in board is
There was a device that could collectively judge the quality of ICs installed on these burn-in boards based on the output results when they were installed on test equipment and performed predetermined operations. In such devices, it is essential that the burn-in board that holds a large number of ICs be of good quality. Therefore, an inspection device is required to inspect whether the burn-in board is a good product or a defective product.

As one of the conventional burn-in board testers, a plurality of measurement pins are directly inserted into a large number of IC sockets arranged on the burn-in board, and the operation between the IC socket and the burn-in board (for example, the connector of the burn-in board) is There was a device that had a measuring mechanism for measuring the resistance value, capacitance value, etc. between the IC socket and the IC socket, and a control means for moving this measuring mechanism in the X-axis, Y-axis, and Z-axis directions. [Problems to be solved by the invention] In such a conventional bar-in-board tester,
Since the measuring mechanism's measuring bottle was configured to be inserted directly into the IC socket, there was a possibility of damaging the IC socket or measuring pin. [Means for solving the problem] For this reason, in this device, there are two test
A measurement mechanism is provided that brings multiple measurement bottles into contact with the contacts of the test IC set by the C-set mechanism. [Operation] Although the test IC itself is wired in a manner suitable for measurement, its shape is the same as that of the IC to be tested.

When this test IC is installed in an IC socket on a burn-in board, the contacts of this test IC are exposed. A measuring bottle of a measuring mechanism is brought into contact with this exposed portion under a predetermined pressure.

〔Example〕

1, 2, and 3 are explanatory diagrams for explaining the bar-in-board tester according to the present invention, respectively. IC that can be used in the bar-inboard tester shown in the figure
FIG. 3 is a structural perspective view showing an example of the socket/insert board tester [C]. FIG. 3 is a structural diagram schematically showing the overall structure of the burn-in board tester of FIG. 1.

First, the overall configuration of a bar-in-board tester according to an embodiment of the present invention will be explained with reference to FIG. In FIG. 3, l represents a burn-in board, on which a large number of IC sockets 2 are arranged and attached. This burn-in board 1 is connected to an electrical component, which will be described later, by a connector 11.

41! ．． 42 is a Y-axis configuration, and 43 is a Z-axis configuration, which work together to move the test IC setting mechanism 44 and the measuring machine side 45 in the X, Y, and Z axis directions.

5l is the contact group of connector 1l of burn-in board l, 52
is a group of measuring pins (contacts) of the measuring mechanism 45 of the device, 53 is L
CR measuring section, 54 is CPU, 55 is controller, 56
is a printer. Prior to measurement, the burn-in board 1 is attached to a predetermined position on the device, and its connector 11 is set. In this state, a command is issued from the CPU 54 to the controller 55 to move the X-axis structure 41, the Y-axis structure 42, and the Z-axis structure 43. The test IC setting mechanism 44 holds a test IC, and the target IC socket 2
It is positioned at the top. Then, this test IIC setting mechanism 44 moves downward on the Z axis to mount the test IC into the target IC socket.

Next, the measurement IIJ 45 is positioned on the IC socket 2 for this purpose and moved down the Z axis. At this point, contact between the test IC mounted in the target IC socket 2 and the measurement pin of the measurement mechanism 45 is achieved. In this state, the target IC socket 2, burn-in board l, and measurement Ja structure 4
In this state, a closed circuit is formed between the electric component and the electrical component via 5.

At this point, the LCR measurement unit 53 has each contact group 5l,
52 to the bar-in board l and the target IC socket 2
Measure the electrical behavior such as inductance, resistance, and capacitance between the This electrical operating value is
It is compared with the allowable range value stored in advance in the internal memory to determine whether it is normal or not.

Similar measurements are performed on the IC sockets 2 on the burn-in board 1 one after another, and the results of the measurements are printed on the printer 56. Based on these, the quality of the burn-in board 1 is determined.

FIG. 2 shows various structural parts that can be applied to this bar-in-board tester I.

As shown in FIG. 2(a), the IC socket 2 includes, for example, an upper structure and a lower structure, and has a structure shown in FIG. 2(a).

Now, assuming that the IC socket 2 is in the state shown in FIG. 2(b), the contact group 21 is located at an upper position relative to its upper structure. In this state, the IC (or test IC) 3 shown in FIG. 2(C) is inserted into the opening.

The upper structure of the IC socket 2 rises due to the action of a spring (not shown), and the contact group 31 of the IC 3 and the IC socket 2
are held in contact with the contact group 2l.

A burn-in board 1 is constructed by arranging a large number of such IC sockets 2 as shown in FIG. 2(d).

FIG. 1 is a diagram showing the main part of a burn-in board tester using a burn-in board l as shown in FIG. 2(d).

The Z-axis structure 43 is supported so as to be movable in the Y-axis direction along the rails 421 of the Y-axis structure 42.

Note that the Y-axis structure 42 is movable in the X-axis direction by the X-axis structure 41 shown in FIG.

This Z-axis structure 43 is provided with a test IC center mechanism 44 and a measurement mechanism 45. test! The C set mechanism 44 includes an IC adsorption block 441 and this block 441.
It has a base 442 that removably holds the. IC
The suction block 441 is formed with four spherically constricted projections T and a pipe holder U for coupling with a suction pipe 444, which will be described later. A recessed portion with a lock is formed to be connected to the recess, forming an attachment/detachment structure 443.
The base 442 connects to the Z-axis configuration 43 via the rail 431.
It is supported so that it can move in the axial direction. On the other hand, a suction section 441a is formed in the IC suction block 441, and when this IC suction block 441 is attached to the base 442 via the above-mentioned detachable structure 443, the suction pipe 444 is connected to the above-mentioned suction section 441a. It is structured. Therefore, the suction pipe 444 is coupled with an air suction pump (not shown), and the test IC 3 can be held by its suction portion 441a.

The side of the measuring machine 45 has a measuring block 451 and a base 452 for detachably holding the measuring block 451. The base 452 of this measurement mechanism 45 is mounted vertically (in the Z-axis direction) along the rail 432 formed on the Z-axis horizontal structure 43.
It has a movable structure. A large number of measurement bins 451a are provided at the bottom of the measurement bronck 451.

Note that this measurement block 451 is detachably attached to a base 452 via an attachment/detachment structure 453. Note that this attachment/detachment structure 453 was tested in Test I mentioned earlier.
It is constructed in the same manner as the attachment/detachment structure 443 of the C set mechanism 44. Now, as shown in Figure 1, the x, y, and z axis configurations are
1, 42, 43, the objective I on the bar-inboard l
Assume that the test IC setting mechanism 44 is positioned on the C socket 2. The test IC setting mechanism 44 is lowered down the Z-axis by the Z-axis configuration 43. The lower side end of the IC suction block 441 pushes down the upper structure of the IC socket 2, and the test IC 3 held therein is inserted into the opening thereof. At this point, air suction by the suction pipe 444 is stopped, and the test IC 3 is stored in the IC socket 2.

By raising the test IC setting mechanism 44, the I
Contact group 21 of C socket 2 (Fig. 2) and test l-[C3
The contact group 31 can be reliably connected to the contact group 31. At this point, move the Z-axis structure 34 in the direction of arrow A to
Position the measuring prong 45'l directly above the C socket 2. The measurement block 451 is moved down the Z-axis by a predetermined amount, and a large number of measurement bottles 45la are individually moved with a predetermined pressure.
It is brought into contact with the contact group 31 of the test IC held in the C socket 2. At this stage, the electrical components shown in FIG. 3 are operated to determine whether the connection between the IC socket 2 and the burn-in board 1 is correct or not. When this measurement is completed, it is time to measure the next IC socket 2! 1! Start preparations. The fixed block 451 is raised and the test IC centering mechanism 44 is again positioned directly above the IC socket 2 where the measurement has been completed. Then, the test IC setting mechanism 44 is lowered and the upper structure of the target IC socket 2 is pushed down to perform the test.
Make c3 free. At this point, the suction operation of the suction pipe 444 is started to adsorb the test IC 3, and the test IC setting mechanism 44 is raised to complete this preparatory operation. All measurement operations are completed by performing this series of measurement operations one after another for all the IC sockets 2 mounted on the burn-in board l. In addition, in this invention, the Tes IIC cent mechanism 44
and the measurement mechanism 45 on the respective bases 442 and 452.
It is configured to be detachably held via detachable structures 443 and 453.

Therefore, the test IC setting mechanism 44 and the measuring mechanism 45 can be used interchangeably depending on the IC that can be mounted on the bar-in board 1 and measured. In this case,
This has the advantage that there is no need to change the processing program of the controller that moves these in the x, y, and z axes. [Effects of the Invention] As described above, according to the present invention, the test ICs are successively mounted on the IC sockets attached to the burn-in board to determine the quality of the connection between each IC socket and the burn-in board. This allows reliable measurements to be made.

[Brief explanation of drawings]

1, 2, and 3 are explanatory diagrams for explaining a bar-in-board tester according to the present invention. FIG. 1 is a perspective view of main parts of the bar-in-board tester of the present invention, and IC that can be used in the bar-inboard tester shown in the figure
FIG. 3 is a perspective view showing an example of a sockent or IC, and FIG. 3 is a view schematically showing the overall structure of the bar-in-board tester shown in FIG. 1. 1-----------Bar-in-board 2----1・C socket 44-・--・--Test IC setting mechanism 45-・11-1--Measuring mechanism

Claims (1)

[Claims] A burn-in board tester that has a large number of IC sockets holding a large number of ICs and is used to measure the ICs mounted on these IC sockets. A test IC set mechanism capable of holding test ICs that can be positioned with respect to each of the IC sockets installed on the board;
A measuring mechanism having a measuring pin that can be contacted with the test IC when held in the C socket is provided, and the test IC is
A test IC is set in a predetermined IC socket by the C setting mechanism, and the measurement pin of the measurement mechanism is connected to the contact group of the IC socket or the test IC held in the IC socket.
A burn-in board tester is configured to be connected to a contact group of C to determine whether the connection between the IC socket and the burn-in board is good or bad.